2-3 December 2025
Tokyo
2-3 December 2025 - Tokyo
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Centric Software® (a subsidiary of Dassault Systemes Group) provides AI-powered platform for consumer goods brands, retailers, and manufacturers of all sizes, covering every process from product ideation to commercialization.
Centric PXM™ (formerly Contentserv) connects product data, digital assets, and content across all channels to accelerate go-to-market execution and deliver consistent, high-quality product experiences worldwide.
Built for industrial-scale efficiency, Centric PXM integrates PIM, DAM, Content Syndication, and Digital Shelf Analytics (DSA) in one unified solution. Manufacturers leverage Centric PXM to streamline product data management, automate content delivery, and gain real-time insights into performance across distributors, e-commerce platforms, and retail partners.
Global leaders in consumer goods and manufacturing achieve measurable results with Centric Software — including up to 400% faster revenue growth, 80% cost reduction in content creation, and an 8.5x increase in product data accuracy.
Part of the comprehensive Centric Software portfolio, Centric PXM complements Centric PLM™, Centric Planning™, and Centric Market Intelligence™, helping manufacturers manage every stage from concept to consumer with full compliance, visibility, and agility.
Empower your teams. Unify your product experience. Transform your growth with Centric PXM.
Learn more about Centric PXM: https://www.centricsoftware.com/centric-pxm/
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Established in 1974, Plasma-Therm is a global manufacturer of advanced plasma processing equipment, providing tailored solutions to the specialty semiconductor markets, including wireless, power devices, photonics, sensors, and MEMS, advanced packaging, memory, and R&D. Plasma-Therm’s products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base.
Phone: +1 727-577-4999 or information@plasmatherm.com
Plasma-Therm’s product portfolio includes single wafer, batch, and cluster solutions for Etch (ICP, RIE, DSE, IBE, ALE); Deposition (PECVD, HDPCVD, F.A.S.T); Material Modification (HDRF, RTP); and Die Singulation Applications (PPDOT). Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of our global customer base.
PVA TePla Analytical Systems designs and manufactures state of the art Scanning Acoustic Microscopes (SAM). This SAM utilizes ultrasound to non-destructively examine surfaces and internal structures of a solid sample. Voids, inclusions, cracks and even density variations are all defects sensitive to the technique of acoustic microscopy. During the last 15 years PVA TePla AS introduced fully automated inline inspection SAMs for Si wafer and DCB quality control, bonding inspection of MEMS, wafers and 3D integration products. PVA TePla AS operates an international sales and service network with own application laboratories in Europe, the US, Japan, Singapore, Korea, Taiwan, China and Malaysia and cooperates with a large number of university facilities, such as Fraunhofer Institute and IMEC. PVA TePla AS participates in a large number of funding projects and takes an active part in research and development in respect of ultrasound methodology and transducer development.
The product range covers measurement and testing systems with ultrasound. In this case, the customers can choose from a large number of Scanning Acoustic Microscope as laboratory, semi-automated and fully automated in line systems. All systems can be customized to customers specific needs and requirements. Furthermore, all Scanning Acoustic Microscopes offer user-friendly application and structured user interface. The measuring systems are equipped with transducers, developed and manufactured in-house. Transducers from 15 to 2000 MHz are available for the systems. Specially adapted software, adjusted to all systems, offers the possibility to analyze samples fast and reliable with standard as well as advanced ML algorithms. In opposition to competitors PVA TePla AS distinguish itself from the competition by its long time experience in acoustic GHz-Microscopy which enables resolution below the 1 μm. The inclusion of multi-channel-scans permits a high throughput of samples and a shorter scan time. The systems reduce operating costs and become an important element in quality control of industry and semi-conductor business.
Founded in 1993, RENA Technologies has established itself as a global leader in mechanical and process engineering, for a diverse range of industries. We specialize in providing cutting-edge wet processing solutions for the semiconductor, solar, additive manufacturing, glass, and medtech industries.
A key area of expertise is wet chemical immersion, spray and single wafer processes for the manufacturing of semiconductors. With over 1,100 systems installed worldwide, our technology is trusted by manufacturers around the globe to enhance efficiency and production quality.
RENA Technologies employs approximately 1,000 professionals worldwide, all dedicated to innovation and excellence in our field. Headquartered in Gütenbach, Germany, and manufacturing sites in Albany, OR and Wykroty, Poland, we continue to drive advancements in process engineering, ensuring our customers receive the highest quality solutions for their manufacturing needs.
On top we provide worldwide onsite service support with over 150 Experts in 20 locations globally to ensure flawless installation and operation of our tools.
RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes like etching, stripping, cleaning or drying. RENA offers proven standard machines as well as customer-specific solutions and process support.
We are an emerging inspection equipment manufacturer, with a particular focus on inspection for advanced packaging.
Currently, our lineup includes a high-precision edge profiler for bonded wafers and a thickness measurement device. Additionally, we can provide various inspection equipment based on customer requirements.
Ajinomoto Fine-Techno Co., Inc. (AFT) is a subsidiary of the Ajinomoto Group responsible for the fine chemicals division. AFT (est. 1942) continues to deliver materials that can suit a wide range of customer needs in our four main strengths: molecular design, formulation, process development, and solutions. Our customers have commended us for our electronic materials. We have grown to play a major part in their value chains for electronics, automotive, and a variety of other products. We continue to refine our ability in materials science through research and development to continue creating value with our customers. We strive to provide the highest quality products, services, and information for our customers. Beyond our Ajinomoto Build-up film®, we’ve expanded our material portfolio to include molding, photo dielectric, magnetic, and optoelectronics. To maintain our leadership in our specified industry, we are devoted to providing state-of-the-art material, technology know-how, and customer service.
Please visit the website: Product information – Ajinomoto Fine-Techno Co.,Inc. (aft-website.com)
We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.
ASM International N.V., headquartered in Almere, the Netherlands, and its subsidiaries design and manufacture equipment and process solutions to produce semiconductor devices for wafer processing, and have facilities in the United States, Europe, and Asia. ASM International’s common stock trades on the Euronext Amsterdam Stock Exchange (symbol: ASM).
ASM equipment is a key technology for the semiconductor integrated-circuit chips needed to make the electronics products that consumers and businesses use everywhere. Our products solve important issues on the semiconductor industry’s technology roadmap with Atomic Layer Deposition (ALD), Plasma Enhanced Chemical Vapor Deposition (PECVD), Epitaxy, and Vertical Furnaces. Helping to make integrated circuits (or chips) smaller, faster and more powerful.
BE Semiconductor Industries N.V. (“Besi”)is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries focusing primarily on the advanced packaging segment of the market. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud infrastructure, computing, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY Nasdaq International Designation) and its headquarters are located in Duiven, the Netherlands. Research and Development is organizedin Switzerland, Austria and the Netherlands. Support and production is in Singapore, Malaysia and China. For more information, please visit our website at www.besi.com.
Based on the management philosophy that “We are committed to action with sincerity”, Uyemura is a leading company in surface treatment technology and develops business related to “plating” globally in order to contribute to the betterment of people’s lives and society.
The scope of surface treatment business is broadly divided into the three areas of plating chemicals, plating equipment and control systems. Uyemura is one of only a few companies in the industry that develops business in all three of these areas. In order to provide one-of-a-kind products and services that meet the diverse needs of our customers, we support cutting-edge manufacturing from “all the areas related to plating”, with plating chemicals, plating equipment and control systems.
CKD celebrated its 80th anniversary in April 2023. CKD’s journey has been a history of co-creation, working together with customers to solve their manufacturing challenges. Today, we have created more than 500,000 automated products and services. We support the lives of people all over the world through manufacturing. We will continue to explore and co-create automation technologies with creativity and innovation to pave the way for a healthy global environment and a prosperous future.
CKD Corporation develops, manufactures, sells, and exports automation machinery and components worldwide.
The company offers components products, including electric actuators, direct drive actuators, pneumatic cylinders, hand and chucks, assistive devices, software, directional control valves, refining and pressure adjusting components, speed and control valves check valves, auxiliary components, gas generators, fluid control components, sensors, controllers, vacuum system components, and mechanical indexer, as well as components for chemical liquids, high vacuum and special gas, and controllers for primary industries and irrigation.
It also provides automatic machinery, such as solder paste inspection machine, transparent object inspection device, and lithium-ion battery winding machine.
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
Henkel was found in 1876 by founder Fritz Henkel. With our business units – Adhesive Technologies and Consumer Brands – we hold leading market positions in both the industrial and consumer goods businesses.
Henkel adhesive technologies is world No. 1 producer in adhesives, sealants and functional coatings. With trusted brands and high-impact solutions based on an unmatched technology portfolio we are creating value for all our stakeholders. As experts for industrial applications in more than 800 industries, we work closely with our customers and partners. Based on our broad technology portfolio and our strong innovative power, we continuously develop customized solutions.
In fiscal 2023, Henkel reported sales of more than 21.5 billion euros and adjusted operating profit of around 2.6 billion euros. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Today employs a diverse team of about 48,000 people worldwide.
Henkel is the world’s leading provider of qualified, compatible material sets for semiconductor packaging. We’re your global partner prepared to handle any challenge and develop a solution that is smart and sustainable — together with you.
Henkel’s total solutions approach leverages extensive global resources to deliver superior semiconductor packaging material technologies and cost-competitive performance. From die attach adhesives used in traditional wirebond packaging to advanced underfills and encapsulants for advanced packaging applications, Henkel provides the cutting-edge materials technology and global support top microelectronics companies require.
Henkel’s advanced packaging solution include:
•Anhydride-free, low warpage liquid compression molding underfill (LC-MUF) for fine-gap filling and low wafer-level warpage.
• High fracture toughness, low CTE capillary underfills for faster flow and thorough bump encapsulation on large dies.
• Low-stress, high-elongation lid attach materials for improved warpage control and enhanced reliability performance.
Hermes-Epitek was founded in 1977. Our vision is to “be a world-class semiconductor and Opto-Electronic company“ by delivering exceptional products and services, uniting the team with the motto ”service by Hermes-Epitek”. Over the 40 years, Hermes-Epitek has been supporting customers in Asia with our partners, serving more than 200 semiconductor and opto-electronic plants. We have successfully developed E-beam inspection, Ion beam implanter, and MOCVD systems. Our service teams are located in Taiwan, Singapore, Malaysia, and China, with more than 1200 employees worldwide. For more information, please visit https://www.hermes.com.tw/en/ Head Office Tel +886-3-579-0022 Fax +886-3-579-0011 Address No.18, Creation Rd., 1, Hsinchu Science Park, Hsinchu 300093, Taiwan
Inabata & Co., Ltd. is a global specialized trading company with a rich history, leveraging its comprehensive capabilities to offer diverse solutions across various industries. A key focus is the information and electronics sector, where Inabata plays a vital role in the semiconductor industry.
The company provides a wide range of semiconductor-related materials, including specialized encapsulating resins and adhesives for optical semiconductors, as well as materials and equipment for LEDs. Inabata’s commitment to product development and quality assurance in this field is underscored by its wholly-owned subsidiary, Inabata Optec Corporation, which focuses on developing new products for opto-semiconductors.
Inabata’s global network and expertise in advanced materials position it as a valuable partner for innovation and growth within the international semiconductor landscape.
Inabata & Co., Ltd. provides a comprehensive array of products and services crucial to the advanced semiconductor industry. Our offerings span a wide range of electronic materials, specializing in solutions that meet the stringent demands of next-generation devices.
Key product categories include high-performance encapsulating resins and adhesives for various semiconductor applications, with a particular focus on optical semiconductors and LEDs. We supply essential materials for advanced packaging, contributing to enhanced device reliability and performance. Furthermore, Inabata facilitates the provision of specialized equipment and related components vital for semiconductor manufacturing processes.
Beyond materials and equipment, Inabata leverages its extensive global network to offer technical support, market intelligence, and supply chain solutions, helping customers navigate complex challenges and accelerate innovation in the rapidly evolving semiconductor landscape. Our commitment lies in being a strategic partner, delivering value across the entire semiconductor ecosystem.
Kyocera Corporation (TOKYO:6971, https://global.kyocera.com/), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as “advanced ceramics”). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of industrial and automotive components, semiconductor packages, electronic devices, smart energy systems, printers, copiers, and mobile phones. During the year ended March 31, 2023, the company’s consolidated sales revenue totaled 2 trillion yen (approx. US$15.1 billion). Kyocera is ranked #672 on Forbes magazine’s 2023 “Global 2000” list of the world’s largest publicly traded companies, and has been named among “The World’s 100 Most Sustainably Managed Companies” by The Wall Street Journal.
Manz Asia delivers semiconductor equipment and solutions built on core technologies in wet chemistry, plating, inkjet printing, automation, and software integration. Our expertise covers advanced packaging (High-Density PLP/FOPLP) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry.
From Fan-Out and High-Density PLP to glass core solutions, Manz Asia delivers complete RDL innovation.
We specialize in wet chemistry (cleaning, developing, etching, and stripping), plating, digital printing, automation, and proprietary software—ensuring uniform patterning on panels up to 700 mm. With end-to-end expertise in equipment design, fabrication, installation, and process validation, we enable a seamless transition from R&D to high-volume manufacturing, complemented by Contract Manufacturing and Sales Representation services.
Materials Analysis Technology Inc. (MA-tek) is an enterprise dedicated to the knowledge economy semiconductor industry. The application of materials analysis in various fields of research, processing, and quality control to enhance the speed of product development in the industrial sector. MA-tek has successfully integrated rare and valuable instrument operation services, while also incorporating consultancy and advisory functions to provide a diverse range of sample preparation services accurately and correctly.
MA-tek ‘s professional services can meet the analytical needs of clients in electronic product development, new material structures, and new process development. By effectively transforming traditional complex experimental research methods into standardized commercial services, MA-tek is committed to providing efficient and convenient solutions.
MA-tek possesses the most comprehensive materials analysis laboratory and electronic/electrical laboratory. It holds a leading position globally and promises customers reasonable success rates and delivery times.
Materials Analysis Technology Inc. (MA-tek) provides services in Materials Analysis (MA), Failure Analysis (FA) , Reliability Testing (RA) services, Failure Analysis (FA) and Reliability Testing (RT) services. MA-tek currently has 16 laboratories set up around the world, providing around-the-clock assistance in logistic support and technical services.
MA-tek is an independent lab with ISO9001, ISO15408 and IECQ17025 international accreditations and filed for an IPO in August 2009. Excellent consulting practices and highly efficient analysis techniques ensure quick response time and data delivery within 24 hours.
MA-tek focuses on capital investment of the hi-end analytical systems in solid state electronics and novel materials applications. The equipment performance characteristics have brought the labs to the highest tier of art. The ultimate goal of MA-tek’s labs is to be the most advanced research center while staying close to our customers and become THE BEST R&D PARTNER® with success.
For the MA-tek account number of express delivery, please contact:+886-3-6116678 ext : 3821
Mitsui Chemicals traces its origins back to 1912, when it began full-scale chemical operations in Japan. Today, Mitsui Chemicals is a comprehensive chemical manufacturer operating in over 30 countries. The company has four major business portfolios, one of which is ICT Solutions. This portfolio offers a diverse range of products for semiconductor device manufacturing, including MITSUI PELLICLE™, used to protect masks during the lithography process, and ICROS™ Tape, which protects wafers during the back-grinding process. Mitsui Chemicals is committed to innovation, continuously offering new solutions to meet the rapidly evolving needs of the semiconductor industry.
Murata Machinery (Muratec) is a worldwide leader and solution provider for automated material handling systems in semiconductor manufacturing and other manufacturing or distribution industries. Muratec also manufactures machinery and equipment such as Textile Machinery, Machine Tools, Sheet Metal Machinery, and Communication Equipment.
This year marks 90 years since its founding in 1935. Under the slogan “Innovation. Mark the turning point”, Muratec aims to create technologies that bring innovation to the market and society.
Pentamaster Group provides automation technology and solutions to multinational manufacturers in the automotive, semiconductor, electro-optical, consumer electronics, and medical sector, spanning across APAC, North America and Europe. Besides the HQ and production plant in Penang, Malaysia, the Group has strategic presence globally with offices located in the USA, Japan, Germany, Singapore and production facilities in China.
With the speed and magnitude of technology progress today, Pentamaster Group will always be bold enough to explore new innovations. For years, the Group has been one of the leading global providers of automated test equipment to suit different requirements and needs of customers from various industries. In the automotive segment, the group has developed a proprietary SiC wafer burn-in system, being one of the top four manufacturers in the world, in creating a niche market space for this growth sub-segment and to solidify the Group’s position in the automotive industry.
Plasmatreat is the key enabler technology for microfine cleaning, surface activation and atmospheric plasma coatings (CVD) of nearly all kinds of materials – from plastics, metals and glass in a wide variety of industries including semiconductors. We prepare surfaces in an environmentally friendly way – replacing the need for chemicals and primers.
Atmospheric plasma equipment enabling state of the art surface preparation – activation, cleaning, reduction and nano-coatings for:
Flux-free Advanced Chip Packaging, Power Modules, Wire Bonding, Display Bonding, LED, PCBA and Consumer Electronics.
Area-selective, inline plasma processes in atmosphere including CVD coatings (dielectric barrier coatings, tie layers and anti-corrosion protection).
Established in 1947, Sekisui Chemical Co., Ltd. is one of Japan’s leading integrated chemical manufacturers. Sekisui operates a residential business known as the Sekisui Heim brand, an environmental lifeline business that handles piping materials for factories and social infrastructure, a high-performance plastics business that provides chemical products in the mobility, electronics and industrial fields, and a life sciences business that provides testing and drug development support. In the electronics industry, we provides various products such as tapes, films, adhesives, fine particles, and binder resins for a wide range of applications such as displays, electronic components, and semiconductors.
Major products for the semiconductor field include “SELFA” temporary fixed tapes with excellent heat and chemical resistance, FCBGA build-up films with excellent low transmission loss property, heat dissipation sheets that combine proprietary magnetic field alignment technology and resin design technology, and conductive micro-particles with the highest particle size accuracy in the industry.
By combining core technologies, cultivated over many years, in precision mechatronics, cleaning, bonding, etching, vacuum processing and sputtering, we can offer solutions for manufacturing equipment that includes semiconductors, flat panel displays and electronic components, extending from development and design through to installation and service.
Inspired by our slogan of “Smart Solutions & Services for Your Manufacturing,” we will continue to be an indispensable partner for our customers, working with them to consider and understand their needs, and providing manufacturing equipment that fully satisfies them.
In this age of IoT, 5G, AI and ever-expanding data growth, we will contribute to our customers’ value creation by bringing cutting-edge technologies to manufacturing equipment for semiconductors and flat panel displays.
・Manufacturing and Sales of Front-End Process Equipment for Semiconductors and FPDs
We hold a strong market share with our single-wafer Si wafer cleaning equipment for semiconductor front-end processes and Hot-H3PO4 Wet Etching System, which have earned strong support from customers.
・Manufacturing and Sales of Back-End Process Equipment for Semiconductors and FPDs, Vacuum Equipment
We boast an extensive track record particularly in semiconductor flip chip bonders and FPD bonders, meeting the diverse needs of customers.
・Service
From service bases in Japan and overseas, Shibaura Mechatronics Group uses it high-tech capabilities to respond to diverse customer needs and to contribute to factory productivity improvements and equipment performance maintenance and upgrades.
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
We are Siliconphotonics advanced package and testing solution provider. Suruga Seiki is a Japanese company founded in 1964. Taiwan is the APAC operation center with design and CPO system assembly functions.
We are focusing on Siliconphotonics, Photonics wafer restring, PIC functional test and Active alignment, passive alignment, edge coupling and grating coupling by our key components, module, and tester system.
We can also provide camera module and lens decenter alignment inspection with our laser collimator and high precision stage.
Our website:
[About Siliconphotonics, Advanced Testing&Package functions for PIC]
[About Company Profile]
SURUGA SEIKI provides cutting-edge technology such as high precision positioning motor stage, excellent optical alignment algorithm and laser measurement technique. Experienced domestic services on photonics wafer testing, PIC coupling, assembly by active/passive alignment.
SUSS is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS supports more than 8,000 installed systems worldwide. SUSS is headquartered in Garching near Munich, Germany. For more information, please visit suss.com.
The SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. After sales, the company supports the entire life cycle of the tools: its range of services begins with the installation and startup of the systems including user training. Once systems are integrated in the customer’s environment, SUSS provides consistent support. Since long life cycles are very common for the company’s equipment, preventive maintenance programs are available, as well as reliable spare parts systems, warranty extensions and system upgrades. SUSS maintains service locations and local support teams in all areas of the globe to provide quick help.
TOK is a long-established photoresist manufacturer and one of its strengths is its full line-up of products that boast the world’s leading market share, including photoresists in the advanced field and in the legacy field. We provide a wide range of materials for the manufacture of a variety of cutting-edge electronic devices, particularly in the semiconductor manufacturing field, where rapidly innovating technology is progressing. Since its founding, the TOK has always focused on “high purity” chemicals and done its best to put into practice its four management principles,
・Create a frank and open-minded business culture
・Continue efforts to enhance our technology
・Raise the quality levels of our products
・Contribute to society
We will continue to follow and aim to further grow in the future through Electronic Material such as the photoresist as a “company meeting expectations of customers and society with the power of chemistry.”
Photoresists: Various chemicals including photoresists, the TOK’s core products, are used in forming fine wiring and transistors inside semiconductor chips. TOK holds a leading market share in semiconductor photoresists in the world including for EUV/ArF/KrF in the advanced field and g/i-line photoresists in the legacy field.
Connecting semiconductor chips to substrates: The TOK’s various photoresists and high-purity chemicals also contribute to the evolution of the backend process in which semiconductor chips formed in the front-end process are sealed to protect from external shocks and wiring to connect with other electronic components is formed.
Image Sensor / MEMS Manufacturing Field: The TOK’s various products contribute to manufacturing more compact and sophisticated electronic devices including image sensors, key components of smartphone cameras, and BAW filters that is part of antenna.
Panel Manufacturing Field: Micro processing technology honed in the semiconductor manufacturing field is also leveraged in the manufacturing of LCD and OLED displays.
通快霍廷格电子有限公司成立于1922年,总部设于德国弗莱堡,是世界领先的等离子体电源制造商,产品主要用于:半导体,显示器和太阳能领域,以及光学镀膜,装饰镀膜,工业镀膜,大面积玻璃镀膜等行业的等离子体应用,于1990年正式加入通快集团。通快霍廷格电子致力于开发、制造用于各种沉积和干法刻蚀工艺的等离子电源,在电源领域拥有一百多年的经验积累,在欧洲、美洲和亚洲分别设有销售和服务子公司和分支机构。
2006年,通快霍廷格电子中国成立,至今已经深耕中国市场19年。如今,通快霍廷格在中国设有亚太区应用中心、维修中心、电源及匹配器生产中心,为客户提供所有生产过程中的优质服务。2023年,通快霍廷格中国新工厂在太仓建成开业,这是通快霍廷格继德国、波兰之后布局的全球第三家生产制造基地。
TRUMPF Huettinger is a high-tech company and a leading global manufacturer of DC, medium-frequency, high-frequency and semiconductor-based solid-state microwave generators.
The business units include plasma technology, industrial heating, battery inverter systems as well as microwave generators and amplifiers. These process power supplies are being used in many key processes in research, development and production. As a part of TRUMPF – technology leader of industrial lasers and machine tools – TRUMPF Electronics is headquartered in Freiburg/Germany and has sales and service branches in Europe, US and Asia providing a global IoT based service support.
Product introduction:
1. TruPlasma DC 4000 (G2) Series
TruPlasma DC 4000 (G2) 系列专为金属,金属氧化物,绝缘材料的反应直流溅射而开发。电源以直流脉冲的形式输出,在高要求的膜层质量和大产能的PVD 和PECVD 工艺中证明了它的优势。
The TruPlasma DC Series 4000 (G2) combines the excellent arc handling of TRUMPF Hüttinger with the advantages of DC pulse technology. This means you gain improved coating results with fewer defects, along with a higher deposition rate. The results are brilliant surfaces and a high level of production power.
2. TruPlasma DC 3000 (G2) Series
TruPlasma DC 3000 (G2) 系列适合众多直流溅射工艺,得益于先进的电弧管理和集成水冷装置,该款直流电源同样可用作脉冲式直流电源的高性价比替代方案。此外,极其紧凑的结构使其方便集成至现有应用中。
The TruPlasma DC Series 3000 (G2) is suited to numerous DC sputtering processes. The DC generators also make an interesting cost-effective alternative to pulsed DC generators due to their progressive arc management and the integrated water cooling. The very compact design also enables simple integration into existing applications.
3. TruPlasma RF 1000/3000 (G2/13) Series
全新一代的射频电源TruPlasma RF 1000 / 3000 (G2/13.56M) 系列,对工艺过程中的所有参数进行实时监测,即使在要求严苛的等离子体工艺中,仍能确保可靠供电。其稳定的输出功率和高精度控制确保高效高生产效率的同时,实现最佳工艺效果。
The TruPlasma RF Series 1000 / 3000 (G2/13) are the latest generation of RF generators. Due to innovative functions such as the patented CombineLine coupling technology or real-time measurement of all process parameters, reliable power supply even in demanding plasma processes is guaranteed – the optimal conditions for reproducible results and high productivity.
4. TruPlasma LF Series
TruPlasma LF 1000 系列电源基于创新的平台概念, 频率范围有350k,400k,2M,功率范围1~10kw,适用于各类半导体,光伏,ALD,刻蚀等离子应用。
TruPlasma LF 1000 series are based on an innovative platform concept with frequency ranges of 350k, 400k, 2M and power ranges from 1 to 10kw for all types of semiconductors, photovoltaic, ALD, and etch plasma applications.
5. TruPlasma VHF 3000 series
TruPlasma VHF 3000 系列电源基于创新的平台概念, 频率覆盖27M;40M;60M。功率范围1~10kw。可满足极为苛刻的生产要求。VHF 电源的纯水冷模块化结构与极高的功率密度设计可以确保大功率输出下的稳定性。
TruPlasma VHF 3000 series power supply is based on an innovative platform concept covering frequencies of 27M, 40M, 60M, and power ranges of 1~10kw to meet the most demanding production requirements. the VHF power supply’s pure water-cooled modular construction and extremely high power density design ensure stability at high power outputs.
USHIO is a leading company of lithography tool for Panel Level Advanced Packaging.
Yamaha Robotics Co., Ltd. is a Yamaha Motor Co., Ltd. group company that handles semiconductor manufacturing equipment (back-end processing) and electronic component assembly equipment businesses.
We can offer to provide a total solution that exceeds our customers’ expectation as the “Turn-Key Provider in Semiconductor Back-end Process Equipment” by integrating the technologies of bonders, molds,surface mounters, Industrial Robots, and various automated equipments.
Development, manufacturing and sales of semiconductor back-end process equipment.”Connecting” technology: die bonding, wire bonding and flip chip bonding; “Solidification” technology: resin encapsulation equipment and molding equipment; “Assembly” technology: electronic component assembly and manufacturing equipment.
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