Panelist
Haopeng Liu
Technical Solution VP
Focusing on the Collaboration and Leverage between UCIe and China Chiplet Standards
Day 1 / 15:50 - 16:35
Haopeng Liu has nearly 20 years of experience in IP product development and management, who has accumulated rich technical experience from IP products to systems. Besides, he has mastered the latest technology and application trends in the IP industry and ecosystem. Mr. Liu, served as IP Technical Support Manager and Senior Solutions Manager in Synopsys China, joined Synopsys China as the first IP engineer in 2007. He is always committed to developing and supporting many local design and manufacturing enterprises. He also won many honors such as Synopsys Global Outstanding Employees. He once served in Hisilicon, mainly responsible for IP design and implementation.
Company Profile
AkroStar was founded in June 2020 and is a leading Chinese enterprise specializing in advanced interface IP. We are committed to the research and development of domestically produced advanced interface IP and breaking through “bottleneck” technologies. AkroStar offers comprehensive high-speed interface IP solutions, including PCIe, Serdes, DDR, D2D, USB, MIPI, HDMI, SATA, SD/eMMC, etc., covering a full-stack complete IP solution compliant with the latest protocol standards.
Company website：https://www.akrostar-tech.com/
Speaker
Jianmin Li
Packaging R&D Director, Amkor Technology China, Inc.
Chiplets and System Integration – Key Concepts and Implementation
Day 1 / 09:45 - 10:05
In this presentation, Jianmin Li, Director of R&D at Amkor Technology – China, discusses the key concepts and implementations of chiplets and system integration. Li highlights the strong trends in chiplets and heterogeneous integration products, which offer new ways to achieve innovative product architectures while maintaining optimal Performance/Power/Area/Cost (PPAC) ratios for the future of the industry. Li emphasizes the need for advanced IC packaging capabilities to support these approaches, and notes that OSATs and Foundries are actively responding to enable this integration.
The presentation emphasizes the importance of starting with a 2D module and augmenting it with 3D as necessary for enhanced performance and differentiation. Additionally, Li mentions Amkor’s involvement as a contributor member of the UCIe™ ecosystem, which aims to define next-generation computing standards. Overall, this presentation provides valuable insights into the evolving landscape of chiplets and system integration, positioning the speaker as a seasoned professional in the field.
Jianmin joined Amkor in 2013, and is currently packaging R&D director in Amkor Assembly & Test (Shanghai) Co. Ltd, responsible for developing various package type including memory SCSP, flip chip package, SiP and optical sensor packages. He has more than 20 years of experience in assembly process engineering area. Prior to joining Amkor, Jianmin was an assembly process engineer in Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Speaker
Dr. Hongchao Liu 刘红超
SVP/Chief Scientist
The Challenges in Getting a Reliable SiC Device
Day 2 / 16:05 - 16:25
SiC power device is becoming crucial in new energy industry, especially in driving the BEV car to penetrate the market. However, comparing with Si devices, SiC devices are prevailing their applications, since making SiC devices reliable is still challenging. The reliability issues might arise from substrates, epi, processing, assembly, even the final test and application. In this presentation, the defects from different processing stages are sampled, and their impacts on device reliability are outlined. It can be seen that effective tools and more reliable data are needed for screening those flawed devices. In YASC, we are introducing new tools, accumulating data, and know-how to make the SiC device reliable and robust.
How Chinese local makers get ready to power the EV market?
Day 2 / 16:55 - 17:35
Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.
Company Profile
YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.
Speaker
Dr. Stefan Pieper
Global Application Manager
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Day 2 / 14:45 - 14:50
In today’s world with its increasing demand in power semiconductor devices for electrification, e-mobility and enabling the flexible use of green energy it has become more and more imminent that it is not only necessary to involve new semiconductor materials (e.g. SiC, GaN) but also apply alternative manufacturing technologies to maintain the flexibility and reliability on the next generation of power semiconductor devices.
Electroless metallization processes from MKS are part of these alternative technologies for power semiconductor device manufacturing and have been established in the industry over past 10 years with their benefit of providing maskless metallization with higher throughput capability at a reduced Cost of Ownership compared to physical metallization techniques. We present these advantages on an example of an ENEPIG final finish that can be used as the basis for connecting the power semiconductor via wirebonding, soldering or sintering to the outside. The ENEPIG final finish can be obtained by using the Portfolio of MKS Electroless Metallization processes.
Stefan Pieper has studied chemistry in Berlin, Germany where he also completed his PH.D. in analytical chemistry. In 2009 he joined Atotech as Application Scientist in the department of Semiconductor Advanced Packaging processes where he used the opportunity to gain deep insight in multiple electrochemical metallization processes and their characterization for semiconductor application. During his work as Application Scientist, he also spent over 3 years in the US where he optimized Cu dual damascene electrodeposition and Through Silicon Via plating. In 2020 he took over the position of Global Application Manager for Electroless deposition processes in semiconductor application at Atotech. In his current position he is leading a team that provides wet-chemical solutions for semiconductor metallization with the focus on power semiconductor.
Stefan Pieper博士曾在德国柏林学习化学，并在那里获得分析化学博士学位。2009年，他加入安美特，担任半导体先进封装工艺部应用科学家。利用这个机会，他深入了解了多种电化学金属化工艺及其在半导体应用中的特性。在担任应用科学家期间，他还在美国花了3年多的时间，优化了双大马士革铜互连工艺和硅通孔电镀工艺。2020年，他接任安美特半导体化学镀工艺全球应用经理一职。在目前的职位上，他领导的团队为半导体金属化提供湿制程解决方案，重点是功率半导体。
Company Profile
Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com
Speaker
Dr. KK Kuo
VP R&D
Power Electronics Integration and Modulization
Day 2 / 15:40 - 16:00
Dr. KK Kuo is Vice President of ATX Group R&D Center, responsible for development of new technology, introduction of high technology. Dr. Kuo has over 22 years’ experience in semiconductor industry, good at new product development of RF modules, sensors, high reliability and intelligent automotive electronics, IoT IC and smart mobile communications. He holds more than 50 Chinese patents, dozens of U.S. and Taiwanese patents, and published many academic papers. Dr. Kuo is a member of IEEE Electronic Packaging Society, selected as “Science and Technology Entrepreneur of Jiangsu Province” in 2018. He graduated from Taiwan Sun Yat-Sen University with PhD in electrical engineering.
Company Profile
Speaker
Ralf Bornefeld
SVP Power Semiconductors & Modules
SiC – A Yin and Yang Perspective
Day 2 / 11:30 - 11:50
Worldwide ramp-up of electromobility is resulting in a huge demand of wide bandgap semiconductor materials like silicon carbide. The hype for SiC is ongoing, the material allows higher efficiency in power conversion, but is currently at higher cost than conventional silicon-based technology. This presentation will focus on latest SiC innovations in material development, device structures and drivetrain concepts, and shows how, all put together, enables not only efficient, but most importantly affordable electrification. Efficient and affordable aspects need to get in balance like in Yin and Yang philosophy.
Ralf Bornefeld is Senior Vice President with responsibility for the business unit Power Semiconductors & Modules at Bosch.
Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.
Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.
Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.
Company Profile
The Bosch Group is a leading global supplier of technology and services. It employs roughly 428,000 associates worldwide (as of December 31, 2023). According to preliminary figures, the company generated sales of 91.6 billion euros in 2023. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 90,000 associates in research and development, of which roughly 48,000 are software engineers.
Speaker
Laurent Giai-Miniet
CEO
Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging
Day 1 / 14:55 - 15:00
In today’s rapidly evolving technology landscape, the semiconductor industry is constantly pushing the boundaries of innovation to meet the demands of increasingly complex systems. With the popularity of Artificial Intelligence and high demand for new power management, the importance of thermal management cannot be overstated.
As semiconductor devices shrink in size and complexity increases, they generate higher power densities, resulting in elevated operating temperatures. This poses critical wafer testing challenges for manufacturers in terms of temperature accuracy and uniformity, as even minor thermal deviations can significantly impact the performance and reliability of these advanced chips.
This presentation will introduce ERS’s latest developments in wafer probing and advanced packaging; two critical areas that are geared towards maximizing yield and guaranteeing performance.
Laurent is the CEO of ERS electronic GmbH, and oversees the Sales, Marketing, Applications and Business Development team. He has more than 25 years of experience in the semiconductor industry and has held leadership positions in renowned companies such as Texas Instruments and Infineon, as well as in high-tech start-ups. Laurent has an MBA from the Institut d’Administration des Entreprises of Aix-en-Provence (France).
Company Profile
ERS electronic GmbH, located near Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. ERS’s headquarter, sales department, engineering center and production facilities are in Germany, and they also have sales, demo centers and support offices in the US, China and Taiwan.
Phone: +49 898941320
Email: info@ers-gmbh.de
Website: www.ers-gmbh.com
ERS electronic GmbH has gained an outstanding reputation in the industry, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, ERS’s renowned thermal chuck system AC3 Fusion with add-on technologies like High Thermal Uniformity, Anti-magnetic and High Voltage/Current are integral components in most wafer probers across the semiconductor industry.
Leveraging its decades of thermal management experience, ERS launched the first ever Thermal Debonding and Warpage Adjustment tool for Fan-out Wafer- and Panel-level Packaging applications in 2008. Since then, the company has contributed to driving innovation in the Advanced Packaging space, by supporting different wafer formats and panels. The company’s most recent innovations include the Wave3000, a warpage inspection tool that enables the measurement and analysis of warped wafers composed of different materials in less than 1 minute. In 2024, ERS also introduced its series of semi-automatic and fully-automatic PhotoThermal debonding machines, offering a breakthrough solution for TBDB processes. This innovative method minimizes operational costs while ensuring high throughput and exceptional process flexibility, regardless of adhesive material type or supplier. By lowering operational costs by more than 30% compared to laser debonding and enhancing efficiency, this technology is well-suited for applications involving AI chips, power ICs, GPUs, and high-bandwidth memory (HBM).
Speaker
Cheng-Tyng Yen
CEO
High Accuracy SPICE Model Faciliate Optimized Design of Power Electronics with SiC MOSFETS
Day 2 / 13:55 - 14:15
An accurate SPICE model is important for power electronics RD designers to pick up the right topologies according to applications and to optimize the layouts and choose the right components. Characteristics of SiC MOSFET are difficult to modeling using conventional Si-based physics models, and current commercially available models are mostly not accurate here or there, which reduced the usefulness of simulation and increased the complexity for achieving optimized designs. We’ve developed a SPICE model which can be applied to both planar and trench SiC MOSFET with very high accuracy, which will enable engineers to reach their target in an more efficient way.
How Chinese local makers get ready to power the EV market?
Day 2 / 16:55 - 17:35
Founder & CEO of Fast SiC Semiconductor. fastSiC is a fabless company dedicated on SiC power devices. Fast SiC Semiconductor has mass produced 650V~1700V SiC MOSFETs with its own proprietary designs, which have been adopted by leading customers in the field of server power supplies, charging piles and PV inverters. He has more than 10 years experiences on the design, process, qualification and application of SiC power devices. He currently serves as the TPC member of ISPSD and has published and filed more than 150 papers and patents.
Company Profile
Fast SiC Semiconductor is a SiC power devices supplier. We supply high performance 650V~1700V SiC MOSFETs and Schottky Barrier Diodes discrete devices and bare chips with our own proprietary designs, for leading customers in applications including PV inverters, EV charging piles, energy storage system, BMS, ATE, motor drive, SMPS for datacenter, OBC and DC/DC for EV, as well as manufacturers of industrial and EV power modules.
General Telephone: +886-3-6590579
General Email: info@fastsic.com
Website: https://fastsic.com
Speaker
Yupeng Xu
CTO
The Opportunity & Challenge of OSAT for the Coming Chiplet Integration Package
Day 1 / 11:40 - 12:00
The development of semiconductor IC follows Moore’s law. Today, it has encountered great challenges, whether it’s the physical size limit or the advanced manufacturing process with huge investment costs ,and so on have formed huge pressure on the industry. Packaging is considered to be the focus of continuing semiconductor chip integration in the next decade development direction, especially in the 2.5D, 3D packaging technology brought by the chiplet concept; We see that wafer factories have made faster progress in 2.5D and 3D packaging, What are their opportunities for OSAT? What challenges will it face?
Xu YuPeng, CTO of FOREHOPE electronic(NINGBO) Co.LTD since June of 2018. 21 years experience in semiconductor assembly house. Before FHEC, Mr Xu has 7 years experience work as VP of ICBU in JCET (2011~2018). and 7 years RND engineer/Manager in Statschippac shanghai(2004~2011). 2 years process engineer in ASE shanghai(2002~2003). Mr Xu experienced with all kinds of IC package assembly process & technology ,especially in SiP integration, Automotive IC , wafer level package development etc.
Company Profile
Forehope（FHEC） was founded in Nov 2017, devoted to a worldwide and industry-leading high-end IC ，package assembly and testing . The end customer application covered consumer electronics，AI, industry, Automotive, Network,Data center etc. We can deliver package type include WBQFN, WBLGA, WBBGA, FCCSP, Hybrid-BGA, SiP, MEMS.,QFP, FCBGA etc. And also we can provide wafer level package include Bumping, WLCSP. Forehope continue to research & develop advanced wafer level package like as Fan-out, 2.5D/3D , which for chiplet solutions.
Panelist
Jiemin Cao 曹杰敏
VP 副总裁
How Chinese local makers get ready to power the EV market?
Day 2 / 16:55 - 17:35
Graduated from Shandong University in 2003
2003~2004 engaged in process development of Ningbo SMIC(Riying&IMP)
From 2004 to today , I worked in Silan Microelectronics, respectively engaged in chip testing, FA&RA ,quality director, Power module product &assembly development .
Now is VP of Silan, in charge of: power module product &package development, IGBT/SIC chip platform management, product quality engineering, RA&FA, etc.
Company Profile
Since 1997
As a high-tech enterprise specializing in the design of IC chip and the manufacturing of semiconductor microelectronics-related products, Hangzhou Silan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. The company was founded in September 1997 and was headquartered in Hangzhou, China. In March 2003, our stock was listed on the Shanghai Stock Exchange and the company is the first IC chip design enterprise listed in China. Thanks to the rapid development of China’s electronic information industry, Silan has become one of the largest IC design and manufacturing enterprises in China, and many indicators such as technical level, business scale, profitability etc. are among the best in the domestic counterparts.
The IC chip production line belonging to Silan built in the Qiantang New District of Hangzhou currently has an actual monthly output of 220,000 pieces, ranking second in the world in production capacity for chips of 6 inches or less. Meanwhile, with the production line for 8-inch chips being constructed in 2015 and going into operation in 2017, the company has become the first domestic company possessing IDM products and production line for 8-inch chips. In 2018, a special process wafer production line for 12-inch chips and an advanced compound semiconductor device production line were constructed in Xiamen. By the end of 2022, the monthly production capacity of the company’s 12-inch chips line has reached 60,000 pieces, and the monthly production capacity of the compound semiconductor device production line has reached 140,000 pieces.
Our technologies and products cover many fields of consumer products, and maintain a leading position in many technical fields, such as green power supply chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage smart power module technology, the third-generation power semiconductor device technology, digital audio and video technology etc. Moreover, with rich experience in multiple fields of chip design, we can provide customers with solutions on targeted chip product series and systemic applications.
Our product and R&D investment is mainly focused on the following three fields:
ICs, Power Module(IPM/ PIM), Discrete Devices and kinds of MCU/ IC power semiconductor solutions based on Silan’s own special process of high voltage, high power and high frequency.MEMS sensors & Digital audio SoC and speech recognition.Optoelectronic products, LED chip Manufacturing and packaging (for indoor and outdoor LED display panel as well as LED illumination applications).
Our technologies and products cover many fields of consumer products, and maintain a leading position in many technical fields, such as green power supply chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage smart power module technology, the third-generation power semiconductor device technology, digital audio and video technology etc. Moreover, with rich experience in multiple fields of chip design, we can provide customers with solutions on targeted chip product series and systemic applications.
Our product and R&D investment is mainly focused on the following three fields:
ICs, Power Module(IPM/ PIM), Discrete Devices and kinds of MCU/ IC power semiconductor solutions based on Silan’s own special process of high voltage, high power and high frequency.
MEMS sensors & Digital audio SoC and speech recognition.
Optoelectronic products, LED chip Manufacturing and packaging (for indoor and outdoor LED display panel as well as LED illumination applications).
Speaker
Rainer Kaesmaier, Ph.D.
Managing Director Semiconductors
Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective
Day 2 / 11:55 - 12:15
The opportunities for WBG Power Semiconductors in automotive applications are recently widely discussed due to the immense growth potential of the new electric vehicle market. With the speed of market adoption, also the full supply chain needs to be developed.
This is not only the case within the semiconductor products supply from material – i.e. SiC epi substrates – to the chip and then to the module. It needs to be setup in the full industry value chain, from power generation via power transmission to the grid and charging infrastructure, then finally to the electric vehicle EV itself. This full industry value chain needs to be then differentiated depending on the final EV applications which have a wide variety of conditions to reflect: The volume driver is EV passenger cars, here already in a spread of technology requirements from high performance cars to standard models with less power needs. It becomes further differentiated, if we go up the EV types, e.g. in its intrinsic mass, from buses and trucks to electric locomotives.
The presentation will give an overview, how from a power electronics system provider view, the new power semiconductor technologies, i.e. SiC, drives the development of the new system concepts along the industry value chain applications due to the technological specific advantages of the new power semiconductor developments.
Dr. Rainer Kaesmaier is a Managing Director for the Global Product Group Semiconductors of Hitachi Energy, leading the semiconductor business with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes for market segments such as energy transmission & distribution, transportation & rail, renewable, industrial, and emobility. Rainer is a semiconductor industry veteran having held various management and executive positions in the sector for more than 25 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing. After stations at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, he resumed in 2018 the responsibility for ABB’s semiconductor business which is now Hitachi Energy. He is also a member of the board for Hitachi Energy Switzerland. Rainer was a member in various industries strategy committees in Europe and the US. Rainer holds a masters degree in physics from the Technical University Munich and a PhD in physics from the University Kassel in Germany. He is based in Lenzburg near Zürich, Switzerland.
Company Profile
We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.
Hitachi Energy Switzerland Ltd.
Semiconductors
Fabrikstrasse 3
CH-5600 Lenzburg, Switzerland
Phone: +41 58 586 14 19
Fax: +41 58 586 13 06
Email: salesdesksem@hitachienergy.com
www.hitachienergy.com/semiconductors
Panelist
Dr. Hongliang Shi
Silicon Carbide Application Director
How Chinese local makers get ready to power the EV market?
Day 2 / 16:55 - 17:35
Dr. Shi Hongliang, Director of SiC Application of Hunan SANAN, is responsible for customer requirement introduction, system level application solutions, technical support and new product definition. He has 10+ years of R&D experience in system application design of SiC power devices, optimized design of high frequency high power magnetic devices, etc. He holds a PhD degree in Electrical Engineering from Tsinghua University.
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Speaker
Mark Nils Münzer
Distinguished Engineer Innovation & Emerging Technologies Automotive High Power
Fu Lu Shou – The Three Lucky Stars of Power
Day 2 / 09:30 - 09:50
In a world challenged by global warming decarbonization became the most pressing task for our generation. In the light of this power electronics and the underlying semiconductor technologies are an essential tool for survival. In this sense GaN, SiC and Si are the three lucky stars of power. While all three technologies are inevitable for our future, each has its distinct character and use case. Starting with a recap of properties and manufacturing aspects, global trends for use cases and markets will be covered. A special focus will be on technology fusion (e.g. Si’C) to tackle conflicting requirements in power electronics.
Mark Muenzer received the Dipl.-lng. degree in electrical engineering from the RWTH Aachen, Germany, in 1997. As a development engineer for industrial power modules at Eupec GmbH he established industry leading power modules. In 2005 Mark transferred to Infineon Headquarter in Munich where he build up Infineon’s ElectricDriveTrain business. He initiated new product families for automotive power modules and related driver ICs. As a senior director Mark Muenzer was from 2012 until 2018 responsible for the newly found business segment EDT-Electric Drive Train. 2018 Mark Muenzer took over a position as Vice President for Innovation & Emerging Technologies in the Automotive High Power business line of Infineon. In September 2022 Mark was promoted to Distinguished Engineer.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Panel Moderator
Prof. Qinfen Hao
Professor
Focusing on the Collaboration and Leverage between UCIe and China Chiplet Standards
Day 1 / 15:50 - 16:35
Dr. Qinfen Hao, graduated from the Institute of Computing Technology, Chinese Academy of Sciences (ICT) in 2001 with a Ph.D. in System Architecture. He is currently the director of the Interconnect Technology Laboratory of ICT, a professor at the University of Chinese Academy of Sciences, the secretary-general of the China Computer Interconnect Technology Alliance (CCITA) and the director of the Wuxi Institute of Integrated Circuit Interconnect Technology.
He has successively engaged in the design and research of high-performance computer, high-end SMP server, several important chips in computer such as cache coherence interconnect chip, CPU, etc. He has won the second prize of the Chinese National Science and Technology Progress Award twice, in charge of over three national scientific research projects, served as the chief scientist of the Ministry of Science and Technology’s key research and development program. He published more than 40 scientific papers and applied for more than 30 patents until now.
Company Profile
Speaker
Dr. Fengze Hou
Associate Professor
Focusing on the Collaboration and Leverage between UCIe and China Chiplet Standards
Day 1 / 15:50 - 16:35
Fengze Hou is an IEEE senior member. He received his Ph.D. from the Delft University of Technology, Delft, The Netherlands, in 2020. In 2012, he joined the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), in Beijing, China. From 2013 to 2021, he was a senior engineer at the National Center for Advanced Packaging (NCAP), Wuxi, China. Dr Hou is an associate professor at the IMECAS. He has authored or coauthored over 60 articles in journals and international conferences and holds more than 20 patents. He first proposed the PCB-embedded SiC MOSFET packaging technology in the world. His interests cover chiplet and heterogeneous integration, advanced packaging, chip power delivery, thermal management, and thermo-mechanical reliability.
Company Profile
The Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS) was established in 1958 as the CAS No. 109 Semiconductor Factory under the former CAS Institute of Applied Physics. Its original goal was to meet the nation’s strategic need to develop a high-frequency transistor computer. After numerous changes and mergers, it assumed its current name in 2003.
The IME is the only comprehensive scientific research institution in China, capable of carrying out full-chain research and development from microelectronic principal devices, integration processes, high-end chips, advanced packaging, and manufacturing equipment to applications.
IME comprises a national key laboratory, two CAS key laboratories, 11 research departments, and three technology research centers, covering all the main research areas of microelectronics. IME has a Ph.D. program in electronics and information; two master’s degree programs in IC engineering, and electronic and communication engineering, respectively; and a postdoctoral program in microelectronics.
IME has established long-term cooperative relationships with many national research institutions, universities, and companies in such countries as the United States, the United Kingdom, Germany, Japan, and Singapore, etc. A large number of delegations visit the institute every year, giving lectures, conducting academic exchange, and undertaking cooperative research projects.
Company website: www.ime.ac.cn
Speaker
Dr. Yang Cheng
Senior Director Design Service BU
Heterogeneous Integration Enabled by Advanced Chiplet Packaging
Day 1 / 10:50 - 11:10
With the growing demand of high performance IC, heterogeneous system integration of multiple smaller chiplets by advanced packaging technology becomes one of the major driving forces of the semiconductor industry innovation. New technologies in high bandwidth 2.5D and 3D interconnection enable complex designs implementation. Chip-Package co-design is prerequisite to meet the target performance and STCO (system-technology co-optimization) methodology is critical to advance chiplet architecture for optimal system performance.
Dr. Yang has 20 years’ of experience in electronics system and IC packaging development. At present he is senior director of advanced packaging and SiP design at JCET. Before joining JCET, he was at Flex on SiP products and technology development in IoT, automotive, medical, and industrial applications, covering design, manufacturing, and testing areas. He has worked at Intel on memory packaging design and technology development for 13 years. Dr. Yang hold a Ph.D. degree from National University of Singapore, EMBA from Washington University in St. Louis, and Master and Bachelor from Shanghai Jiaotong University.
Company Profile
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Speaker
Simon Zhang
VP
Memory and Processors for Chiplet Designs
Day 1 / 13:45 - 14:05
Recent application of AI drives strong demand for HPC chip, and in the latest technology, 2.5D& 3D package solution provides the best electrical performance for these type chips; In this presentation, speech will focus on the CHIPLET design challenge which focus on the HBM& Logic chip multi connection.
VP of JSSI with 20+ years R&D and PM experience in advanced package area, full global OSAT operation experience. He holds more than 25+ patents in 2.5D PKG area and worked in global enterprise like SPIL, TI.
Company Profile
JSSI, registered in Sep’2020 in Nanjing，Jiangsu Province, P.R.C, and factory located in the same industry park with TSMC-12inch Nanjing Plant. JSSI business focus on Semiconductor Assembly & Test service including Bumping/WLCSP/eWLB/WB-FCQFN/LGA/BGA/2.5D package solution. JSSI core management and R & D team worked in advanced package area more than 20 years, and company committed to provide first-class technology services for customers; JSSI factory has 1700+ employees and obtained ISO9001, QC080000, ISO14001, ISO27001，TS16949 and other system certifications. JSSI R&D team worked with several key GPU/CPU design house to focus on the 2.5D PKG design and test vehicle sample manufacturing now.
Speaker
MoChen Tian
Founder and CEO
Interconnection Define Computing: Key Technology for Next Generation Computing Paradigm Evolution
Day 1 / 11:15 - 11:35
In 2021, he founded Kiwimoore and assumed the role of CEO. Kiwimoore is among the world’s pioneering companies, focusing on universal interconnect chiplets and system-level solutions. These are built on next-gen computing architecture and offer leading high-performance general-purpose chiplets and solutions. Their aim to enable high-computing power chips to achieve a significant leap in performance.
Former Global Vice President of NXP Semiconductors, he was accountable for marketing and team management in Greater China, encompassing Smart ID, MCU, Mobile, IoT, and other product lines.
He successfully spearheaded the product line definition in China, overseeing the entire process from market demand assessment to specification definition and product realization. This effort resulted in cumulative product lifecycle sales of $5 billion.
Previously, he served as the Head of Marketing Asia Pacific in the Chipcard & Security Division at Infineon Technologies.
Company Profile
Founded in early 2021, Kiwimmore is among the world’s pioneering companies, offering “universal interconnect chiplets and system-level solutions” based on the Chiplet architecture，our primary product lineup comprises two types of products: High-speed interconnect IO Die
and High-performance interconnect Base Die. Additionally, we provide a series of Die2Die IPs, Chiplet software design platforms, and other hardware and software products.
We target the AIGC-driven high-performance computing markets, such as data centers, autonomous driving, personal computing platforms, and more. Our company is dedicated to delivering chiplet system-level solutions with the interconnect chiplets. These solutions are designed to assist our customers in expediting the development of intricate, high-computing-power chips in a more efficient manner.
Speaker
Dr. David Haynes
VP Strategic Marketing
Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications
Day 1 / 14:35 - 14:40
A wide range of applications in consumer electronics, automotive electronics, IoT applications and 5G cellular communications are increasingly dependent on devices such as sensors, including MEMS, and CMOS image sensors, RF Devices, advanced power semiconductors and Bipolar-CMOS-DMOS ICs. This trend means these specialty technologies currently account for approximately 30% of all global IC demand1.
Deep reactive ion etching (DRIE), initially developed for the fabrication of MEMS devices2, has since become one of the key enabling technologies used in the fabrication of such devices as well as in advanced packaging schemes that require through silicon via (TSV) integration. At the same time, demands on the capability of the DRIE process have increased as device architectures have advanced and production has shifted to high volume manufacturing on 300mm substrates.
Lam Research’s Rapidly Alternating Process (RAP) and Syndion® DRIE tools have been well established in such high-volume manufacturing for more than two decades. Today we are focused on continued enhancement of our systems and process control methodologies in order to meet future requirements.
In this work we show how development of our deep silicon etch hardware and process capabilities is resulting in significant improvements in on-wafer results and supporting next generation device fabrication. Such challenges include the continuous improvement of process productivity, improved profile control, achieving smoother etched sidewalls, and improving uniformity of both etch depth and feature CD.
To illustrate this, we will discuss critical applications such as advanced deep trench isolation (DTI) in CMOS image sensors, etching of power device trenches and TSV fabrication.
1. IC Insights, McClean Report, Feb 2022
2. Franz Laermer and Andrea Schilp, Robert Bosch GmbH, Method of anisotropically etching silicon, United States Patent 5501893
David gained a B.Eng and PhD in Materials Engineering from Swansea University. His PhD thesis was in the field of organic semiconductors for electronic and optoelectronic applications.
In his professional career, David has accrued more than 25 years of experience in the Semiconductor Capital Equipment and research instrumentation sectors. Focused on new technology development, he has a strong process background in plasma etch and deposition for optoelectronics, photonics, MEMS, Power and RF Electronics, as well as advanced chip packaging technologies.
Building on this technical knowledge, David has a proven track record in developing strategic business partnerships, specializing in new technology developments and introduction of enabling process capabilities to leading semiconductor fabs worldwide.
David Joined Lam Research in June 2016. He is currently Vice President of Strategic Marketing in Lam’s Customer Support Business Group and is responsible for Lam’s strategy in Specialty Technologies.
Company Profile
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Speaker
Tong Wu, Ph.D.
Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications
How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges
Day 2 / 14:20 - 14:40
SiC materials and devices are rapidly gaining acceptance and being the game-changer in EV market future. The expected performance enhanced by SiC devices perfectly matches the need for the next generation of electrical vehicles, especially for the 800V EV platforms with high efficiency and high power density requirements.
However, a number of challenges must be addressed before SIC can be widely adopted and pursue its promises. Three major challenges, i.e., Manufacture Cost, Device and Packaging, and System Integration need to take care of, not alone by semiconductor manufacturers but together with up and down streams to collaborate.
Today, by gathering worldwide experts and players here, the presentation will focus on the market overview of SiC in automotive, promises and challenges, and how can we accelerate the adoption and breakthroughs.
吴桐，安森美（onsemi）中国区汽车市场负责人，上海交通大学半导体物理专业，数学专业辅修本科毕业，美国田纳西大学电气工程博士学位。吴博士在半导体封装，碳化硅设计应用方面拥有 10 余年的研发和工业经验。 目前在安森美负责中国区汽车技术与市场，覆盖产品设计，制造，市场及应用，了解新能源行业的市场、供应链、开发流程以及解决方案。与国内多家车厂、Tier 1 保持着深度合作以及技术支持。曾就职于美国田纳西州橡树岭橡树岭国家实验室（ORNL），以及车厂研发团队，共在国际会议和期刊上发表了 40 多篇论文，同时获得了多项 半导体方面的美国专利。
Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.
Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Speaker
Kaisheng Ma
Chief Scientist
Focusing on the Collaboration and Leverage between UCIe and China Chiplet Standards
Day 1 / 15:50 - 16:35
Kaisheng Ma is now an Assistant Professor in Institute for Interdisciplinary Information Sciences (IIIS), Tsinghua University. Founder of Polar Bear Tech. He received his Ph.D. in Computer Science and Engineering at the Pennsylvania State University. His research focuses on Robust and Efficient AI Algorithms, Post-Moore Architecture, and High-Performance Chips, especially the advanced chip architecture in the post Moore era and the corresponding design methodology and tool chain. Dr. Ma has published papers on top conferences including NeurIPS, ICCV, AAAI, CVPR, ISCA, ASPLOS, MICRO, HPCA, DAC etc. He has won many awards and honors, including: 2015 HPCA Best Paper Award, 2016 IEEE MICRO Top Picks, 2016 Penn State CSE Department Best Graduate Research Award, 2017 ASP-DAC Best Paper Award, 2018 EDAA Best Dissertation Award, and Springer Nature Research Highlights from China Collection Award 2020.
Company Profile
Polar Bear Tech(Xi’an) Co.,Ltd. founded from the Institute for Interdisciplinary Information Sciences of Tsinghua University, incubated by Xi‘an Institute for Interdisciplinary Information Core Technology, registered and established on July 9, 2021 and officially settled in the Software New Town in November 2021. Kaisheng Ma, an Assistant Professor of the Institute for Interdisciplinary Information Sciences of Tsinghua University, served as the Chief Scientist.
This company is committed to reducing the design period and NRE cost of large-scale and high-performance chips through Chiplet technology, and quickly realizing the iterative upgrading and function addition of products, and aims to provide customers with low-cost and flexible solutions from algorithms to server clusters.
Company website: https://www.bjxxtech.net/
Virtual Speaker
Victor Veliadis, Ph.D.
Executive Director & CTO
Vehicle Electrification Catalyzing Power SiC Mass Commercialization
Day 2 / 11:05 - 11:25
SiC brings compelling advantages to vehicle electrification including higher efficiency, fast charging, weight/volume reductions, and ultimately cost savings. Indeed, electric vehicle system insertion has emerged as the mass commercialization opportunity for SiC power semiconductors catalyzing their explosive growth. In this presentation, the fab models of the vibrant SiC manufacturing infrastructure will be introduced. In particular, the modest capital investments to manufacture SiC in mature fully depreciated fabs, alongside Si, leverage existing infrastructure and allow for SiC fabrication at Si economies of scale. Key barriers to SiC volume adoption will be identified and discussed. Finally, the impact of the US$150M PowerAmerica member-driven consortium in accelerating SiC and GaN power technologies will be summarized.
Victor Veliadis is Executive Director & CTO of PowerAmerica, a member-driven Manufacturing USA Institute of industry, universities, and national labs accelerating the commercialization of energy efficient silicon carbide and gallium nitride power semiconductor chips and electronics. At PowerAmerica he has managed a budget of US$156 million, and is now managing a US$64M renewal. Victor is also an ECE Professor at NC State University, an IEEE Fellow, a National Academy of Inventors Fellow, and an IEEE EDS Distinguished Lecturer. He has 27 issued U.S. patents, 12 book chapters, and 165 peer-reviewed publications to his credit.
Company Profile
PowerAmerica is a consortium of industry, universities, and national labs accelerating the commercialization of energy efficient silicon carbide and gallium nitride power semiconductor technologies. Our membership network spans the wide-bandgap technology ecosystem, from materials to device developers and fabs to module manufacturers to end users, as well as universities that educate and supply the future workforce. As we continue to grow, so does the diversity of our membership.
Speaker
Hidenori Abe
CTO, Semiconductor Materials, Resonac Holdings Corporation
Advanced Packaging Materials and Evaluation Platform at Resonac
Day 1 / 14:10 - 14:30
An increased density of IC chips and other components to increase processing speed highly will be required for post-5G/6G systems. Therefore, there is a need for technologies that allow for high-density packaging of differing chips within a single semiconductor package.
Resonac has started Packaging Solution Center to propose one-stop solution for customers in 2019 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package.
We are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large advanced package.
Hidenori Abe CTO for semiconductor materials, Resonac Holdings Corporation Executive director, Electronics Business Headquarters, Resonac Corporation. He is leading electronics materials R&D and strategy for semiconductor, substrate and display. Until 2023, he was the head of Electronics R&D Center and Packaging Solution Center, which is open innovation hub in advanced packaging development. I launched JOINT2, new advanced packaging consortium targeting 2.xD and 3D package in 2021.Prior to the above mission, he have been a General Manager of CMP Slurry Business Sector for three years. Before that he was a Manager of Marketing Promotion Group in Innovation Promotion Center at Hitachi Chemical (HC) for 2 years. When the career, he was promoted new R&D projects, especially targeting new business field using new technologies, and also to promote developing R&D products. As a side note, HC is one of the merged companies of Resonac. Hidenori Abe was Manager of Business Development Group in Packaging Solution Center at HC for 1 year with responsibility to promote open laboratory to partners such as customers and equipment makers, responsibility of marketing wearable related materials. Before that, he was epoxy molding compounds (EMC) engineer. During his 16 years carrier as engineer, he spent time doing responsibility of development of non-conductive carbon, green EMC, Cu wire compatible EMC, wafer level compression compounds, power module EMC and so on. His Cu wire compatible EMC development work contributed to the promotion to Cu wire conversion through several published papers. He received a master degree in chemical engineering field from Tokyo Institute of Technology, Japan and a master degree at the EMBA course from Oxford, UK.
Company Profile
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Speaker
Dr. Terry Wu
Director
Chiplets and Advanced Heterogeneous Integration
Day 1 / 09:20 - 09:40
With the ever-increasing demand for computing performance for mobile, IoT, AI, Big Data and automotive applications, the need for new solutions is growing due to the slowdown of Moore’s Law and computing power solutions. Heterogeneous integration is one of the key platforms to enable higher bandwidth and density for HPC and AI systems. This presentation will discuss how chiplets and advanced heterogeneous integration are enabling next generation computing.
Dr. Wu is currently working as Director of Business Development Team, AVP, Samsung Electronics. Prior to joining Samsung, he was CTO of Chengdu ESWIN System IC. He had also held several key positions in SJSemi and TSMC. Wu received DPhil in Inorganic Chemistry from Oxford University, and MS & BS degree in Chemical Engineering from National Taiwan University & National Chung Hsing University, respectively. Dr Wu was granted several awards in recognition of his contribution in Advanced Packaging, including 2018 Jiangshu Innovative & Entrepreneurial Talent Award, 2019 Wuxi Taihu Talent Award, 2021 Chengdu Golden Panda Talent Program, and 2022 CSTIC Best Young Engineer Award from SEMICON China. He has 14 journal and conference papers, with over 680 citations and H-index of 11. He also holds 40 US patents and 144 China patents on microelectronic packaging.
Company Profile
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.
Speaker
Francesco Muggeri
VP Marketing & Applications, Power Discrete & Analog, China, STMicroelectronics
Innovation in Power & Energy Management is Key to Support a Sustainable Future
Day 2 / 09:05 - 09:25
In this presentation, Francesco Muggeri will talk about the global challenges on energy consumption and the importance of more efficient and energy savings in power & energy management in Automotive and Industrial to achieve a sustainable future. Electrification and Digitalization leads to the acceleration of silicon content pervasion in automotive and industrial market, Mr Muggeri will further discuss how new technologies like Silicon Carbide (SiC) and Gallium Nitride (GaN) contribute to better power efficiency and more intelligent solutions for energy usage.
Francesco Muggeri is Vice President for Power Discrete and Analog Products, China at STMicroelectronics. In his role, Muggeri leads ST’s Industrial Focused Competence Centers including the Motor Control Competence Center, Power & Energy Competence Center and Automation Competence Center in Asia and is appointed as the Global Leader of ST Industrial Power and Energy Segment in July 2024.
Muggeri joined ST in 1995, as a designer for automotive sensors in Italy. In 2000, he moved to product marketing for power transistors before relocating to Shanghai as marketing manager for transistors in 2002. In 2008, Muggeri moved to Commercial Marketing for STMicroelectronics’ Asia Pacific operations in Hong Kong. He became director for Discrete and Analog Products in 2017 and added Marketing Communications to his mandate in 2018.
Francesco Muggeri was born in Zambrone, Italy in 1969 and graduated with a Master’s degree in Electronic Engineering from the University of Pisa, Italy. In 2014, he received an EMBA degree from the Global Asia Program, organized by the London Business School of London, Columbia University of New York, and the University of Hong Kong. In recognition of his contribution to the electronics industry, Muggeri was awarded the 2023 Asia Executive of the Year by EETimes and EDN from Aspencore.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Speaker
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
Tailored Solutions for the Semiconductor Industry Powered by TRUMPF
Day 1 / 14:45 - 14:50
With short introduction of TRUMPF and short video show how we active in Semiconductor industry, Mr. Czaja will Define our tailored solutions for customers in the semiconductor industry around the world.
Dariusz Czaja先生于2007年加入通快霍廷格电子，目前担任通快霍廷格电子亚洲董事总经理，主要负责中国，日本，韩国以及东南亚市场的业务营运以及拓展。在光伏、半导体、显示面板、玻璃镀膜等多个领域，Dariusz Czaja先生拥有十余年的业务营运和管理经验，其中包括光伏应用项目的重点推广。在通快霍廷格电子任职期间，Dariusz Czaja先生曾先后在波兰和德国工作，并于2017年开始担任通快霍廷格电子中国总经理一职。2023年，因应业务成长需要，荣任亚洲董事总经理
Dariusz Czaja先生拥有波兰卡齐米耶日-普瓦斯基拉多姆技术与人文大学的电子工程学位，他也是世界太阳能大会（World Solar Congress）咨询委员会的成员，同时也是中国国际半导体高层峰会（I.S.E.S.）的执行委员会成员。
Dariusz Czaja joined TRUMPF HUETTINGER Electronics in 2007 and is currently the Managing Director of TRUMPF HUETTINGER Electronics Asia, where he is responsible for business operations and expansion in China, Japan, Korea and Southeast Asia. Mr. Dariusz Czaja has more than 10 years of business operation and management experience in photovoltaics, semiconductors, display panels, glass coatings and other fields, including the key promotion of photovoltaic application projects. During his tenure at TRUMPF Huettinger Electronics, Mr. Czaja worked in Poland and Germany, and in 2017 he became General Manager of TRUMPF Huettinger Electronics China. In 2023, he was appointed Managing Director of Asia in response to business growth needs.
Mr. Czaja holds a degree in Electronic Engineering from the University of Technology and Humanities in Kazimierz-Pułaskiradom, Poland, and is a member of the Advisory Board of the World Solar Congress and a member of the China International Semiconductor Executive Summit (I. S.E.S.).
Company Profile
通快霍廷格电子有限公司成立于1922年，总部设于德国弗莱堡，是世界领先的等离子体电源制造商，产品主要用于：半导体，显示器和太阳能领域，以及光学镀膜，装饰镀膜，工业镀膜，大面积玻璃镀膜等行业的等离子体应用，于1990年正式加入通快集团。通快霍廷格电子致力于开发、制造用于各种沉积和干法刻蚀工艺的等离子电源，在电源领域拥有一百多年的经验积累，在欧洲、美洲和亚洲分别设有销售和服务子公司和分支机构。
2006年，通快霍廷格电子中国成立，至今已经深耕中国市场19年。如今，通快霍廷格在中国设有亚太区应用中心、维修中心、电源及匹配器生产中心，为客户提供所有生产过程中的优质服务。2023年，通快霍廷格中国新工厂在太仓建成开业，这是通快霍廷格继德国、波兰之后布局的全球第三家生产制造基地。
TRUMPF Huettinger is a high-tech company and a leading global manufacturer of DC, medium-frequency, high-frequency and semiconductor-based solid-state microwave generators.
The business units include plasma technology, industrial heating, battery inverter systems as well as microwave generators and amplifiers. These process power supplies are being used in many key processes in research, development and production. As a part of TRUMPF – technology leader of industrial lasers and machine tools – TRUMPF Electronics is headquartered in Freiburg/Germany and has sales and service branches in Europe, US and Asia providing a global IoT based service support.
Product introduction:
1. TruPlasma DC 4000 (G2) Series
TruPlasma DC 4000 (G2) 系列专为金属，金属氧化物，绝缘材料的反应直流溅射而开发。电源以直流脉冲的形式输出，在高要求的膜层质量和大产能的PVD 和PECVD 工艺中证明了它的优势。
The TruPlasma DC Series 4000 (G2) combines the excellent arc handling of TRUMPF Hüttinger with the advantages of DC pulse technology. This means you gain improved coating results with fewer defects, along with a higher deposition rate. The results are brilliant surfaces and a high level of production power.
2. TruPlasma DC 3000 (G2) Series
TruPlasma DC 3000 (G2) 系列适合众多直流溅射工艺，得益于先进的电弧管理和集成水冷装置，该款直流电源同样可用作脉冲式直流电源的高性价比替代方案。此外，极其紧凑的结构使其方便集成至现有应用中。
The TruPlasma DC Series 3000 (G2) is suited to numerous DC sputtering processes. The DC generators also make an interesting cost-effective alternative to pulsed DC generators due to their progressive arc management and the integrated water cooling. The very compact design also enables simple integration into existing applications.
3. TruPlasma RF 1000/3000 (G2/13) Series
全新一代的射频电源TruPlasma RF 1000 / 3000 (G2/13.56M) 系列，对工艺过程中的所有参数进行实时监测，即使在要求严苛的等离子体工艺中，仍能确保可靠供电。其稳定的输出功率和高精度控制确保高效高生产效率的同时，实现最佳工艺效果。
The TruPlasma RF Series 1000 / 3000 (G2/13) are the latest generation of RF generators. Due to innovative functions such as the patented CombineLine coupling technology or real-time measurement of all process parameters, reliable power supply even in demanding plasma processes is guaranteed – the optimal conditions for reproducible results and high productivity.
4. TruPlasma LF Series
TruPlasma LF 1000 系列电源基于创新的平台概念, 频率范围有350k，400k，2M，功率范围1~10kw，适用于各类半导体，光伏，ALD，刻蚀等离子应用。
TruPlasma LF 1000 series are based on an innovative platform concept with frequency ranges of 350k, 400k, 2M and power ranges from 1 to 10kw for all types of semiconductors, photovoltaic, ALD, and etch plasma applications.
5. TruPlasma VHF 3000 series
TruPlasma VHF 3000 系列电源基于创新的平台概念, 频率覆盖27M；40M；60M。功率范围1~10kw。可满足极为苛刻的生产要求。VHF 电源的纯水冷模块化结构与极高的功率密度设计可以确保大功率输出下的稳定性。
TruPlasma VHF 3000 series power supply is based on an innovative platform concept covering frequencies of 27M, 40M, 60M, and power ranges of 1~10kw to meet the most demanding production requirements. the VHF power supply’s pure water-cooled modular construction and extremely high power density design ensure stability at high power outputs.
Speaker
Markus Mosen
CEO
How does SiC Accelerate NEVs
Day 2 / 09:55 - 10:15
Nowadays, more and more electric vehicles hit the road, and this is helping the world to reduce its carbon footprint and fight against ever increasing greenhouse effect. The EVs can reuse multiple types of power sources in the shape of electric power. Nowadays, new EVs require higher charging speed, higher output power, higher efficiency, longer milage, and as well as more comfortable riding experience, which come along with new technical solutions and new demands for semiconductor power devices. New generation SiC devices have adopted more and more innovative structures and cooler packages, which enable the EVs to go farther, charge faster and work more economy. We believe with accelerated adoption of SiC-based solutions, we will make power efficiency for a cooler planet.
Markus has 20 years professional experience in managing globally Business and Product Lines in the Semiconductor Industry, developing, and setting up Sales & Marketing offices in China and Asia-Pacific, improving Market Share in different market segments including Mobile Solutions, Bipolar Power and Security. As well in his career he has been addressing different applications for Mobile Chipsets, Security and Chip Cards ICs, and more recently Power Discrete in Renewable Energy, Industrial and Consumer markets. Markus has 15 years living and working experience in Asia-Pacific (Singapore) and China (Beijing and Shanghai).
Company Profile
WeEn Semiconductors Co., Ltd was registered as a company on Aug 5, 2015. WeEn’s global footprint has an operational headquarter in Shanghai and wholly owned subsidiaries and centers in Jilin (North East China, Front-End Fabrication) , Hong Kong, Manchester (Research and Development) , Dongguan (Warehouse and Distribution), and cities throughout the world (Sales Offices and Customer Service Access). In September 2018, WeEn added its new, in-house, reliability and failure analysis laboratory in Nanchang, Jiangxi Province, China. With a heritage of over 50 years in semiconductor development and manufacturing, WeEn as a key player has focused on developing a wide and deep portfolio of industry-leading power products including Silicon Carbide Power Devices, Silicon Controlled Rectifiers and Triacs, standard and fast recovery Power Diodes, TVS and ESD Diodes and IGBT and Modules. All these products are widely used in the markets for telecommunications, computing, consumer electronics, intelligent home appliances, lighting, automotive and power management applications. WeEn seeks to help our customers achieve improved cost and production efficiency and contribute to the development of global intelligent manufacturing.
Speaker
Jim Jian
VP Sales APAC and NA
GaN HEMT for Electric Car Inverter: Breakthroughs and Challenges
Day 2 / 16:30 - 16:50
The mobility industry is living through the most dramatic changes since the invention of the internal combustion engine and the standardization of the manufacturing process. Society and governments are looking for zero-emission transport, while car makers are seeking the most efficient way to manufacture low-cost and long-distance electric cars. In this context, inverter efficiency became the critical performance parameter, and semiconductors with low loss switching energy, such as SiC and GaN are getting into the spotlight. In this keynote the successful development of a three- phase GaN-based inverter reference design with 400V bus voltage and 400ARMS current is discussed and the results are presented. The major steps on the way from semiconductor chip design, through module development and to full current inverter operation are discussed, chosen solutions explained and results are presented. The main challenges include robust high current > 100A GaN die, with low parametric shift because of repetitive unclamped switching tests up to 1600V; driving 4 dies in parallel to obtain equal current sharing, smooth waveform at needed current and obtaining low voltage overshoots on the gate and on the drain.
Jim Jian is Vice President of Sales for Asia Pacific and North America at VisIC Technologies, responsible for all aspects of Sales and Business Development of VisIC’s GaN semiconductors to Automotive OEMs and Tier-1s. Jim has over 25 years of experiences in semiconductor industry, spanning across Sales, Business Development, Product Management, Applications Engineering, and Design Engineering at various semiconductor companies including Broadcom, Provigent, Lucent Technologies. Jim graduated from California State University at San Jose with a BSEE degree.
Company Profile
VisIC Technologies has a decade of experience in creating, developing, and advancing concepts based on cutting-edge Gallium Nitride-on-silicon technology. We develop solutions that help reduce energy waste in power conversion systems, with a focus on battery electric vehicles (BEV). Our patented D3GaN technology – Direct Drive D-mode GaN – addresses the automotive industry’s cost, supply, sustainability, reliability, quality, and performance needs.
With our D3GaN technology, BEV can save up to 50% on power losses over the driving cycle of the electric car, thus reducing battery cost and increasing driving range and performance. This solution also reduces the cooling system requirements and the size of the BEV inverter.
VisIC Technologies has produced the first GaN-based transistors used in automotive inverters. By utilizing the GaN on Silicon technology, we address the supply chain concern as we are using existing semiconductor high-volume production lines.
Speaker
Dr. Wenbiao Ruan
R&D Director
Chiplet Process Integration Based on Glass Substrate and TGV Process
Day 1 / 13:20 - 13:40
The hole size can be less than 15 microns, and the metal filling capacity aspect ratio can reach 10:1. It adopts high-density intermediate layer wiring, with a minimum line width and line spacing of less than 1.5um, meeting the needs of high-density interconnections such as high-performance memory and CPU. The entire packaging body uses glass as the core layer of the intermediate layer, and uses the “RDL-First” process to flip the chip onto multiple layers of RDL wiring layers to achieve electrical interconnection. Compared with TSV, it reduces parasitic capacitance and inductance effects, reduces transmission signal delay, and can be widely used in high-frequency transmission fields.
Ph.D, majoring in Electronics and Solid State Electronics at the Chinese Academy of Sciences, currently serving as the Director of R&D at Xiamen Yuntian Semiconductor Technology Co., Ltd., responsible for the research and development of processes such as through glass via (TGV), fanout packaging (WL-FO), wafer level packaging technology, and glass based high-frequency devices. He has successively served in SMIC., Institute of Microelectronics and Detection Technology. In 2010, he was appointed as an associate researcher at the Institute of Microelectronics, conducting research on the modeling of integrated circuit manufacturing processes and manufacturability design methodology for 65 nm and below node, and participating in and completing multiple national major special research projects. Published over 10 articles and applied for 18 patents.
Company Profile
Founded in July 2018, Xiamen Sky-semi commits to the development and industrialization of advanced packaging and system integration technology for high-speed and high-frequency communication applications. Through independent R&D and collaborative innovation, we provide customers with integrated solutions and services from collaborative product design, process research and development to mass production.
The main business of Xiamen Sky-semi includes Wafer Level 3D Package (WLP), Fan Out Package (FO), System in Package (SIP) and Module, IPD device manufacturing, High Density Glass Through Via (TGV) technology, manufacturing of high precision antenna ,etc. We have provided design, packaging and integration services for nearly 100 customers at home and abroad。Sky-semi has a core team with outstanding innovation ability that has broken through a series of core and key technologies and has full range of wafer level system packaging as well as precision manufacturing capabilities from 4 inch, 6 inch, 8 inch to 12 inch.
Sky-semi Semiconductor based on technological innovation embarking on seize the historical opportunity to achieve leapfrog development in the new era of global semiconductor industry competition pattern by adhere to customer-centered ，Innovative and progressing philosophy，5G application as a breakthrough.
Speaker
Simone Bertolazzi, PhD.
Principal Technology & Market Analyst
Memory and Processors for Chiplet Designs
Day 1 / 16:40 - 17:00
The rise of generative AI applications and high-performance computing (HPC) in data centers has boosted demand for high-speed memory and computing devices with low-latency interfaces. In this context, heterogeneous integration and chiplet architectures enabled by advanced packaging approaches (e.g., hybrid bonding) are being regarded as the most promising solutions to address the memory-bandwidth bottleneck and increase the performance of computing systems via a tight integration of logic and memory functions.
This talk will provide an overview on the interplay between memory and processors in terms of technology and markets trends, describing the main solutions, the challenges, and the opportunities ahead for semiconductor players.
Simone Bertolazzi, PhD, is a Principal Technology & Market Analyst at Yole Intelligence (part of Yole Group), working with the Semiconductor, Memory, and Computing division. He is a member of Yole’s Memory team and contributes daily to the analysis of memory markets and technologies, their related materials, and fabrication processes. Simone obtained a PhD in Physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed flash memory cells based on heterostructures of 2D materials and high-κ dielectrics. Simone also earned a double M. A. Sc. degree from Polytechnique de Montréal (Canada) and Politecnico di Milano (Italy), graduating cum laude.
Company Profile
Yole Group is an international company recognized for its expertise in the analysis of markets, technological developments, and supply chains, as well as the strategy of key players in the semiconductor, photonics, and electronics sectors.
With Yole Intelligence, Yole SystemPlus and Piséo, the group publishes market, technology, performance, reverse engineering and costing analyses and provides consulting services in strategic marketing and technology analysis. The Yole Group Finance division also offers due diligence assistance and supports companies with mergers and acquisitions.
Yole Group benefits from an international sales network. The company now employs more than 180+ people.
More information on www.yolegroup.com.
Speaker
Julian Fieres
Vice President Transformation, Strategy, Sustainability & Digitalization
Semiconductors and Sustainability – Why Going Green is Chip Driven
Day 2 / 13:30 - 13:50
Julian Fieres studied management but always loved technology equally as much and is now working towards a vision for zero emissions to leave a better planet for the next generation. He is the Vice President of Transformation, Strategy, Sustainability & Digitalization at the Division Electrified Powertrain at the ZF Group. This includes the areas of strategy, M&A, product planning, digitalization and sustainability. With a revenue of €10 billion and around 30,000 employees at Division E, his team and he strive to make an impact for a more affordable and more sustainable mobility of tomorrow every day.
Company Profile
ZF is a global technology company supplying systems for passenger cars, commercial vehicles and industrial technology, enabling the next generation of mobility. ZF allows vehicles to see, think and act. In the four technology domains of Vehicle Motion Control, Integrated Safety, Automated Driving, and Electric Mobility, ZF offers comprehensive product and software solutions for established vehicle manufacturers and newly emerging transport and mobility service providers. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate and enhancing safe mobility.
With some 157,500 employees worldwide, ZF reported sales of €38.3 billion in fiscal 2021. The company operates 188 production locations in 31 countries.
For further press information and photos, please visit: www.zf.com
ZF Friedrichshafen AG
Corporate Headquarters / ZF Forum
Löwentaler Straße 20
88046 Friedrichshafen
Germany
Phone: +49 7541 77 – 0
Email: postoffice@zf.com
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