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Jianmin Li

Jianmin joined Amkor in 2013, and is currently packaging R&D director in Amkor Assembly & Test (Shanghai) Co. Ltd, responsible for developing various package type including memory SCSP, flip chip package, SiP and optical sensor packages. He has more than 20 years of experience in assembly process engineering area. Prior to joining Amkor, Jianmin was an assembly process engineer in Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Frank Ruschmeier

Frank Ruschmeier has been appointed as the Director of Application Engineering at Bosch Sensortec in Shanghai since 2023, marking over a decade of impactful contributions to the technology sector. As Lead Product Manager at ETAS GmbH, Stuttgart, and Application Field Manager at ETAS China, he led significant projects in embedded systems, contributing to the evolution of Software Defined Vehicle Verification and Validation.

Before ETAS, Frank showcased expertise as the Project Leader for Hardware/Electronics at Ushio – Xtreme Technologies GmbH in Aachen, Germany, from August 2010 to January 2013. His career commenced at Philips Extreme UV GmbH, progressing from Development Engineer to Project Leader and System Architect in the semiconductor area for extreme ultraviolet lithography development.

Frank holds a Diploma in Communications and Electronics Engineering from Aachen, Germany, and a Master of Science in International Business from Maastricht University, The Netherlands.

In his current role at Bosch Sensortec, Frank continues to drive innovation and lead teams, solidifying his reputation as a forward-thinking professional shaping the future of sensor technologies in the semiconductor industry.

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Bosch Sensortec

Bosch Sensortec GmbH, a fully owned subsidiary of Robert Bosch GmbH, develops and markets a wide portfolio of microelectromechanical systems (MEMS) sensors and solutions tailored for smartphones, tablets, wearables and hearables, AR/VR devices, drones, robots, smart home and IoT (Internet of Things) applications. The product portfolio includes 3-axis accelerometers, gyroscopes and magnetometers, integrated 6- and 9-axis sensors, smart sensors, barometric pressure sensors, humidity sensors, gas sensors, optical microsystems, acoustic microsystems and comprehensive software. Since its foundation in 2005, Bosch Sensortec has emerged as the MEMS technology leader in the markets it addresses. Bosch has been both a pioneer and a global market leader in the MEMS sensor segment since 1995 and has, to date, sold more than 15 billion MEMS sensors.

The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). According to preliminary figures, the company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology.

As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. Bosch employs some 76,100 associates in research and development, as well as roughly 38,000 software engineers.

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Dr. Yuan Lu

  • Manager Technical Marketing Management
  • Evatec

Dr. Yuan Lu, manager technical marketing management at Evatec China. He participated in the project of BAW device research and development between Evatec and global RF-filter top companies. Besides, he was doing of the strategic marketing of MEMS state-owned company, including filter, IMU, temperature and gas MEMS project cooperation and investment. Currently his team is focusing on the solution and strategic marketing of business unit semiconductor, optoelectronics, photonics in Evatec China.

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Evatec

Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.

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Jörg Amelung

Jörg Amelung received his diploma in physics from the University of Duisburg, Germany, in 1993. In the same year, he joined the Fraunhofer Society in the field microsystem sensor technology. In the following years he was responsible and involved in technology developments in the MEMS and OLED field and founded two OLED dedicated companies. Since 2021 he is deputy institute director of the Fraunhofer Institute for Photonic Microsystems IPMS. Since 2023 he additionally took over the responsibility of the division MEMS Engineering, Manufacturing & Test.

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Fraunhofer IPMS

The Fraunhofer Institute for Photonic Microsystems IPMS in Dresden Germany is your access to know-how, expertise, and modern R&D infrastructure in the field of optical sensors and actuators, integrated circuits, microsystems (MEMS/MOEMS) and nanoelectronics. The Fraunhofer IPMS is one of 76 institutes of the Fraunhofer-Gesellschaft, the leading organization for applied research in Europe. Relying on more than 30,000 employees, the Fraunhofer-Gesellschaft has a research budget of 2.9 billion euros. Around 70 percent of this sum are generated through industrial commissions and publicly financed research projects.

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Dr. Sandro Koch

Dr. Sandro Koch completed his physics studies at the Dresden and received his PhD in applied physics in 2015. He then joint Fraunhofer IPMS as a research scientist and held several research management positions focusing on MEMS-based acoustic and photonic sensors. Currently, Sandro Koch is working as business unit manager “Acoustic Sensors and Systems” on the development of MEMS modules in the audible and ultrasonic range and their transfer to industry.

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Fraunhofer IPMS

The Fraunhofer Institute for Photonic Microsystems IPMS in Dresden Germany is your access to know-how, expertise, and modern R&D infrastructure in the field of optical sensors and actuators, integrated circuits, microsystems (MEMS/MOEMS) and nanoelectronics. The Fraunhofer IPMS is one of 76 institutes of the Fraunhofer-Gesellschaft, the leading organization for applied research in Europe. Relying on more than 30,000 employees, the Fraunhofer-Gesellschaft has a research budget of 2.9 billion euros. Around 70 percent of this sum are generated through industrial commissions and publicly financed research projects.

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Elpin Goh

Elpin Goh is Senior Director of Specialty Technologies Business Development at Lam Research. She is responsible for business strategy development and planning in Specialty Technologies in APAC region. She works with various Lam product owners to define product strategy and drive innovative product solutions in Specialty Technologies.

Prior to this, Elpin focused on the sales account management in Lam SEA. Elpin’s experience includes process integration, product management, sales and business development in the foundry and semiconductor equipment industry. She started her career as a process integration engineer at GlobalFoundries where she held various positions in process integration, customer engineering, product management and business development.

Elpin received a Master’s degree in Electrical Engineering from National University of Singapore, Singapore. She also holds a Bachelor’s degree from University of Manchester Institute of Science and Technology, UK.

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Lam Research

Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.co

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Kamel Ait Mahiout

Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

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ISES

International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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Dr. Robert Pan

Robert is current working at Silterra Malaysia as head of Technology Development. He had total of 26 years of experirnce in semiconductor industry.

His previous working experienc was with Texas Instruments and TSMC. The technologies he had developed including 45 -65 nm CMOS technologies, 0.6um to 0.13 um BCD technologies, RFLDMOS, DDI, and High voltage, Life Science, SiPh and MEMS …etc. He has a PhD degree from University of New York at Buffalo, Electrical Engineering Department.

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SilTerra Malaysia Sdn. Bhd

SilTerra, a pure-play wafer foundry, offers various CMOS technologies from 180nm to 110nm nodes. It serves a wide range of end-market applications, including IoT, power management, consumer electronics, medical and communication products. Besides CMOS technologies, SilTerra also provides MEMS foundry services, unique and patented MEMS-on-CMOS technologies, silicon photonics, bio-photonics, and power. Its excellent customer service team helps customers realize working prototypes from proof of concept to high volume manufacturing.

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Yuanli Sun

Yuanli Sun received her M.S. degree in Industrial Management from the Polytechnic of Turin (Italy) in July 2012. She joined SPEA during her last academic year as a semiconductor testing equipment application engineer. She rapidly achieved being responsible for application development projects for IC, Power and MEMs devices,technical expertise that involve data modeling and analysis, C/C++ program languages, also, she participated in the design of extremely accurate measurement modules that are widely used in MEMS wafer testing.

With such a strong and well prepared background, in 2014, Yuanli establishes a wholly owned subsidiary of SPEA in China, where she’s responsible in full for SPEA’s business development and after-sales service in China. Riding the wave of success, Yuanli establishes more offices in Suzhou, Shenzhen, and Chongqing to enhance the popularity and reputation of SPEA in China.

Today, as General Manager of SPEA China, her group has worked directly with SPEA’s customers to develop state-of-the-art technology for testing high volume Power Modules, MEMS test cell, wafer level tester high parallelism solutions.

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SPEA

Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.

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Dr. Daniel Chang

Dr. Daniel Chang is Vice President and General Manager of TDK-InvenSense Taiwan. Dr. Chang has over 25 years’ experience commercializing MEMS products and specializes in MEMS product integration. At InvenSense, he oversees the team of 300 people on various aspects of operation and engineering activities to deliver over 1 billion intelligent sensors per year. Prior to this in 2015, Dr. Chang serves as Sr Director of Product Engineering in Qualcomm MEMS Technology; where he launches several connected devices showcasing the latest Qualcomm technologies. Before joining Qualcomm in 2005, Dr. Chang has been with HannStar Display (2003), TSMC North America (2000), and Unilever Research US (1996). Dr. Chang received a BS in Chemical Engineering from National Taiwan University in 1987, and then received an MS in Chemical Engineering from the University of Texas in Austin in 1992 and a PhD in Chemical Engineering and Material Science from the University of Minnesota in 1996.

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TDK InvenSense Taiwan

InvenSense, a TDK Group company, is a world-leading provider of SmartSensing platforms targeting the consumer electronics and industrial areas with integrated Motion, Sound, Pressure, and Ultrasonic solutions. InvenSense’s solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, barometric pressure sensors, and ultrasonic time-of-flight sensors with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in Mobile, Wearables, Smart Home, Industrial, Automotive, IoT, Robotics, and many more types of products. InvenSense became part of the MEMS Sensors Business Group within the Sensor Systems Business Company of TDK Corporation in 2017. InvenSense is headquartered in San Jose, California and has offices worldwide.

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