08:00 – 08:35

Registration

HPC and AI Session

08:40 – 09:10

Keynote

Google AI and AI for Semiconductor Industry in Taiwan

Jason Ma photo

Jason Ma, Ph.D.

Engineering Director, ChromeOS, Google

Google

09:10 – 09:40

Keynote

Intelligent Computing Everywhere

ST Liew photo

ST Liew

President, Taiwan & SEA Australia, New Zealand Vice President

Qualcomm Technologies Inc.

09:40 – 10:10

Keynote

AI Computing on Edge Devices

Dr. Bor-Sung Liang photo

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

10:15 – 11:15

Networking and Coffee Break Business Meeting Slot 5&6

11:20 – 11:40

Unlocking Values: The Power of AI/ML in Semiconductor Test

This presentation offers an in-depth exploration of how artificial intelligence and machine learning are revolutionizing semiconductor testing. We will chart a course through the industry’s evolving landscape, highlighting how Advantest’s strategic foresight is aligning with these technological advancements. We will tackle pressing challenges in advanced packaging and the imperative for robust security measures underpinned by a Zero Trust model. Additionally, we will examine the synergy between the Open Solutions Ecosystem and ACS Real-time Data Infrastructure. Highlighting practical AI/ML use cases, we will demonstrate enhancements in yield, quality, and time-to-market delivery. Join us for an exploration of transformative solutions and a forward-looking perspective on AI/ML’s role in shaping the semiconductor testing future.

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Michael Chang

VP & GM, Advantest Cloud Solutions

Advantest

11:40 – 11:50

Assembly Technologies for the Front End

The drive towards 3D chiplets to extend Moore’s law is changing the way we think about advanced packaging interconnect. Assembly processes like die attach that used to be performed only in back-end factories are now being inserted into front-end wafer fabrication process flows. This presentation explores the latest advancements in front-end assembly technologies, focusing on bringing hybrid bonding into production and improving its accuracy and speed. We will also delve into recent advancements in TCB for 3D chip-to-wafer connections. The discussion will compare and contrast the relative benefits of hybrid bonding and TCB for both logic and memory applications. The adoption of these technologies in high performance AI devices and other applications will be discussed.

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Chris Scanlan

SVP Technology

Besi

11:50 – 12:10

REALITY Twin vs. Digital Twin: Revolutionizing Industrial Remote Management

The perfect image for vision AI closely mimics the human visual system, offering a non-distorted panoramic view. Unlike conventional camera images with many limitations, Cupola360 technology not only provides immersive experiences but also delivers the most AI-friendly images in real-time, 24/7, continuously enhancing AI accuracy and efficiency. This capability unlocks a multitude of possibilities for AI-driven applications.

Imagine immersing yourself in crucial moments missed, whether uncovering breakthroughs at factory crime scenes or capturing the essence of concert performances. This isn’t just a concept from science fiction; it’s a game-changer with practical applications across manufacturing sectors. Recognized by the World Economic Forum (WEF) as the world’s first AI server Lighthouse Factory, the facility covered in the presentation demonstrates the effective integration of Cupola360 technology, signifying a significant milestone in validating its efficacy within the manufacturing domain, elevating beyond conventional IP CAMs and SCADA systems.

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CJ Hsieh

COO

ASPEED

12:15 – 13:40

Buffet Lunch

13:45 – 14:05

RISC-V Accelerating ML Innovation and Beyond

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Samuel Chiang

Deputy Technical Director

Andes Technology

Market Outlook on AI

14:05 – 14:25

Generative AI and Chiplet: Impact on semiconductor industry and position of Taiwan

The semiconductor industry, particularly the processor branch, is undergoing significant transformations driven by two key trends: chiplet adoption and the rise of generative AI.

Chiplet is a kind of ground swell for which the industry has geared up and started adopting it for a couple of years. The developers have step by step removed the technical obstacles, putting in place the supply chain.

Generative AI adoption has surged, driven by hyperscalers and cloud players investing heavily in AI servers to construct their infrastructure.

This presentation will unveil the latest trends in chiplet adoption and will dissect Gen AI investment to identify who is making the revenues of it and what we Gen AI means for the processor industry (GPU and AI accelerators vendors) to the supply chain (foundry and OSATs). While describing the global situation and worldwide enthusiasm around AI, this talk will also elaborate on Taiwan’s position and impact in that field.

Jéröme Azémar photo

Jérôme Azemar

Custom Project Business Development Director

Yole Group

microLED Session

14:25 – 14:45

Micro LED Technology and Platform Trend

In this presentation, the focus will be on how COW (chip on wafer) platform satisfies various selective mass transfer types and monolithic type. In addition, the presentation will introduce the key technology development trend for different platforms and highlight the challenges in realizing mass production of Micro LED.

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Sam Chen

Senior Director

Unikorn Semiconductor Corporation

14:45 – 14:50

Closing Address

Kamel Ait Mahiout photo

Kamel Ait Mahiout

President

14:50 – 17:00

Farewell Cocktail Party & Business Meeting Slot 7

  • 14:50 – 15:20 – Business Meeting Slot 7
  • 15:00 – 17:00 – Farewell Cocktail Party

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