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ISES TV –

IC Packaging Panel Discussion

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Curtis Zwenger photo

Curtis Zwenger

Ahmer Syed photo

Ahmer Syed

VP Package Engineering

Qualcomm Technologies Inc.

Tony LoBianco photo

Tony LoBianco

Head of Global Packaging

Skyworks Solutions

Deepak Kulkarni photo

Deepak Kulkarni

Senior Fellow Advanced Packaging

AMD

Rahul Manepalli, Ph.D. photo

Rahul Manepalli, Ph.D.

Intel Fellow; Director Substrate TD Module Engineering

Intel Corporation