ISES EU Power 2023

14-15 September, 2023 – Stresa, Italy

  • Regina Palace Hotel
  • Corso Umberto I, 29, 28838 Stresa VB, Italy

Sponsors

Agenda Day 1 – September 14, 2023

Registration

07:30 – 08:30

Welcome Speech

08:45 – 09:00

Salah Nasri

President

ISES

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STRENGTHENING EUROPE’S STRENGTHS & TECHNOLOGICAL LEADERSHIP

Opening Address

09:05 – 09:25

Lucilla Sioli

Director Artificial Intelligence and Digital Industry

EU Commission

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The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem

09:25 – 09:45

Dr. Thomas Morgenstern

EVP Frontend IFAG FE

Infineon Technologies AG

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ENABLING AN ELECTRIFIED & ENERGY EFFICIENT FUTURE

Future of SiC Power Modules in Automotive and Industrial Applications

09:45 – 10:05

Claus A Petersen

President

Semikron Danfoss

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Networking Break and Business Meetings

10:05 – 11:05

Volkswagen Group – Power Electronics In-House Development

11:05 – 11:25

Alexander Krick

EVP Technical Development

Volkswagen Group Components

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Innovative Traction Drives with SiC Semiconductors

11:25 – 11:45

Dr. Ladislav Sobotka

Engineering and R&D Director

Skoda Electric

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Partnership as a Foundation for Decarbonization

11:45 – 12:05

Vishnu Kumaresan​, Ph.D

Semiconductor Business Specialist & Segment Leader

Volvo Group

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ENHANCHING RELIABILITY, QUALITY & PERFORMANCE

Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive

12:05 – 12:25

Ph.D. Emmanuel Sabonnadière

VP Division Automotive & Industrial

Soitec

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Process Control Trends for WBG Power Devices

12:25 – 12:45

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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Buffet Lunch

12:45 – 14:00

The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors

14:00 – 14:20

Gayn Erickson

President & CEO

Aehr Test Systems

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Risk and Challenges With Capacity Investments & Supply Chain Resiliency

14:20 – 15:00

Ralf Bornefeld

SVP Power Semiconductors & Modules

Bosch Sensortec

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Networking Break, Business Meetings and Refreshments

15:00 – 16:00

EQUIPMENT & MATERIAL SUPPLIER SESSION

How Laser is Enabling The Power Semiconductor Roadmap

16:00 – 16:10

Jeroen van Borkulo

Head of Business & Marketing

ASMPT

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Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?

16:10 – 16:20

Roland Shaw

President of Accel-RF

STAr Technologies

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Addressing Testing Challenges for Power Modules and Three-Level Inverters

16:20 – 16:30

Elia Petrogalli

Sales Manager Semi & MEMS Business Unit

SPEA

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Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection

16:30 – 16:35

Dr. Vamsi Velidandla

Senior Director, Product Management

Onto Innovation

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Enabling Solutions For Advanced Power Device Fabrication

16:35 – 16:40

Dr. Anna Battaglia

Technology Manager

Lam Research Corporation

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Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

16:40 – 16:45

Dr. Christian Ohde

Global Product Director SC/FEC

mks Atotech

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Customized Silicon and SOI Wafers Enabling Enhanced Power Devices

16:45 – 16:50

Dr. Atte Haapalinna

CTO

Okmetic

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TEL: Moving Into the MAGIC Era of Semiconductors

16:50 – 16:55

Neil Armstrong

Director Sales Development

TEL

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Thin Film Solutions for Wide Bang Gap (WBG) Power Devices

16:55 – 17:00

Dr. Vinoth Sundaramoorthy

Product Marketing Manager

Evatec

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Empowering Power Electronics Packaging Through Photonic Debonding

17:00 – 17:05

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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The EDA breakthrough solution for SiC and GaN Front-End and Back-End

17:05 – 17:10

Luca Lillacci

General Manager

EDA Industries

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SiC / IGBT Power Module Assembly & Test Equipment Solutions

17:10 – 17:20

Michael Koelbl

General Manager Pentamaster Automation Germany GmbH

Pentamaster

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Total Solution of Process Kits to Enabling an Efficient Supply Chain in FAB

17:20 – 17:30

Jimmy Tao

Marketing Director

Tessvida

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Closing Address

17:30 – 17:45

Cocktail Reception & Gala Dinner

18:00 – 21:00

Wojciech Tyborowski

Director

Invest in Pomerania

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Agenda Day 2 – September 15, 2023

Registration

08:00 – 09:00

MARKET PULL AND TECHNOLOGY PUSH IN A VARIETY OF WBG APPLICATIONS

GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?

09:00 – 09:20

Bas Verheijen

Senior Director GaN Technology and Operations

Nexperia

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ICeGaN: the Call of the GaN Revolution

09:20 – 09:40

Dr. Giorgia Longobardi

Founder and CEO

Cambridge GaN Devices

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Innoscience’s GaN Power Devices: Reliable, Price Competitive and Mass Manufactured

09:40 – 10:00

Denis Marcon

General Manager

Innoscience

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Networking Break, Business Meetings and Refreshments

10:00 – 11:00

GAN INVESTMENTS, CAPACITY NEEDS & MARKET OUTLOOK

BelGaN – Moving to The Next Chapter

11:00 – 11:20

Dr. Marnix Tack

CTO & VP Business Development

BelGan

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ISES and GaN Valley MOU Announcement

11:20 – 11:30

Packaging & Integration Requirements and Different Approaches to SiC and GaN Packaging

11:30 – 12:00

David Clark

VP Product Marketing

Amkor Technology, Inc.

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GaN Is The New Black?

12:00 – 12:20

Ezgi Dogmus, PhD

Team Lead Analyst – Compound Semiconductors & Emerging Substrates

Yole Group

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Buffet Lunch

12:20 – 13:30

What is the Future of SiC, GaN and IGBT in EV?

13:30 – 14:20

Amr Darwish

Sr Director Product Marketing & Market Development

Vishay Intertechnology, Inc.

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Networking Break, Business Meetings and Refreshments

14:20 – 15:20

Ecosystem Collaboration Required to Drive Up WBG Economy of Scale

15:20 – 16:00

Dr. Rainer Kaesmaier

Managing Director, Global Product Group Semiconductors

Hitachi Energy Ltd.

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Boat Transfer to Island

Aperitivo

Dinner

Boat Transfer Return

Speakers

Venue

Regina Palace Hotel

Corso Umberto I, 29, 28838 Stresa VB, Italy

Advisory Board