27-28 August 2025
Suwon
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The increasing demand for advanced applications such as artificial intelligence (AI) and high-performance computing (HPC) has driven the greater adoption of the heterogeneous integration of chiplets into advanced packaging technologies. To optimize power, performance, area, and cost for specific applications, integration is pursued at both wafer and panel levels. In this presentation we will discuss key integration technology trends and examine how Onto Innovation’s comprehensive product portfolio addresses these high-value challenges.
Monita Pau, Ph.D.
Strategic Marketing Director, Advanced Packaging
Onto Innovation