Platinum
Amkor Technology, Inc.
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Platinum
KLA
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
Silver
Evatec
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
Silver
TRUMPF Huettinger
通快霍廷格电子有限公司成立于1922年，总部设于德国弗莱堡，是世界领先的等离子体电源制造商，产品主要用于：半导体，显示器和太阳能领域，以及光学镀膜，装饰镀膜，工业镀膜，大面积玻璃镀膜等行业的等离子体应用，于1990年正式加入通快集团。通快霍廷格电子致力于开发、制造用于各种沉积和干法刻蚀工艺的等离子电源，在电源领域拥有一百多年的经验积累，在欧洲、美洲和亚洲分别设有销售和服务子公司和分支机构。
2006年，通快霍廷格电子中国成立，至今已经深耕中国市场19年。如今，通快霍廷格在中国设有亚太区应用中心、维修中心、电源及匹配器生产中心，为客户提供所有生产过程中的优质服务。2023年，通快霍廷格中国新工厂在太仓建成开业，这是通快霍廷格继德国、波兰之后布局的全球第三家生产制造基地。
TRUMPF Huettinger is a high-tech company and a leading global manufacturer of DC, medium-frequency, high-frequency and semiconductor-based solid-state microwave generators.
The business units include plasma technology, industrial heating, battery inverter systems as well as microwave generators and amplifiers. These process power supplies are being used in many key processes in research, development and production. As a part of TRUMPF – technology leader of industrial lasers and machine tools – TRUMPF Electronics is headquartered in Freiburg/Germany and has sales and service branches in Europe, US and Asia providing a global IoT based service support.
Products & Services
Product introduction:
1. TruPlasma DC 4000 (G2) Series
TruPlasma DC 4000 (G2) 系列专为金属，金属氧化物，绝缘材料的反应直流溅射而开发。电源以直流脉冲的形式输出，在高要求的膜层质量和大产能的PVD 和PECVD 工艺中证明了它的优势。
The TruPlasma DC Series 4000 (G2) combines the excellent arc handling of TRUMPF Hüttinger with the advantages of DC pulse technology. This means you gain improved coating results with fewer defects, along with a higher deposition rate. The results are brilliant surfaces and a high level of production power.
2. TruPlasma DC 3000 (G2) Series
TruPlasma DC 3000 (G2) 系列适合众多直流溅射工艺，得益于先进的电弧管理和集成水冷装置，该款直流电源同样可用作脉冲式直流电源的高性价比替代方案。此外，极其紧凑的结构使其方便集成至现有应用中。
The TruPlasma DC Series 3000 (G2) is suited to numerous DC sputtering processes. The DC generators also make an interesting cost-effective alternative to pulsed DC generators due to their progressive arc management and the integrated water cooling. The very compact design also enables simple integration into existing applications.
3. TruPlasma RF 1000/3000 (G2/13) Series
全新一代的射频电源TruPlasma RF 1000 / 3000 (G2/13.56M) 系列，对工艺过程中的所有参数进行实时监测，即使在要求严苛的等离子体工艺中，仍能确保可靠供电。其稳定的输出功率和高精度控制确保高效高生产效率的同时，实现最佳工艺效果。
The TruPlasma RF Series 1000 / 3000 (G2/13) are the latest generation of RF generators. Due to innovative functions such as the patented CombineLine coupling technology or real-time measurement of all process parameters, reliable power supply even in demanding plasma processes is guaranteed – the optimal conditions for reproducible results and high productivity.
4. TruPlasma LF Series
TruPlasma LF 1000 系列电源基于创新的平台概念, 频率范围有350k，400k，2M，功率范围1~10kw，适用于各类半导体，光伏，ALD，刻蚀等离子应用。
TruPlasma LF 1000 series are based on an innovative platform concept with frequency ranges of 350k, 400k, 2M and power ranges from 1 to 10kw for all types of semiconductors, photovoltaic, ALD, and etch plasma applications.
5. TruPlasma VHF 3000 series
TruPlasma VHF 3000 系列电源基于创新的平台概念, 频率覆盖27M；40M；60M。功率范围1~10kw。可满足极为苛刻的生产要求。VHF 电源的纯水冷模块化结构与极高的功率密度设计可以确保大功率输出下的稳定性。
TruPlasma VHF 3000 series power supply is based on an innovative platform concept covering frequencies of 27M, 40M, 60M, and power ranges of 1~10kw to meet the most demanding production requirements. the VHF power supply’s pure water-cooled modular construction and extremely high power density design ensure stability at high power outputs.
Bronze
ERS electronic GmbH
ERS electronic GmbH, located near Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process. ERS’s headquarter, sales department, engineering center and production facilities are in Germany, and they also have sales, demo centers and support offices in the US, China and Taiwan.
Phone: +49 898941320
Email: info@ers-gmbh.de
Website: www.ers-gmbh.com
Products & Services
ERS electronic GmbH has gained an outstanding reputation in the industry, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, ERS’s renowned thermal chuck system AC3 Fusion with add-on technologies like High Thermal Uniformity, Anti-magnetic and High Voltage/Current are integral components in most wafer probers across the semiconductor industry.
Leveraging its decades of thermal management experience, ERS launched the first ever Thermal Debonding and Warpage Adjustment tool for Fan-out Wafer- and Panel-level Packaging applications in 2008. Since then, the company has contributed to driving innovation in the Advanced Packaging space, by supporting different wafer formats and panels. The company’s most recent innovations include the Wave3000, a warpage inspection tool that enables the measurement and analysis of warped wafers composed of different materials in less than 1 minute. In 2024, ERS also introduced its series of semi-automatic and fully-automatic PhotoThermal debonding machines, offering a breakthrough solution for TBDB processes. This innovative method minimizes operational costs while ensuring high throughput and exceptional process flexibility, regardless of adhesive material type or supplier. By lowering operational costs by more than 30% compared to laser debonding and enhancing efficiency, this technology is well-suited for applications involving AI chips, power ICs, GPUs, and high-bandwidth memory (HBM).
Bronze
Lam Research Corporation
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
Products & Services
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Bronze
mks | Atotech
Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com
Bronze
Nordson Electronic Solutions
Bronze
Suzhou Semitop Semiconductor Co., Ltd.
Networker
JSR Corporation
JSR Corporation is a multinational company employing more than 9,000 people worldwide and a leading materials supplier in a variety of technology driven markets, driving materials innovation and creating value through materials to enrich society, people and the environment. JSR’s global network is headquartered in Tokyo (Japan) and has factories and offices in Europe, USA, China, Taiwan, Korea, and Thailand. JSR is a research-oriented organization that pursues close collaborations with leading innovators in a number of industries that are a key to the present and future welfare of human society: life-sciences, synthetic rubbers, electronic materials, display and optical materials.
For more information about JSR Corporation, please visit https://www.jsr.co.jp/jsr_e/.
Networker
Nordson TEST & INSPECTION
Nordson Test & Inspection offers its SMT & Semiconductor customers a robust product portfolio, including Acoustic, Optical and both Manual and Automated X-ray Inspection systems, X-ray Component Counting systems and Semiconductor measurement sensors. Nordson Test & Inspection is uniquely positioned to serve its customers with best-in-class precision technologies, passionate sales and support teams, global reach, and unmatched consultative applications expertise.
About Nordson
Nordson Corporation (Nasdaq: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at https://www.nordson.com/, https://x.com/nordson_corp or https://www.facebook.com/nordson/.
Products & Services
Advanced Metrology & Inspection
High Accuracy. High Resolution. High Speed.
Nordson Test & Inspection manufactures world-class metrology and inspection systems & sensors. Our inspection metrology equipment meets the highest standards for electronic assembly and semiconductor applications. Acoustic, Optical, Bond Test, X-ray Components, Manual X-ray, and Automated X-ray systems enable you to identify even the smallest defects at high resolution and capture critical measurements. Wireless Semiconductor Sensors can significantly improve semiconductor tool setup and maintenance.
We design, develop, and manufacture innovative inspection & metrology equipment for a wide range of industries, including AI, Server & 5G, Consumer, Automotive, Power & Energy, Sensors & LED, Aerospace & Defense and Medical.
Our key segments include Advanced SMT, Advanced Packaging, Front-End semiconductor, Mid-End semiconductor, and Back-End semiconductor.
The right inspection & metrology equipment can elevate your product quality. If you’re looking to save time and money, and improve your yields, processes, and productivity, of the semiconductors or the electronics you manufacture, our inspection equipment can help you ensure exceptional quality every time.
Networker
SPEA
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
Products & Services
- SPEA product portfolio includes test equipment for:
- Automotive, linear, analog mixed signal & SoC devices requiring the most advanced and powerful instrumentation. SPEA’s DOT platform addresses today’s and future roadmap needs.
- MEMS & Sensors. SPEA has been chosen by the biggest players in this market to develop the best solutions for inertial, high-g, proximity, time-of-flight, light, pressure, environmental, magnetic, acoustic sensors. SPEA equipment combines physical stimulus with a complete electrical test, fast pick&place handling, reliable contacting, tri-temp.
- Power & Discretes. DOT800 T perforfms static and dynamic measurements with extended current/voltage ranges, on the whole range of power applications: wafers, discretes (Si, SiC, GaN based), IPMs, KGDs, DBCs, IGBT modules.
- Identification. CT1000 and CT3000 are low-cost test systems dedicated to micro-controllers, RFID, UHF, combi devices. They perform complete, highly accurate measurements, offering high throughput, with high multi-site test capability at wafer test, and a fast data transfer for memory test.
Networker
ULVAC Technologies, Inc.
ULVAC GmbH which was established in 1987 as the European subsidiary of ULVAC, Inc. headquartered in Munich, Germany. ULVAC’s solutions diversely incorporate equipment, materials, and services for Semiconductors, MEMS, Flat Panel Displays, Electronic Components, PCB, TFB, and other Vacuum Equipment for the European Markets.
ULVAC is the global leader for thin film PZT deposition and etch.
ULVAC GmbH
Klausnerring 4
85551 Kirchheim b. München
Germany
Fon: +49 – 89 – 96 09 09 – 0
Fax: +49 – 89 – 96 09 09 – 96
Email: ulvac@ulvac.de
http://www.ulvac.eu
Products & Services
For MEMS application ULVAC has developed systems dedicated to MEMS sensors, actuators, switches, lab-on-chip and micromirror manufacturing. This equipment range includes sputtering and etching for piezo electric materials like PZT, AlN and ScAlN, glass and metal etching, thick resist ashing, resist and polymer removal within trench structures, and others.
Piezoelectric materials can be used to further miniaturize a range of devices, including inertial sensors, tuneable RF devices, inkjet print heads, micromirrors, microphones, autofocus lenses and others. The integration of thin film deposition directly on CMOS-processed wafers is key for highly-integrated devices. ULVAC has developed high-volume processing sputtering method that allows sub 500°C processing temperatures, is configured to pole the piezoelectric crystals during the deposition process and is compatible with other CMOS processes.
End of content
End of content