08:00 – 08:30

Keynote

Revitalizing Domestic Semiconductor Manufacturing: Challenges, Opportunities and Emerging Applications

With the passage and signing of the CHIPS and Science Act of 2022, companies in and adjacent to the semiconductor industry are working on plans to help revitalize domestic manufacturing, develop the workforce, strengthen American supply chains, and accelerate the technologies of the future. During this keynote talk, SkyWater President and CEO Thomas Sonderman will talk about how a company like SkyWater can address the challenges of bringing chip manufacturing back to the U.S., invest in opportunities for supply chain certainty and security and enable nimble new innovations that can be accelerated with CHIPS funding to lead the next wave of computing.

Thomas Sonderman photo

Thomas Sonderman

President & CEO

SkyWater Technology

08:30 – 09:00

Keynote

Advancing The Memory Solutions Roadmap To Enrich Our Multi-Dimensional World For Generations To Come

A memory and storage hierarchy evolution is unfolding before us. Homogenous data centers that met our needs in the past, will not meet our future needs.

We must look to heterogenous solutions that require an expansion of the current memory hierarchy, and ultimately, a convergence of memory and storage.

Conventional scaling must continue, while disruptive 3D, and other advanced solutions will emerge to move us into the next few decades of memory advancement.

Advanced Packaging solutions will play a critical role in this expanded hierarchy, but to achieve this monumental shift, the collaboration, knowledge-sharing, and

innovation our industry has relied on to extend Moore’s Law over the past decade must now push the boundaries, to move the packaging supply chain to a front-end like model.

At the same time, we must keep focus on more sustainable and cost-effective solutions while building a strong talent-based workforce to support long-term growth.

We face many near-term challenges to enable this new ecosystem, but if successful, our industry will emerge with a longer-term roadmap that impacts and enriches lives for generations to come.

Naga Chandrasekaran photo

Naga Chandrasekaran

SVP Technology Development

Micron Technology, Inc.

09:00 – 09:30

Technologies To Break The Walls Slowing Compute Systems Scaling

Transistor density in chips continues to follow Moore’s law, but the node to node logic performance improvements have slowed down. Memory and power walls limit compute system performance. Future compute systems will increasingly rely on new materials, new device architectures and system technology co-optimization to realize benefits beyond pure density scaling of compute, connect and store technologies. This talk will highlight technology innovations in logic, memory and 3D integration that will enable continued compute systems scaling. With the anticipated semiconductor industry growth in the next decade, we also need collective action to address the carbon footprint of semiconductor manufacturing.

Sri Samavedam photo

Sri Samavedam

SVP, CMOS Technologies

imec

09:30 – 10:30

Networking Break & Business Meetings 5+6

09:30 – 10:30

Time to Collaborate. SubFAB Research and Development.

Workshop by International SubFAB Research Labs Initiative (ISRL)

One of the key areas poised to become a showstopper for the industry’s ability to achieve sustainability goals is commonly called SubFAB. Existing infrastructure can’t support true game changing development of environmentally friendly and affordable solutions to match the manufacturing technologies advancement cadence.

International SubFAB Research Labs (ISRL) initiative will enable an industry-wide collaborative effort. Member companies will gain access to a dedicated facility with a complete infrastructure required to operate a set of 300mm process tools to enable a science based research focusing on reliability issues, technology validation, pathfinding, materials handling and reclaim.

Ilya Zabelinsky

Co-Founder

International SubFAB Research Labs Initiative (ISRL)

10:30 – 11:00

Wall Street Perspectives on the Semiconductor Market

The presentation will apply a financial lens to the current state of the semiconductor industry. The discussion will evaluate key industry and economic trends, and assess factors that will shape the industry in years to come, including government support and regulations. It will also provide perspectives on sector valuations, strategic transaction activity and potential future consolidation.

Tom Stokes photo

Tom Stokes

Senior Managing Director

Evercore

Kunal Chakrabarti photo

Kunal Chakrabarti

Managing Director

Evercore

11:00 – 11:20

Building the Metaverse: Augmented Reality applications and integrated circuits challenges

Augmented reality is a set of technologies that will fundamentally change the way we interact with our environment. It represents a merging of the physical and the digital worlds into a rich, context aware and accessible user interface delivered through a socially acceptable form factor such as eyeglasses. One of the biggest challenges in realizing a comprehensive AR experience are the performance and form factor requiring new custom silicon. Innovations are mandatory to manage power consumption constraints and ensure both adequate battery life and a physically comfortable thermal envelope. This presentation reviews Augmented Reality and Virtual Reality applications and Silicon challenges.

Edith Beigné photo

Edith Beigné

Silicon Research Director at Reality Labs

Meta

11:20 – 11:40

The New Packaging Math: 2x + 4y = 1

Wolfgang Sauter photo

Wolfgang Sauter

Customer Solutions Architect, Packaging

Marvell Technology

OPTICAL INTERCONNECT FUTURE IN ADVANCED PACKAGING

11:40 – 12:05

Optical I/O Technology to Meet Future Demands of AI

As AI model sizes continue to grow, models will have 100 trillion or more connections, exceeding the technical capabilities of existing AI platforms. New optical interconnect solutions that enable novel system architectures are needed to address the scale, performance and power demands of the next generation of AI. The latest advancements in optical I/O, a new generation of chiplet and multi-wavelength laser solutions, provide dramatically increased bandwidth, at lower latency, over longer distances and at a fraction of the power of existing electrical I/O solutions. In this talk, we present the convergence of trends in compute applications, new optical and advanced packaging technologies, and a scalable supply chain ecosystem, leading to opportunities to build paradigm shifting system architectures addressing AI/ML and cloud computing applications.

Mark Wade, Ph.D.

CEO

Ayar Labs

12:05 – 12:30

Mix and Matching Chiplets with the Economics of PCB Design

Industry has been looking for ways to implement high-performance system in package (SiP) solutions by mixing and matching existing off-the-shelf chiplets. However, due to lack of a universal standard for chiplet interfaces, and connections, this has not yet been practical and achievable. In addition, people have often depended on complex and expensive advanced packaging structures (e.g., large silicon interposers) to build their large SiPs. A new chiplet PHY technology that provides high performance (high bandwidth/power efficiency and low latency) over standard organic package substrates is presented. In addition, an innovative interfacing product that converts any chiplet interface to the new PHY enables practical mix and match of chiplets with different die-to-die interfaces and in different processes. The combined solution not only enables mixing and matching of chiplets, but also provides such option over standard packaging, reducing the total cost of the solution.

Ramin Farjadrad photo

Ramin Farjadrad

Co-Founder & CEO

Eliyan

12:30 – 13:45

Buffet Lunch

13:45 – 14:15

Supply Chain Panel – Sponsored by Airspace

Rebeca Obregon-Jimenez photo

Moderator

Rebeca Obregon-Jimenez

SVP Strategic Business Engagements and Supplier Management

Avnet

Jackie Sturm photo

Panelist

Jackie Sturm

CVP Global Supply Chain Operations

Intel Corporation

Nana Tseng photo

Panelist

Nana Tseng

Chief Procurement Officer

onsemi

Ryan Rusnak photo

Panelist

Ryan Rusnak

Co-Founder & CTO

Airspace

14:15 – 14:25

Are New CS Markets Pushing Reliability Culture Shift?

Conditions are changing rapidly in today’s semiconductor manufacturing market. A convergence of emerging applications — primarily 5G, IoT, AI, and AVT— has bolstered the electronics industry. While this boom is good news for the semiconductor manufacturer, the variety of applications place pressure on companies to meet multiple benchmark reliability guidelines. Manufacturers must validate reliability performance to standards of each industry. Add to this the fact that the semiconductor market has an established history of strict reliability standards already entrenched in the markets, and companies face a seemingly impossible uphill climb to qualify their technology to meet opportunity windows.

How can the technical team arm sales and marketing with hard data to convince customers that new, un-fielded products will work in the intended environment?

Roland Shaw photo

Roland Shaw

President of Accel-RF

STAr Technologies

14:25 – 14:30

Advanced Silicon Wafers for Optimized MEMS and RF Device Performance

Advanced silicon wafers can greatly improve MEMS and RF device performance and precision, and they can also effectively remove some of the burden in the front-end operations.

Bonded Silicon-On-Insulator (SOI) wafers’ high degree of device layer specification flexibility and high thickness uniformity drive for improved MEMS device performance and precision, design freedom and miniaturization. The use of hermetically sealed structures enabled by Cavity SOI (C-SOI®) wafers also enable more streamlined MEMS manufacture and cost-savings.

High resistivity wafers with highly efficient trap-rich layer and optional ultra-flat wafer geometries provide optimized wafer solution even for the most demanding RF filter and device requirements. They enable RF filters to reach superior performance in terms of very low second harmonics and IMD3 levels, low insertion losses and excellent Q values.

Dr. Atte Haapalinna photo

Dr. Atte Haapalinna

CTO

Okmetic Oy

14:30 – 14:35

Advancing the Semiconductor Industry, TOGETHER

Despite slowdown, semiconductor industry continues to be vibrant in addressing next generation technology challenges in logic, memory, specialty devices and advanced packaging. Lam Research, a US based capital equipment leader in this ecosystem, plays key role in advancing the industry. This presentation shares Lam’s initiatives in driving the technology development to enable future semiconductor solutions. As technology advances exponentially, the big question is around how to accelerate semiconductor innovation in an ecosystem that can often be bound by physical limitations, siloed research and development efforts and the time it takes to connect. The answer will be explored in the presentation, of which Lam proposes a new concept to bring that ecosystem together like never before : through Semiverse.

Andrew Goh photo

Andrew Goh

CVP & GM, Advanced Packaging Customer Operations

Lam Research Corporation

14:35 – 14:40

The future of Advanced Packaging Inspection is X-ray

The global demand for high-end computing power driven by smartphones, IoT applications, High-performance computing, and new mobility applications is constantly rising while facing miniaturization demands. The semiconductor industry is all about identifying and solving these challenges and thereby, yield and process control is core for foundries and its importance increased even more through the introduction of advanced packaging. In today’s environment, two things can be observed. One, prototyping and verification costs exponentially increase while node sizes decrease. Two, a change from typical inspection methods like optical or FIB-SEM to advanced non-destructive inspection techniques like X-ray inspection. Ultimately advanced packaging companies seek non-destructive automated inspection tools which are fast enough to provide value within their production processes, increase yield and reduce waste at an early stage. This presentation will give an overview on how X-Ray and CT inspection can provide value-added data and information for exactly that.

Enrico Härtel photo

Enrico Härtel

Director Global Key Account Management

Comet

14:40 – 15:40

Networking Break and Business Meetings 7

15:40 – 16:10

Fab Optimization Panel – Sponsored & Moderated by Deloitte

Dr. Bobby Mitra photo

Moderator

Dr. Bobby Mitra

Managing Director

Deloitte

Juan Velasquez photo

Panelist

Juan Velasquez

Senior Director of Global Industrial Engineering and Automation

Skyworks Solutions

Maitreyee Mahajani photo

Panelist

Maitreyee Mahajani

VP Fab Operations

Western Digital

José J. García, Ph.D. photo

Panelist

José J. García, Ph.D.

Managing Director

Analog Devices Sdn Bhd

16:10 – 16:40

Geopolitical Landscape and the Semiconductor Industry Impact Closing Panel Discussion

Moderator

Salah Nasri

CEO & Co-Founder

I.S.E.S.

Matthew Fulco photo

Panelist

Matthew Fulco

Business & Political Journalist

The Economist Intelligence Unit

Prof. Rao Tummala photo

Panelist

Prof. Rao Tummala

Founding Director and Emeritus Professor

Georgia Institute of Technology

Sunil Banwari photo

Panelist

Sunil Banwari

COO

iontra

Mario Morales photo

Panelist

Mario Morales
Group VP, Enabling Technologies and Semiconductors

IDC

16:40 – 16:50

Closing Address

Salah Nasri

CEO & Co-Founder

I.S.E.S.

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