As the pace of Moore’s law slows, and the associated development cost increases, the industry has turned to advanced packaging to enable the improvement of the overall system performance, whilst also reducing cost. A key trend is the adoption of a “chiplet” approach, with panel level packaging and hybrid bonding being the two key advanced packaging enablers for the heterogenous integration. In this presentation, we will discuss the challenges and solutions for process control as well as the importance of chiplet genealogy.