27-28 August 2025
Suwon
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Gradiant is a Different Kind of Water Company. With a full suite of differentiated and proprietary end-to-end solutions for advanced water and wastewater treatment, powered by the top minds in water, the company serves its clients’ mission-critical operations in the world’s essential industries, including semiconductors, pharmaceuticals, food & beverage, lithium and critical minerals, and renewable energy. Gradiant’s innovative solutions reduce water used and wastewater discharged, reclaim valuable resources, and renew wastewater into freshwater. The Boston-headquartered company was founded at MIT and has over 1,000 employees worldwide. Learn more at gradiant.com.
Silicon Island Development Sdn Bhd (SID) is the joint venture between Penang State Government and Gamuda Bhd, one of Malaysian’s largest engineering and infrastructure company, dedicated to developing Silicon Island, a 2,300-acre Low Carbon Smart City in the south of Penang Island, Malaysia.
Phase 1 land sales will begin in early 2025 and offers a diverse selection of industrial, commercial, and residential plots—providing prime investment opportunities for businesses looking to establish or expand in Penang. SID invites companies to register their interest in being part of this groundbreaking development.
Silicon Island is an innovative and sustainable development poised to become a key engine of economic growth in the region. The Green City of the Future is designed to support the growth of high tech electrical and electronics (E&E) industry, while serving as a dynamic hub for international investments, trade, business services, tourism and leisure for the region.
Located 3km away from Penang International Airport and Bayan Lepas Free Industrial Zone, Malaysia’s oldest and most established E&E hub, this ESG-compliant development, supported by high tech infrastructure seamlessly integrates industrial, commercial, and residential zones, creating a dynamic ecosystem that attracts global businesses and talent.
Strategically connected to Penang Island via two link bridges, Silicon Island blends green spaces, tranquil water bodies, and sustainable architecture, creating a harmonious environment for families to prosper and businesses to thrive.
InvestPenang is the Penang State Government’s principal agency for promotion of investment. Its objectives are to develop and sustain Penang’s economy by enhancing and continuously supporting business activities in the state through foreign and local investments, including spawning viable new growth centers. To realize its objectives, InvestPenang also runs initiatives like the SMART Penang Center (providing assistance to SMEs) and Penang CAT Center (for talent attraction and retention).
For more information, please visit https://investpenang.gov.my/
Do follow us on InvestPenang’s social media channels: Facebook ; LinkedIn
Tokyo Seimitsu Co Ltd or better known as Accretech has been a pioneer in both the nanometre precision sector of industrial measuring technology and also in the fascinating area of semiconductor equipment technology since its inception in 1949. The word Accrete is hidden in ACCRETECH, which means: Using synergies, combining power, finding solutions together, offering the best support for the best products, growing closer and growing together. The name is our driving force for new pioneering technologies in both fields.
Accretech is offering solutions ranging from CmP’s, wafer probers, wafer grinders and wafer dicing solutions. All our products and solutions are compatible to 300mm form factor to cater to high volume manufacturing demands. ACCRETECH offers you ultra-modern machines and systems which you can use to manufacture precisely the types of wafers required in the semiconductor industry complete with state of the art automation systems, compatible with OHT, AGV and networking demands. We see ourselves not only as a developer and manufacturer, but also as a service provider and partner
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.
With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.
Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay.
Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert team that understands the specific needs of shipments such as those in the semiconductor business.
From NFO, to OBC, dedicated drives, charters and more, the Airspace technology will calculate the best routing for you, taking your specific requirements into consideration as well as automating the process to save your team valuable time.
Your supply chain is complicated — we make it easy for you.
Advanced Micro-Fabrication Equipment Inc. China (AMEC, stock code: 688012) is an innovative Asia-based semiconductor equipment company with a range of proprietary fabrication solutions designed to advance technology, increase productivity, and reduce manufacturing costs for leading global manufacturers of semiconductors and LEDs. Headquartered in Shanghai, the company is an entrenched supplier of dielectric and TSV etch tools, helping chipmakers build devices at process nodes as low as 5nm and beyond. In addition, AMEC’s MOCVD system has become a market leader in China for producers of LEDs and power devices. AMEC products are used today by technology leaders in Chinese mainland and Taiwan region, as well as Singapore, Korea, Germany, Italy and so on.
Atotech, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit us at atotech.com
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
HSBC’s presence in Malaysia dates back to 1884 when the Hongkong and Shanghai Banking Corporation Limited established its first office in the country on the island of Penang, with the permission to issue currency notes. HSBC Bank Malaysia Berhad was locally incorporated in 1984 and is a wholly-owned subsidiary of The Hongkong and Shanghai Banking Corporation Limited, founding member of the HSBC Group. In 2007, HSBC Bank Malaysia was the first foreign bank to be awarded an Islamic banking subsidiary licence in Malaysia, namely HSBC Amanah Malaysia Berhad. HSBC Malaysia offers a comprehensive range of banking and financial services including Islamic financial solutions. HSBC Malaysia has also led innovation in Malaysia by introducing Malaysia’s first ATM and Electronic Touch Banking in the early 1980s. Today, HSBC Malaysia has launched innovative solutions such as HSBCnet for secure banking for businesses, Trade Transaction Tracker and Facial Recognition on supported mobile phones.
MIT Semiconductor (Tianjin) Co., Ltd. is a leading manufacturer of semiconductor packaging and testing equipment in China. The company focuses on the core process equipment and software services of advanced packaging and testing of integrated circuits, and its core products include: various types of bare die sorting and inspection machines, various types of high-precision die bonder (flip/non-flip) machines, 3D visual inspection equipment, laser marking machines, various digital/analog ATE, and AI solutions for packaging production line. Products are widely used in packaging and testing of consumer electronics, high-performance computing, storage, automotive electronics, camera modules etc., supporting processes such as WLCSP, FCQFN, FCBGA, Fan-Out, SiP, 2.5D/3D, etc. We serve customers all over the world, including leading IDM companies, packaging and testing foundries and design companies in various segments.
砺铸智能设备(天津)有限公司是国内领先的半导体封装测试设备制造厂商。公司聚焦于集成电路先进封测的核心工艺设备及软件服务,核心产品包括:各类裸晶分选检测机、各类高精度倒装/正装贴片机、三维视觉检测设备、激光打标机、各类数字/模拟测试机、以及封装产线AI解决方案等。产品广泛应用于消费电子、高性能计算、存储、汽车电子、摄像头模组等领域的半导体先进封测制程,如WLCSP,FCQFN,FCBGA,Fan-Out,SiP,2.5D/3D等。服务的客户遍布全球,包含各细分领域领先的IDM公司、封测代工厂和设计公司。
Lead laser technology is mainly engaged in the research and development, production, sales, and service of semiconductor laser precision processing machine; Committed to providing customers with comprehensive solutions for semiconductor equipment and processes.
Lead laser offers: wafer laser grooving/full cut machine, wafer backside marking machine, wafer steath dicing machine etc., Widely used in advanced semiconductor packaging, wafer level packaging, TSV, 3D packaging and other processes.
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