Advanced power semiconductors and PMICs are key enabling technologies in automotive, consumer and wireless communications.

Si power semiconductors continue to evolve and are becoming increasingly sophisticated in order to deliver performance improvements. These trends are also driving the need for more advanced high volume manufacturing solutions. 300mm production, ultra-thin wafer processing, higher density device architecture and more complex vertical trench designs all pose new challenges from a fabrication perspective. At the same time, new generations of wide bandgap power devices that complement established Si based technologies are increasingly being deployed.

Lam is partnering with our customers and research partners to continually innovate in these fields in order to offer market leading etch, deposition and clean solutions for advanced and next generation power device manufacturing.