Panel Moderator
Curtis Zwenger
Session info not yet published.
Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and Wafer Level packaging technologies. He was formerly responsible for Advanced System in Package product development. Curtis has authored numerous technical articles and papers, and he currently serves on the IMAPS Executive Council as Director of Membership. Curtis has been issued 35 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
Company Profile
Keynote Speaker
CS Chua
President & Managing Director
Zero Emission Becomes Real in Next-Generation Mobility
Day 2 / 09:00 - 09:25
The European Union intends to cut greenhouse gas emissions by at least 55% by 2030 and has the goal be climate-neutral by 2050. Passenger cars and vans are collectively responsible for around 15% of total EU emissions of CO2. To meet the 2050 climate goal, road transport CO2 emissions would then have to decline more than three times as quickly (5.5% per year) from 2035 to 2050. Can such ambitious vehicle CO2 targets of the European Union and also those of other countries be achieved?
CS Chua will discuss the contribution of semiconductor companies to enable next-generation zero-emission mobility. Using electric vehicles, he explains how it is technically feasible to meet CO2 targets for vehicles while also meeting other crucial factors, such as extension of vehicle range, improvement of charging speed and the availability of a reliable charging infrastructure – with electricity from renewable energy sources. He discusses the market prospects for electric vehicles from 2023 to 2030 and the mix of semiconductor materials such as silicon, silicon carbide (SiC) and gallium nitride (GaN) used during this period.
CS Chua oversees regional sales, marketing and distribution, supply chain, R&D, and manufacturing. He is also responsible for strategy, quality management, human resources, and communications for the Asia Pacific region with local presence in Australia, India, Indonesia, Korea, Malaysia, Philippines, Thailand, and Vietnam. He has held the current role since 2017. CS joined Infineon in 2000 and has taken on roles in product marketing for industrial microcontrollers and regional marketing covering Asia Pacific’s automotive electronics segment. Previously as the Vice President of Automotive Regional Centre. CS has a Bachelor of Electrical and Electronics Engineering degree from the Nanyang Technological University in Singapore.
Company Profile
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.
Keynote SpeakerPanelist
Amarjit Sandhu
CVP of Assembly and Test, NAND Operations
Future Opportunities: Semiconductors Packaging
Day 1 / 11:35 - 12:00
Semiconductor is at the heart of future technologies such as data economy, artificial intelligence, autonomous and electrical vehicles and consumer products to name a few. Memory and storage are fueling the growth of these technologies, and there is a need for a portfolio with faster, persistent platforms of mainstream storage for read focus workloads to higher performance mixed-use workloads. Micron is at the forefront of solutions to these challenges with memory innovation and is scaling up to capture future growth opportunities.
Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology
Day 1 / 14:10 - 14:40
Mr Amarjit Singh Sandhu is the Corporate Vice President, Assembly and Test NAND Operations for Micron Technology. He has 30 years of Operations Management expertise in locations such as Singapore, China and Malaysia. He currently oversees 4 Assembly and Test captive sites namely in Micron Singapore, Muar (Johor) and Penang engaged in manufacturing NAND and DRAM components, Solid State Devices (SSD) and Memory Modules. He is currently leading the new state-of-the-art Batu Kawan semiconductor plant that will process wafers into semiconductor components and subsequently shipping it out as SSD or Memory Module to major customers worldwide. He has pioneered 4 Green field manufacturing startups in different geographies and led 3 successful turnarounds of matured organizations in the last 10 years in China, Singapore and Malaysia. Amarjit built up his career in the semiconductor industry with Texas Instruments Singapore, United Test and Assembly Center (UTAC), Western Digital Corporation (WDC) prior to joining Micron Semiconductor Asia in 2018. He earned his MBA from the Warwick Business School and Bachelor degree in Mechanical Engineering from the National University of Singapore.
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
Keynote SpeakerPanelist
Kam Lee
Senior Director, Advanced Packaging Technology and Service
Unleash Product Innovations with 3DFabric
Day 1 / 11:05 - 11:30
With the development of 3DIC and associated packaging technologies, semiconductor industry has extended performance and density optimization to system level, complementary to traditional chip scaling. Amid broader adoption of TSMC’s advanced 2.5D/ 3D packaging solutions along with growing chiplet complexity and form factor, the interaction between Si, packaging and components become increasingly crucial and requires continue innovations on design, process development and manufacturing.
With 3DFabric Alliance, we are extending OIP collaboration to packaging/ testing and working with industry partners on substrate and memory technology development for integrated system-level design solution to customers, together with the ecosystem of OSATs, material and equipment suppliers. In parallel, we also establish the worldwide first fully automated factory to offer best flexibility for our customers to optimize their packaging solution with better cycle time and quality control.
Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology
Day 1 / 14:10 - 14:40
Kam currently serves as Senior Director at TSMC Advanced Packaging Technology and Service, which he joined in 2022. He specifically manages the TSMC Testing RD, Testing operations and backend turnkey operations. He has extensive experience in semiconductor industry, having worked 27 years at Intel, in various roles in technology development, product development and high volume manufacturing. He previously held the role of Vice President of Intel product development and engineering.
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
Panelist
Dato Seri Lee Kah Choon
Chairman
Panel Discussion: Empowering the Next Generation of Semiconductor Talent in SEA
Day 1 / 16:35 - 17:15
Dato’ Seri Lee Kah Choon is currently the Independent Non-executive Chairman of Aemulus Holdings Berhad, a company listed on Bursa Malaysia, which engages in the design & assembly of automated test equipments in the electronic industry.
He is the Chairman of Federal Oats Mills, South East Asia’s largest oats manufacturer producing quality oats & oats based products for the Asian, Middle East and African markets.
Dato Seri Lee also sits on the boards of Nationgate Holdings Berhad & L&P Global Berhad (both listed on Bursa Malaysia) as their Senior Independent Director.
Additionally, Dato Seri Lee is a member of the Investment Committee of Areca Capital, a licensed fund manager for individuals, corporations and institutions.
Industries covered by these companies include: electronic testing equipments manufacturing; electronic manufacturing services; box & crate packaging; food production; wealth management.
Dato Seri Lee had served as board member of various federal & state government linked companies & corporations; Parliamentary Secretary; Member of Parliament & Municipal Councillor.
He was a practicing lawyer with his own private legal practice from 1987 to 2004, after being called to the Bar of Malaya in 1987 and Bar of England & Wales in 1986.
Dato’ Seri Lee holds a LLB from the Southampton University, UK and a MA from the City University, London.
Dato Seri Lee is a Barrister at Law (Middle Temple) & a Certified Financial Planner.
Company Profile
TBC
Panelist
Siobhan Das
CEO
Panel Discussion: Opportunities & Challenges Arising From the Changing Semiconductor Geopolitical Climate
Day 1 / 09:25 - 09:55
SIOBHAN DAS Chief Executive Officer American Malaysian Chamber of Commerce Siobhan Das joined the American Malaysian Chamber of Commerce (AmCham Malaysia) as its Executive Director in 2016 and was promoted in 2020 to become the organization’s first Chief Executive Officer in its 43 year history. Siobhan has created an action-oriented policy platform at the Chamber that is designed to address both the strategic concerns of American multinational companies and the tactical day-to-day challenges faced by operations on the ground. By working closely with business leaders and various stakeholders in the Malaysian and U.S. governments, Siobhan has been able to represent the membership and ensure that AmCham Malaysia fulfills its role as the Voice of U.S. Businesses in Malaysia. Siobhan spent 11 years in Shanghai, five of which as a director at AmCham Shanghai. Siobhan is a Sloan Fellow from London Business School with a Masters in Leadership and Strategy; she also holds two undergraduate degrees from Boston University in Broadcasting and Film, and English. She enjoys golf and is still reveling in her first hole-in-one (2023)!
Company Profile
The American Malaysian Chamber of Commerce (AMCHAM) was founded in 1978 as an international, non-profit, private-sector business association. It comprises more than 1200 members representing about 290 American, Malaysian, and other international companies. The Chamber is a member of the AmChams of Asia Pacific (AAP) a non-governing association of 27 AmChams in the region that come together to support engagement in the Asia Pacific.
Speaker
Dr. JinYoung Khim
System-level Packaging: Challenges and Solutions
Day 1 / 13:45 - 14:05
The trend of connecting heterogeneous circuits/subsystems and integrating them into a system using packaging technology has been an ongoing effort in many semiconductor applications, including computing, networking, artificial intelligence (AI), mobile and automotive. In the computing, networking and AI domains, technologies such as chiplets have emerged in the market to achieve increased yield in wafer fabrication. In addition, newpackaging solutions like interposer technologies have been actively developed in semiconductor packaging areas, enabling chiplet device integration in packages. In the mobile sector, as the demand for miniaturization, low power consumption and low cost continues to rise, ongoing systemization efforts are centered around processors, memories, and RF front-end devices. At the same time, efforts to pursue high-speed, high-memory capacities are driven by the emerging market demand for AI services. Finally, automobiles are becoming more of an electronic product than a mechanical one withmany built-in electronic components. Today’s vehicles require a variety of electronic products, such as central processing units (CPUs) for data processing, microcontroller units (MCUs) for powertrain control, sensors for comfort and driving convenience, and power modules for driving motors. Some of these components require systemization. However, automotive components operate in a rugged environment and require a high level of reliability for safe driving, so verified technology and platforms should be implemented in system integration. This presentation will review the technical requirements and challenges that arise during the systemization process for each of these applications and discuss potential solutions.
JinYoung, formerly Sr. Vice President, Global R&D Strategy at Amkor Technology. He has more than 23 years’ experience in semiconductor package development and design including Wafer Level, Flip Chip, and MEMS & Sensors. JinYoung has been awarded thirty-five patents and published fifteen papers on advanced packaging technologies at several industry conferences. He holds a Ph.D. in mechanical engineering from Korea Advanced Institute of Science and Technology (KAIST) in Daejeon, Korea.
Company Profile
Speaker
Dr. Yul Koh
Senior Scientist
Piezoelectric MEMS Platform for Sensing and RF Applications
Day 2 / 11:25 - 11:45
In the field of MEMS (Micro-Electro-Mechanical Systems), material innovation drives MEMS process platform development. Over the past decade, MEMS has experienced remarkable growth and the commercialization of RF MEMS devices, primarily due to advancements in AlN/ScAlN film processes. Therefore, to effectively translate innovations in piezoelectric materials into the development of piezoelectric MEMS devices, it is essential to establish a Piezoelectric MEMS process platform capable of implementing the optimized stack and structure required for specific applications. IME is actively developing in the development of Piezoelectric MEMS process platforms and would like to share our progress. In this presentation, we introduce IME’s MEMS platforms and their associated applications:1. Back cavity platform for ultrasonic ranging and imaging2. Piezoelectric Silicon-on-Nothing platform for dense PMUT array (e.g. microfluidics)3. Thin-film ScAlN platform for RF ME
Graduated from the Department of Electrical and Electronic Engineering at Seoul National University in Korea. Following graduation, he embarked on a journey of research at LG Electronics Sensor Solution Lab, where he focused on the developing of MEMS sensor platform and its application in products. Afterward, he assumed his current position at the Institute of Microelectronics in Singapore, where he delved deep into research at the acoustic MEMS device. His expertise spans a wide spectrum, from MEMS devices to sensor solutions, acquired through 15 years of experience in the field. He is currently engaged in various research and development initiatives in the field of piezoelectric micromachined ultrasound transducers and low-power MEMS switches.
Company Profile
Established in 1991, the Institute of Microelectronics (IME) is a research institute under Singapore’s Agency for Science, Technology and Research (A*STAR). In IME, we focus on delivering high impact research and development for the global semiconductor industry. IME’s role is to collaboratively develop and innovate next-generation technologies to enable a dynamic semiconductor ecosystem. Together with our highly skilled talent pool, we develop strategic capabilities and innovative technologies through state-of-the-art infrastructure. IME’s core research areas are in Advanced Packaging, piezoMEMS, SiC, mmWave GaN, and photonics & sensors. We will continue to shape the semiconductor industry’s roadmap for many years to come.
Speaker
Dr. Abderrazzaq Ifis
Engineering Director
Exploring Innovations and Growth in the SEA Semiconductor Industry – Competitive Advantages & Challenges
Day 1 / 15:10 - 15:30
In the semiconductor value chain, ASEAN countries have always played the role of OEM production hubs focusing on cost and mature technologies. Shifting from this role to a technology powerhouse involves a huge leap that requires the creation of a vibrant R&D environment (such as those found in Japan, Taiwan, South Korea and China who have recently achieved). This kind of R&D environment typically involves high capital expenditure, intense technology knowledge and a pool of highly educated talents that usually define the completeness of the whole supply-chain (for instance and it does not only apply for IC Design). On this note, ASEAN countries shall then concentrate their limited resources in covering this all-round industrial chain integrity (from infrastructure to talents). Our suggestion is therefore to focus on not only clustering regional readiness (for instance the infrastructure and the talents) but also on chocking points of the semiconductor value chain.
We, AT&S, believe that ICSubstrates is one of these few vehicles that would create a far reaching impact in Malaysia. As ICSubstrates is an essential element of Advance Packaging (reference More than Moore front-end Vs. Back-end nodes developments). With the technology of AT&S’s high end IC Substrates, it will bridge gap of the semiconductor value chain and to shift Malaysia from OEM producer to a powerhouse of R&D with a focus on high end IC substrate.
In our presentation we will show how by bringing into Malaysia AT&S proprietary technology of high end IC Substrates, we will develop and create high-tech knowledge that can be benefitical for all the surrounding countries, besides developing a more complete ecosystem for Advance packaging in Malaysia. This is what we trust AT&S would bring to Malaysia to enhance its position as a prominent player in semiconductor in ASEAN.
As Engineering Director, Dr. Abderrazzaq Ifis is leading the new AT&S IC-Substrate plant qualification and ramp-up in Kulim. He has over 13 years of engineering experience in developing and manufacturing innovative and high-end technologies and products. Dr. Ifis hold a Ph.D. in Mechanics of Materials and Ing. degree in Processes Engineering from prestigious Moroccan and French institutions. Abderrazzaq and his family have been relocated to Malaysia in 2022, seeking not only career development but also exploring life in a joyful, rich and diversified culture and environment here.
Company Profile
AT&S has chosen Malaysia for its pioneer production site in Southeast Asia. With a planned total investment of €1.7 billion (RM8.5 billion) over the next 6 years, this is by far the largest investment in the corporate history of AT&S. The new campus of AT&S is being built at Kulim Hi-Tech Park, which is approximately 350km north of the capital city, Kuala Lumpur. The ongoing construction work started in November 2021 and the start of series production is tentatively scheduled for the end of 2024.
At AT&S Kulim site, there are 3,000 – 4,000 construction workers performing different tasks at site to deliver the fast track construction progress. This manufacturing facility, once completed, will be responsible for the production of high-end IC substrates for high-performance processors at the location in Southeast Asia. These processors are primarily used in high-performance computers, data centres, gaming, 5G, automotive and Artificial Intelligence (AI).
Speaker
Arjun Kumar Kantimahanti
R&D Engineer
Silicon Photonics and its Challenges
Day 1 / 16:10 - 16:30
Silicon Photonics (SiP) is an upcoming emerging technology that is helping to meet the growing demand of higher bandwidths for Data Centers and AI/ML applications. Just like any other new technology, SiP has its own unique characteristics and challenges. The Industry is working aggressively to resolve these challenges. The potential and key challenges of this SiP technology are discussed in this talk.
Arjun is an R&D Engineer with Broadcom Inc. He is presently working on Silicon Photonics.
Formerly, Arjun was the SVP of Technology Development (TD) and Design Technology (DT) departments at SilTerra Malaysia Sdn Bhd. He has been with SilTerra since 2001 and has been instrumental in setting up various technologies at SilTerra.
He has a total experience of 29 years in Semiconductor Foundry and throughout his career has been working in Technology Development.
He has experience in leading various teams to develop technologies from the start and take them through various phases (such as feasibility, prototyping, qualification, risk release and full production ramp). He has worked on various technology nodes starting from 0.6um through 80nm covering High Voltage, Logic, RF, Mixed Signal, BCD, Flash, MEMS, Silicon Photonics and others.
He also experience in leading the Design Technology group to develop key capabilities such as RF modeling, PDK and library development.
Arjun holds a Master’s degree in Microelectronics from Texas A&M University, USA and a Bachelor’s degree in Electrical and Electronics from Sri Venkateswara University, India.
He has been granted 7 US patents and authored various technical publications.
Company Profile
Broadcom Inc. designs, develops, and markets digital and analog semiconductors. The Company offers wireless RF components, storage adapters, controllers, networking processors, switches, fiber optic modules, motion control encoders, and optical sensors. Broadcom markets its products worldwide.
Panel Moderator
Fouzun Naseer
Director R&D, Technology, Industry
Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology
Day 1 / 14:10 - 14:40
Fouzun Naseer had been involved in semiconductor industry over 30 years with wide ranging experience on assembly, test, packaging, manufacturing systems, quality, reliability, material and supplier management. He was previously at Hitachi Semiconductor and Altera Corporation prior to joining CREST. In his current role, he leads R&D group at CREST, and he is also involved in E&E technology and industry development related to Industry 4.0, IC Design, Smart City and Precision Agriculture. He is often engaged for formulation and advocacy of E&E related eco system and directions for various government agencies.
Company Profile
Collaborative Research in Engineering, Science and Technology (CREST) established in 2012 to catalyst triple helix collaboration between industry, academia and government on E&E technology and ecosystem development. In over 10 years, CREST also undertake talent development initiatives to support E&E industry. Recently, CREST had become an agency under Ministry of Investment, Trade and Industry.
Panelist
Charng Yee Heng
CEO
Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology
Day 1 / 14:10 - 14:40
Heng Charng Yee is the CEO of Globetronics Technology Berhad. For the past 10 years, she led technology roadmap, product developing, quality and efficiency innovation in the organization’s fastest growing optoelectronics segments. Charng Yee held various role in global strategy, regional expansion and operations, digitalization and operation excellence during her tenure in Tyco Fire and Security. She is current the committee member of FREPENCA and FMM as well as the Industrial Advisor for the Faculty of Business and Finance of UTAR ( University Tunku Abdul Rahman).
Company Profile
Globetronics Technology Berhad provides Design, Development and Outsource Semiconductor Assembly and Test services. Product portfolio include highly miniaturised optoelectronics, sensors, IC devices and timing devices for mobile, networking, automotive and emerging medical segments. The company is collaborating with leading technology partners in the areas of wafer level packaging, silicon photonics and wafer level MEMS.
Panel Moderator
Noorazidi Che Azib
Deputy Vice President
Panel Discussion: Empowering the Next Generation of Semiconductor Talent in SEA
Day 1 / 16:35 - 17:15
Noorazidi is currently attached to Inari Technology Sdn. Bhd. (a wholly owned subsidiary of Inari Amertron Berhad) as Deputy Vice President for OTSP (Operation Technology and Strategic Programs) and EHS (Environment, Health and Safety). Possessing a Mechanical Engineering degree from University Of Nevada, Reno, USA, Azidi started his career in the semiconductor related high-volume manufacturing, process engineering, automation system design, Industry 4.0 and environment sectors for the past 30 years with experience working with multinational companies like AMD, Hewlett Packard, Agilent and Avago. Beside transforming Inari into digitalization and cyber-physical-system adoption, Azidi has strong relationship with local academia (secondary and tertiary levels) for the work on developing new industrial-ready talents in the preparedness, exposure and pre-experience prior to joining the industry. Established strong collaborations with government agencies such as MPC, MIMOS, MIDA and MITI for the internal adoptions of advanced technology development and supporting local SME productivity and business developments.
Company Profile
Inari Amertron Berhad is an investment holding company with wholly-owned subsidiaries involved in the Outsourced Semiconductor Assembly and Test (OSAT) & electronics manufacturing (EMS) industries. Products manufactured involved the RF filters module in mobile communications, optoelectronic products segment, sensors and indicators in automotive segment and others. Manufacturing capability includes prost wafer processing operations, surface mount technology, package assembly and full RF and electrical test capabilities.
Speaker
Teng Chow Ooi
Sr Director Program Office
Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging
Day 1 / 13:05 - 13:20
- The anticipated growth of Semiconductor Industry by 2030
- The role of Advanced Packaging to support the scale of Moore’s Law
- Roadmap for advanced packaging for Intel
- How is advanced Packaging factory setup different vs traditional Assembly Test Factory
- Challenges in building a fab in Malaysia
- Collaboration opportunities for vendors and Malaysia to make the industry more effective and level the playing field
- Conclusion
Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology
Day 1 / 14:10 - 14:40
Teng Chow joined Intel Disaggregation Manufacturing Operations in 2021 as the Senior Director of the Program Office. In his role, his is responsible for overlooking the start-up of the Advanced Packaging Factory from design review, hiring, supplier readiness, technology transfer to factory operations.
As an industry veteran, Teng Chow has more than 20 years of various experience including FPGA and ASIC IC design, lead Product Test Development engineering and lead automotive qualification for generations of FPGA products. Teng Chow holds a bachelor’s degree on EE engineering from University of Technology Malaysia.
Company Profile
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.
To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.
Speaker
Herbert Oetzlinger
VP Business Development
Panel Level Packaging Requires the Same Wet Process Performance As Wafer Level Packaging
Day 1 / 17:20 - 17:30
In the landscape of semiconductor manufacturing, the transition to panel level packaging is a significant evolution. Despite the shift in scale and form factor, it’s essential to emphasize that the process performance requirements for panel level packaging remain on par with those of traditional wafer level packaging. The intricate processes involved in wafer-level techniques, such as precise interconnects, material compatibility, and thermal management, must seamlessly adapt to panel level methodologies.
This key message underscores the continuity in the high standards of manufacturing precision and reliability, highlighting that advancements in panel level packaging do not compromise the rigorous process demands established in wafer level packaging. As the industry moves toward larger-scale production formats, acknowledging the equivalency in process performance ensures a seamless and efficient integration of panel level packaging into the broader semiconductor manufacturing ecosystem.
Herbert Oetzlinger , graduated HTL Braunau 1987 in high power electronics/ electrotechnics,
Herbert worked in the Semiconductor industry for 30+ years, focused on wet processing .
Special focus on advanced packaging in electroplating and wet etching/cleaning of wafers and substrates. For many years he was VP of Sales with Semitool Inc, where he excelled with his in-depth knowledge of process and hardware. During this time, Herbert worked with many worldwide leading companies on Fan-out, E-WLB and other new developments in wafer level advanced packaging.
In 2012, he founded Semsysco GmbH and is also heading the company as CEO.
Semsysco is a world leader in high speed electrochemical deposition with a pedigree and expertise in all-around wet processing for wafer and panel level.
Company Profile
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Panelist
Dato’ Seri Siew Hai Wong
President
Panel Discussion: Opportunities & Challenges Arising From the Changing Semiconductor Geopolitical Climate
Day 1 / 09:25 - 09:55
Dato’ Seri Wong Siew Hai has 29 years of working experience in the electronics industry. He served Intel for most of his illustrious career and retired from Intel after 27 years of service. His last position with Intel was Vice President of Technology and Manufacturing Group (TMG) and General Manager of Assembly and Test Manufacturing (ATM), responsible for all assembly test factories worldwide. He also served as the Vice President and Managing Director of Dell’s Asia Pacific Customer Centre for approximately 2 years. Currently, Dato’ Seri Wong is involved in the electronics industry as Champion of the E&E Productivity Nexus (EEPN) and President of the newly formed Malaysia Semiconductor Industry Association (MSIA).
Company Profile
Panelist
Sivasuriyamoorthy Sundara Raja
Deputy CEO, Investment Promotion and Facilitation
Panel Discussion: Opportunities & Challenges Arising From the Changing Semiconductor Geopolitical Climate
Day 1 / 09:25 - 09:55
A Business Administration graduate from the University of Malaya, Sivasuriyamoorthy Sundara Raja joined Malaysian Investment Development Authority (MIDA) in 1989 as an Assistant Director in the Food, Beverages and Chemical Division. Over the last 33 years he had served in the Strategic Planning and Policy Advocacy Division, Investment Promotion Division and Incentive Coordination and Collaboration Office (ICCO). Mr.Siva was posted to Germany twice to head MIDA’s office in Cologne (2006-2009) and Frankfurt (2013-2017). He was responsible to move MIDA’s office from Cologne to Frankfurt and to establish MIDA’s second office in Germany in Munich. As an overseas Director in Germany, Mr.Siva was responsible to attract foreign direct investments from Germany and the Benelux countries, namely Belgium, the Netherlands and Luxembourg. Throughout most of his 33 years career with MIDA, Mr.Siva was involved in various projects on Malaysia’s industrial development, such as the 2nd and 3rd Industrial Master Plans (IMP), 8th-10th Malaysia Plans, equity liberalisation of the manufacturing sector, formulation of investment incentives and policies, and empowerment of MIDA. Mr.Siva was also responsible for the coordination of the Study on Exit Strategy for Foreign Labour Intensive Industries, formulation of policies and guidelines for the establishment of Domestic Investment Strategic Fund (DISF) to accelerate the shift of Malaysian-owned companies in high technology industries, as well as the establishment of One Stop Centre and Business Travellers Centre for Short Term Business Travellers during COVID 19 Pandemic. Mr.Siva was promoted as the Executive Director (Investment Promotion) on 1st November 2018 and moved to his current position as the Deputy Chief Executive Officer (Investment Promotion & Facilitation) effective 1st May 2021.
Company Profile
MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 21 overseas offices. MIDA continues to be the strategic partner to businesses in seizing the opportunities arising from the technology revolution of this era.
Speaker
Thiagesh K Lingam
Senior Director
MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia
Day 1 / 13:25 - 13:40
Malaysia’s electrical and electronics (E&E) industry, particularly the semiconductor segment, is a vital contributor to exports but lags in its GDP share (6.85%) due to limited high-value activities. The global E&E industry is poised for 6-8% annual growth until 2030, driven by electric vehicles, renewable energy, AI, and smart devices. Malaysia should establish a visionary plan for the E&E sector, aiming for 2-3x GDP growth in the next two decades. This can be achieved by boosting local content, exploring adjacencies like chip design, and emphasizing value-added activities. To succeed, the focus should be on domestic capacity building in areas like design, R&D, and brand ownership, supported by industrial policies, strategic foreign investments, R&D funding, and institutional support. Coordination and policy interventions are crucial to creating an ecosystem conducive to E&E sector growth. In summary, Malaysia needs a long-term vision for the E&E sector emphasizing local content, value addition, and capacity building, supported by coordinated policies and investments
Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology
Day 1 / 14:10 - 14:40
Thiagesh K Lingam is the Senior Director for Industrial Development and Technology Transfer at MIMOS Berhad. He plays a crucial role in engaging the Electrical and Electronics industry in Malaysia and globally. His focus is on facilitating technical and commercial interactions to enhance the industry’s competitiveness. With degrees in Electrical and Electronics Engineering and Materials Engineering from the University of Sunderland, UK, and a Lead Auditor qualification, he brings a strong educational background. Over his 25-year career, Mr. Lingam excelled in IC Design, wafer fabrication, Analytical Services, Product Reliability, Embedded Technology, and Rapid Prototyping, working at Chartered Semiconductor and Hitachi Nippon Steel. His proactive, strategic, and problem-solving skills make him a standout leader in the field.
Company Profile
MIMOS is a leading innovation center in Semiconductors, Microelectronics, and ICT technologies, operating under Malaysia’s Ministry of Science, Technology, and Innovation (MOSTI). It plays a pivotal role in Malaysia’s socio-economic advancement by developing patentable technology platforms, products, and solutions. With over 1,300 filed patents, MIMOS contributes to Malaysia’s international digital transformation efforts and rebranded as MIMOS Global in 2022. The organization focuses on research excellence in Semiconductor & Thin Film Research, Embedded Microelectronics, Manufacturing, and Smart Nation technologies. MIMOS collaborates with strategic partners, explores new opportunities, nurtures technology ventures, and prioritizes innovation, trust, and high performance.
Speaker
Jerome Teysseyre
VP Package Development & Engineering
Intelligent Power and Sensing Packaging Solutions for a Sustainable Future
Day 2 / 14:50 - 15:10
Vehicle electrification, autonomous driving, renewable energy and big data are enabling unprecedent changes in human life, and are pushing the technology to new limits. Those major evolutions require power electronics and sensing solutions, driven by optimum technology and packaging solutions to deliver maximum product efficiency.
This talk will review recent progress in front end technology , packaging (discrete, power modules) and highlight the importance of system integration.
It will illustrate the challenges of simultaneously meeting a wide range of power density, product scalability , cost and reliability requirements, and are made possible by the ongoing progress in semiconductor research, engineering and manufacturing.
Jerome is having 25 years of experience in Package development and engineering.
His career started in Europe with the introduction of BGA , System in Package, embedding and optical camera sensors. Soon after Jerome moved to Singapore to develop southeast Asia packaging center of excellence focusing on next generation wafer level packaging introduction such as E-WLB (fan out).
Jerome transitioned in 2014 to onsemi and power electronics. Jerome’s team are focusing on the development and release to production of differentiated automotive package portfolio and solutions for wide band gap.
Company Profile
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Speaker
Ayman Ahmed
CEO
SingleDieTM MEMS-Based SAW MEMS on CMOS Reference Clock for Automotive and Industrial Applications
Day 2 / 11:50 - 12:10
With no doubt, we are all witnessing the digitization of all aspects of our life promising formidable devices and business opportunities. The automotive industry’s push for autonomous driving and electrification is challenging suppliers and designers. Automotive requirements are very demanding not only on reliability but also performance under harsh environments and across wide temperature ranges. Modern cars have more than 50 timing devices needing a stable reference clock. Classically these clocks were based on Quartz crystals yet such traditional solutions face many performance challenges. Pearl Semiconductor SingleDie™ technology uses an innovative MEMS based solution integrating the resonator on the CMOS die forming a true one-stop shop for a reference clock that can withstand tough and demanding automotive requirements such as temperature and mechanical vibration. This breakthrough technology will pave the way to the first reference clock and timing chiplet solution opening unprecedented levels of integration and security.
With a genuine passion for entrepreneurship, Ayman accumulated +28 years of engineering and managerial experience in the semiconductor industry. As one of the co-founders of Si-Ware Systems in 2004, he assumed several roles including VP of ASIC Engineering and VP of ASIC Marketing & Business Development before starting the Timing BU and then spun it out as Pearl Semiconductor in 2020. Ayman has notable contributions in the Timing industry such as leading the MEMS-Based Programmable Clock Generator Development program for Discera (Microchip) and a CMOS only LC-Based Self-Compensated Oscillator (SCO). Ayman holds 10 patents and received his B.Sc. and M.Sc. degrees in electronics and communication engineering from Ain-Shams University, Cairo, Egypt in 1994 and 2002 respectively.
Company Profile
Coming soon…
Speaker
YAB Chow Kon Yeow
Chief Minister of Penang
Opening Address
Day 1 / 09:05 - 09:20
Mr. Chow Kon Yeow is Penang’s fifth Chief Minister. He assumed the State’s top leadership role after Pakatan Harapan’s thumping victory in Malaysia’s 14th General Elections in May 2018. He has also been a Penang State Executive Councilor since 2008.
Born in November 1958, Mr. Chow holds a Bachelor’s degree in Social Sciences (Honours) from the University of Science, Malaysia (USM). He is married to Madam Tan Lean Kee and blessed with two children.
Mr. Chow started out as a journalist before becoming the political secretary of DAP’s former Secretary-General and Member of Parliament for Tanjong, YB Lim Kit Siang from October 1986 to 1990. After winning the Pengkalan Kota state seat in 1990, he became Member of Parliament for Tanjong in 1999. He defended Tanjong for another two terms (2004 and 2008). The 2008 elections, which ushered in the new DAP administration under the then Pakatan Rakyat, also saw him winning the Padang Kota state seat and his appointment as the State Executive Councilor overseeing the Local Government and Traffic Management portfolios.
DAP’s continued triumph in the 2013 elections saw Mr. Chow retaining his Padang Kota constituency. He continued to serve as the State Executive Councilor with Flood Mitigation added to his existing portfolios.
In the historic 14th General Elections, Mr. Chow successfully defended his Padang Kota state seat and won the Tanjong parliamentary seat. He has been the DAP Penang State Chairman since 2000 and DAP National Vice-Chairman since 2004.
In a recent interview after his swearing-in, the fifth Chief Minister of Penang reiterated his administration’s commitment to ensure delivery of three mega projects, namely the Penang Transport Master Plan, flood mitigation and affordable housing. Undaunted by the higher expectations, he takes this as a challenge to serve Penangites and find ways to make this state, a better home for all.
Besides that, Mr. Chow also aims to transform Penang into ‘A Family-Focused Green and Smart State that Inspires the Nation’ with the Penang2030 Vision and this is the current focus of the State Government.
Company Profile
Panelist
ET Tan
CEO
Panel Discussion: Empowering the Next Generation of Semiconductor Talent in SEA
Day 1 / 16:35 - 17:15
Currently CEO of PSDC, Mr Tan has over 30 years’ experience in R&D and product development at Hewlett-Packard in the UK, HP Labs and Seagate Technology in Silicon Valley. He has mentored tech and social enterprise startups and led his own optics startup Singapore. He returned to Malaysia in 2014 through TalentCorp to lead a top business school in Selangor and later joined SilTerra as VP Strategic Management to nurture Malaysia’s own semicon fab into life-sciences, photonics and advanced sensors. He holds a BSc(Hons) from Imperial College London, and MBA from Cranfield School of Management, UK. His passion is to leverage his Silicon Valley experience to help build stronger businesses in Malaysia.
Company Profile
PSDC (Penang Skills Development Centre) was established in 1989 and is the first tripartite, industry-led skills training and education centre in Malaysia. Over a period of 33 years, the Centre has trained over 250,000 participants through more than 13,000 courses; pioneered local industry development initiatives; assisted in the input and formulation of national policies pertaining to human capital development and contributed directly to the Malaysian workforce transformation initiatives. Today, PSDC is recognised as a premier TVET training centre by government and industry alike, locally and abroad, in its role in talent development, skills training and nurturing innovation.
Speaker
Eloi Marigo, Ph.D.
Senior Manager
More than Moore Emerging Technologies for the Sensing Needs in EV
Day 2 / 11:00 - 11:20
EV, IoT and industry 4.0 open new market opportunities in the semiconductor field. The potential is high but so are the expectations to quickly fulfil the stringent specifications and requirements for tomorrow’s products. The customer focus is shifting into embedding more and more capabilities into their devices in order to develop smart products. Several challenges must be faced in each of the stages of the MEMS and sensors development: from the conceptual design employing unconventional materials and unique processes to the characterization and reliability assessment of complex structures. In this talk we will provide an overview to the journey from a conventional pure-play CMOS foundry to become a reference partner in more than Moore technologies with special emphasis into MEMS, sensors and its monolithic integration with CMOS devices.
ELOI MARIGO was born in Barcelona, Spain, in 1985. He received the degree in Engineer Telecommunications, a Master in Micro and Nanoelectronics and a Ph.D. degree in electrical engineering from Universitat Autònoma de Barcelona, Bellaterra, Spain, in 2008, 2009 and 2012 respectively. In 2013, he joined the Department of Technology Development, Silterra Malaysia Sdn. Bhd., as a Senior Engineer, and in 2024 he became a Senior Manager. His current research interests include the design, simulation, fabrication and characterization of monolithic CMOS-MEMS with special focus on piezoelectric devices.
Company Profile
SilTerra, a pure-play wafer foundry, offers various CMOS technologies from 180nm to 110nm nodes. It serves a wide range of end-market applications, including IoT, power management, consumer electronics, medical and communication products. Besides CMOS technologies, SilTerra also provides MEMS foundry services, unique and patented MEMS-on-CMOS technologies, silicon photonics, bio-photonics, and power. Its excellent customer service team helps customers realize working prototypes from proof of concept to high volume manufacturing.
Panelist
Wee Seng Ang
Executive Director
Panel Discussion: Opportunities & Challenges Arising From the Changing Semiconductor Geopolitical Climate
Day 1 / 09:25 - 09:55
With over two decades of experience in the semiconductor industry—ranging from fab start-ups and technology development to manufacturing and executive leadership—Wee Seng now helms the Singapore Semiconductor Industry Association (SSIA), where he drives talent development, business growth, and sustainable practices. He also serves on multiple advisory committees, including Singapore Polytechnic’s School of Electrical and Electronic Engineering, NTU’s School of Materials Science and Engineering, Industrial Transformation Asia-Pacific (ITAP), and Enterprise Singapore’s Smart Manufacturing and Environment & Resources Standards Technical Committees. Beyond the industry, Wee Seng is deeply committed to community outreach as a District Councillor with North East CDC. He holds a Bachelor’s degree in Electrical and Electronics Engineering from Nanyang Technological University and a Master of Science in Management of Technology from the National University of Singapore.
Company Profile
Singapore Semiconductor Industry Association (SSIA) is the voice of Singapore’s semiconductor industry and is committed to support this important sector in Singapore in order to facilitate substantial growth of the whole semiconductor economy of the country. SSIA brings together industry players, academia, and government agencies. Major activities focus on industry and talent outreach and continuing education, as well as to collectively address industry needs. SSIA is a platform for members to reach out to new business opportunities, industry alliances, and partners. It provides networking and relationship opportunities beyond the boundaries of Singapore. SSIA members today include companies and organizations throughout all parts of the complex and comprehensive value chain – IC design companies, Manufacturers, Fabless companies, Equipment suppliers, Photovoltaic and LED companies, EDA and material suppliers. Training and service providers, IP companies, Research institutes and Academia, as well as individual members.
Speaker
Francesco Muggeri
VP Marketing & Applications, Power Discrete & Analog, China, STMicroelectronics
Innovative Power Solutions in Industrial Applications driving towards Carbon Neutrality and Greener Future
Day 2 / 14:00 - 14:20
The world is confronting extraordinary challenges, and the preservation of our planet is no longer a choice, but a necessity. The semiconductors ecosystem emerges as a trailblazer, propelling rapid innovations. In this presentation, Mr. Muggeri will share the unwavering commitment of ST on sustainability, and how ST actively fosters sustainability by spearheading the production of renewable energies, amplifying power efficiency with the cutting-edge diffused intelligence (Digitalization) and pioneering Energy and Power Conversion. He will also discuss the new technologies like Silicon Carbide (SiC) and Gallium Nitride (GaN) contribute to better power efficiency and more intelligent solutions for energy usage.
Francesco Muggeri is Vice President for Power Discrete and Analog Products, China at STMicroelectronics. In his role, Muggeri leads ST’s Industrial Focused Competence Centers including the Motor Control Competence Center, Power & Energy Competence Center and Automation Competence Center in Asia and is appointed as the Global Leader of ST Industrial Power and Energy Segment in July 2024.
Muggeri joined ST in 1995, as a designer for automotive sensors in Italy. In 2000, he moved to product marketing for power transistors before relocating to Shanghai as marketing manager for transistors in 2002. In 2008, Muggeri moved to Commercial Marketing for STMicroelectronics’ Asia Pacific operations in Hong Kong. He became director for Discrete and Analog Products in 2017 and added Marketing Communications to his mandate in 2018.
Francesco Muggeri was born in Zambrone, Italy in 1969 and graduated with a Master’s degree in Electronic Engineering from the University of Pisa, Italy. In 2014, he received an EMBA degree from the Global Asia Program, organized by the London Business School of London, Columbia University of New York, and the University of Hong Kong. In recognition of his contribution to the electronics industry, Muggeri was awarded the 2023 Asia Executive of the Year by EETimes and EDN from Aspencore.
Company Profile
At ST, we are more than 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Panelist
Thomas Mathew
Group Chief Executive Officer
Panel Discussion: Empowering the Next Generation of Semiconductor Talent in SEA
Day 1 / 16:35 - 17:15
Thomas brings with him more than 30 years of experience in corporate management, business strategy, and risk management. Reflecting on his 2.5 years to date with TalentCorp, he firmly believes that individuals with corporate experience should actively serve in the public sector. He appreciates the unique perspective such individuals can bring and recognizes the importance of bridging the gap between the private and public sectors.
Company Profile
Talent Corporation Malaysia Berhad (TalentCorp) is a Ministry of Human Resources agency that drives Malaysia’s talent strategy towards becoming a dynamic talent hub. To support the growth and well-being of all Malaysians, we partner with the public and private sectors on initiatives that attract, nurture, and retain the right expertise needed to meet current and future talent demands.
Panelist
Prof. Ir. Dr. Rizalafande Che Ismail
Deputy Vice Chancellor, Research & Innovation
Panel Discussion: Empowering the Next Generation of Semiconductor Talent in SEA
Day 1 / 16:35 - 17:15
Prof. Ir. Dr. Rizalafande Che Ismail is currently a Professor at Faculty of Electronic Engineering Technology, Universiti Malaysia Perlis. His research interests include VLSI Circuit and System, Computer Arithmetic Algorithms, Low Power and High Speed System, FPGA Design, Digital Signal Processing, Image & Video Processing.
Company Profile
Universiti Malaysia Perlis (UniMAP) is one of the public university in which focuses in engineering and technology programmes in various fields. The niche area of university is on Electronics Engineering in which related to Semiconductors Technology. The lab facilities are well equipped with industrial standards approach including teaching cleanroom for semiconductor fabrication process. In addition, there are also several industrial labs sponsored by the MNCs and local partners available in the university. The highly percentage of graduate employability in which about 98% after 6 months graduation, shown that the UniMAP vision and mission is in line and relevant with industrial needs.
Speaker
YT Chin
Senior Director, Flash Backend Engineering
Western Digital’s Semiconductor Odyssey: Charting a Course for Innovation and Business Growth
Day 1 / 14:45 - 15:05
The semiconductor industry in Southeast Asia (SEA) has undergone significant expansion in recent years, establishing itself as a prominent player in the global tech arena. With the continued surge in demand for semiconductors, SEA stands poised to maintain its pivotal role in this ever-evolving industry. This presentation offers an insightful exploration of Western Digital’s remarkable journey, beginning as a start-up with vertically integrated Solid State Drives (SSD) manufacturing facilities, and charts the course it envisions for future advancements in manufacturing excellence.
Furthermore, this presentation delves into Western Digital’s pioneering efforts in harnessing Industry 4.0 capabilities, marked by automation and data analytics, solidifying its status as the inaugural World Economic Forum’s Lighthouse factory in the region. It underscores the paramount importance of innovation within Western Digital’s growth strategy, and addresses the challenges it encounters on this transformative path.
A forward looking approach extends beyond traditional manufacturing embracing a holistic vision that encompasses capabilities in the area of product design and advanced packaging. This presentation underscores the company’s commitment to nurturing talent and resources to ensure a sustainable future in a rapidly evolving industry landscape.
Dr. YT Chin is a seasoned executive leading Western Digital SSD Operations in Batu Kawan, Penang. With 27 years of experience in Manufacturing and R&D, specializing in Advanced Packaging, Package Development, and Operations in the semiconductor industry, he is recognized for his expertise. Dr. Chin’s passion for advancing manufacturing in the Industry Revolution 4.0 era earned him the prestigious WEF Global Lighthouse award. He is a Chartered Engineer and Chartered Scientist, known for successfully delivering complex technical programs in advanced packaging. As a speaker, Dr. YT Chin brings valuable insights into advanced packaging, manufacturing, and the transformative potential of Industry Revolution 4.0. YT Chin holds the titles of Chartered Engineer, Chartered Scientist and a Fellow of IOM3 (uk).
Company Profile
Western Digital Corporation is an American data storage company renowned for its innovative solutions. With a wide range of products including hard drives, solid-state drives, and data center solutions, Western Digital prioritizes data security and protection, consistently pushing the boundaries of storage technology to meet evolving customer needs.
Speaker
Sascha Dern
Director of Product Line
Wolfspeed’s SiC Optimized Power Module Approach
Day 2 / 14:25 - 14:45
Wolfspeed’s founders were the first to successfully commercialize Silicon Carbide, and for more than 35 years have focused on designing and supplying the industry’s highest-performing Silicon Carbide and GaN-on-Silicon-Carbide materials and devices for high-power applications.
In 2015 Wolfspeed acquired Arkansas Power Electronics International Inc. (APEI), which specialized with approx. 50 employees in wide-bandgap advanced and high-performance power modules for a variety of customers and applications, including the defense, aerospace and automotive markets. Since its foundation in 1997, APEI created more than 100 patents and developed a broad power module portfolio above 10,000V and 1,000A.
The acquisition combined two experts with complementary skills to define the ideal combination of device and packaging technology to set the industry standard for power modules.
Today, Wolfspeed’s Power Module Business Unit with almost 150 people globally is developing and offering Silicon Carbide optimized power modules for mainly I&E, automotive and MV/HV applications.
Sascha Dern is Director of Product Line of Wolfspeed in Fayetteville, AR, USA, where he is overseeing the global overmolded power module business. Born in Berlin, Germany, Sascha studied Electrical Engineering at the Technical University in Darmstadt and received his Dipl.-Ing. degree in 1998. He started his career at Texas Instruments when he joined the European Graduate Program with three assignments across Europe. Before joining Wolfspeed in 2021, he held various positions in Europe and in the USA at TI, EM Microelectronic Marin, Sensortechnics, Lantiq and Infineon.
Company Profile
Wolfspeed (NYSE: WOLF) leads the market in the worldwide adoption of Silicon Carbide and GaN technologies. We provide industry-leading solutions for efficient energy consumption and a sustainable future. Wolfspeed’s product families include Silicon Carbide materials, power-switching devices and RF devices targeted for various applications such as electric vehicles, fast charging, 5G, renewable energy and storage, and aerospace and defense. We unleash the power of possibilities through hard work, collaboration and a passion for innovation. Learn more at www.wolfspeed.com.
Wolfspeed® is a registered trademark of Wolfspeed, Inc.
Speaker
Jovin Li
Technical Marketing Director
Progress of Wafer Level Advanced Packaging Technology for MEMS and Sensor Integration
Day 2 / 12:15 - 12:35
The development of the semiconductor industry in the new era has appeared new characteristics. On the one hand, it is still developing in the direction of continuing Moore’s Law, and the technology node is in the 3nm era; on the other hand, it is developing in the direction of beyond Moore’s Law, and advanced packaging has significant impact on it. In the past two decades, advanced packaging technology has developed rapidly in the direction of system integration, high-speed, high-frequency, three-dimensional and fine pitch interconnections. As wafer-level advanced packaging can achieve system miniaturization and high performance, the advanced microsystem integration technology with wafer-level advanced packaging as the core is gradually developed.
- The report focuses on the latest progress of advanced packaging in the new era,；
- discusses Through Si Via (TSV), Fan-Out packaging (WL-FO) and Through Glass Via (TGV) wafer-level packaging technology will be widely used in MEMS and EV fields；
- then further discusses the development path and trend from advanced packaging to advanced microsystem integration.
Graduated from HUAZHONG University OF Science and Technology Electronics Department in 2006, then successively engaged in customer technical support and marketing work in China Resources Shanghua and Kunshan Huatian. With more than 15 years of working experience in semiconductor industry，I have clear understanding of wafer manufacturing, packaging , testing and module industry. As Moore’s law slows down and the perspective of the upstream and downstream of the semiconductor industry chain, the advanced packaging plays an increasingly important role and has huge potential for future development. Based on this, I worked with Dr. Yu Daquan to establish Xiamen Sky-Semi Semiconductor in 2018 and now I am responsible for the marketing work in Sky-Semi Semiconductor.
Company Profile
Founded in July 2018, Xiamen Sky-semi commits to the development and industrialization of advanced packaging and system integration technology for high-speed and high-frequency communication applications. Through independent R&D and collaborative innovation, we provide customers with integrated solutions and services from collaborative product design, process research and development to mass production.
The main business of Xiamen Sky-semi includes Wafer Level 3D Package (WLP), Fan Out Package (FO), System in Package (SIP) and Module, IPD device manufacturing, High Density Glass Through Via (TGV) technology, manufacturing of high precision antenna ,etc. We have provided design, packaging and integration services for nearly 100 customers at home and abroad。Sky-semi has a core team with outstanding innovation ability that has broken through a series of core and key technologies and has full range of wafer level system packaging as well as precision manufacturing capabilities from 4 inch, 6 inch, 8 inch to 12 inch.
Sky-semi Semiconductor based on technological innovation embarking on seize the historical opportunity to achieve leapfrog development in the new era of global semiconductor industry competition pattern by adhere to customer-centered ，Innovative and progressing philosophy，5G application as a breakthrough.
Speaker
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Global Vehicle Electrification Trends and BEV Opportunities in the Developing World
Day 2 / 09:30 - 09:50
Vehicle electrification is a set trend, led by developed countries and China, for the coming decades. Globally, Yole forecast (Q1 2023) a combined growth of ~1.2% in the period between 2022 to 2028, which the total light duty vehicle drops ~3% meanwhile. BEV definitely leads the growth with ~16% increase, far advancing the total market.
This change of powertrain landscape is reshaping the supply chain with several ongoing features highly relevant to the power electronics community, which are to be full explained in the presentation: Auto OEMs are turning more to in-house development and production: high voltage system integration is growing in various directions; power electronics demonstrate strong resilience towards current Si cycles; wide band gap materials are going through incubation to mainstream.
Opposite to common understanding, Yole is seeing huge opportunities of BEV development in developing countries, although the current penetration is low. Strategies, including financial promotion in both BEV supply chain and charging infrastructure, leveraging existing BEV supply chain, right positioning BEV models for local needs, and 2-wheeler early adoption, etc. can be applied by official and private investment in some developing countries, like India, Malaysia, Indonesia, Thailand, Vietnam, Turkey, etc.
Yik Yee Tan, PhD is Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group.
Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market products and is engaged in dedicated custom projects.
Prior to Yole Group, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects.
She authored more than 30 papers and wrote 3 patents related to semiconductor packaging technologies.
Yik Yee Tan holds a PhD in Engineering from Multimedia University (MMU, Malaysia).
Company Profile
Yole Group is an international company recognized for its expertise in the analysis of markets, technological developments, and supply chains, as well as the strategy of key players in the semiconductor, photonics, and electronics sectors.
With Yole Intelligence, Yole SystemPlus and Piséo, the group publishes market, technology, performance, reverse engineering and costing analyses and provides consulting services in strategic marketing and technology analysis. The Yole Group Finance division also offers due diligence assistance and supports companies with mergers and acquisitions.
Yole Group benefits from an international sales network. The company now employs more than 180+ people.
More information on www.yolegroup.com.
Company phone:
+33 472 83 01 80
Panel Moderator
Kamel Ait Mahiout
President
Panel Discussion: Opportunities & Challenges Arising From the Changing Semiconductor Geopolitical Climate
Day 1 / 09:25 - 09:55
Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.
Company Profile
Speaker
Salah Nasri
CEO & Co-Founder
Welcome Speech
Day 1 / 08:40 - 09:00
Salah Nasri is the CEO & Co-Founder of the International Semiconductor Executive Summits (ISES), a division of the International Semiconductor Industry Group Ltd. an influential organization within the semiconductor industry. With extensive experience in the sector, Nasri has played a pivotal role in fostering global collaboration among semiconductor leaders. Under his leadership, ISES has become a premier platform for industry executives to connect, share insights, and drive innovation across various regions including the United States, Europe, Asia, and the Middle East.
Salah Nasri has been instrumental in expanding the reach and impact of ISES, organizing significant events that bring together decision-makers from across the semiconductor ecosystem. These events provide opportunities for networking, collaboration, and the exchange of ideas crucial for advancing the industry in areas such as semiconductor manufacturing, MEMS, AI, automotive electronics, and more.
His leadership has not only enhanced the visibility of ISES globally but also strengthened partnerships with key industry players, ensuring that ISES remains at the forefront of semiconductor innovation and development. Salah Nasri has previously worked at Goldman Sachs’s, Credit Suisse and International Business Development Group. Salah Nasri graduated from Oxford University and Loughborough University in International Relations and Economics. In 2024, Salah Nasri became a Stanford University Alumni after completing the Stanford Executive Program.
Company Profile
Established in 2010, the International Semiconductor Industry Group (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today!
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