Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.


Markus Ulm

SVP Business Unit Sensors, Mobility Electronics


Dr. Christina Hirschl

Chief Executive Officer


Hamid Azimi, Ph.D.

Chairman of the Board

Formerly CVP of Intel


Dr. Xiaoning Qi

VP


Jennifer Zhao

CEO Global Business, SIngapore


Vincent Dicaprio

Vice President – Head of Business and Corporate Development and Technology Pathfinding, Advanced Packaging and ICAPS


Bernard Lim

Vice President Operations


CJ Hsieh

COO


Wei Wang

Director of BD


Dr. Xiaoxin Qiu

CEO


Martin Weigert

VP & GM Industrial Fiber Products Division


Dr. Qingchun Zhang

Professor


Dr. Yongxiang Wen

Process Technology Director


Chang Fu

Advanced Module R&D Dep., Deputy Director


Prof. Shaojun Wei

Professor


Prof. Tianchun Ye

Researcher Professor


Marvin Liao, Ph.D.

Advisory Board Member


Yaojian Lin

Vice President, Advanced Packaging


JY Zhang

Chairman and CEO


Dr. Tim Yeh

Technical Director


Samuel Liu

VP


Yu-Po Wang, Ph.D.

Vice President, R&D Center


Dato’ KL Bock

SVP Global Flash Backend Operations


LW Yong

Head of R&D, Power Modules in Asia


Kam Lee

Senior Director, Advanced Packaging Technology and Service


Noorazidi Che Azib

Deputy Vice President


Michael Siebert

Sales Manager


Dr. Gerhard Lammel

Director System Architecture


Maurus Tschirky

Senior Strategic Marketing Manager


Dr. Mark Wang

CEO


Dr. Zhijian Zhou

R&D Director


Michelle Bourke

Managing Director Specialty Technologies and Strategic Marketing


June Shen

Managing Partner


Winfred Chen Ph.D.

Chief Hardware Architect of AIoT, Home Service Robot, Intelligent Innovation Centre


Mike Rosa, Ph.D.

CMO & SVP Strategy


Dr. Mustafa Badaroglu

Principal Engineer/Architect (& IRDS More Moore Global Chair)


Prof. Dr. Zewen Liu

Professor


Coralie Gallis Ph.D.

Co-Founder & Chief Technology Officer


Dr. Mary Ann Maher

CEO


Dimitrios Damianos Ph.D.

Project Manager, Consulting Services Division


Dariusz Czaja

Managing Director of TRUMPF Huettinger Asia


Ralf Bornefeld

SVP Power Semiconductors & Modules


Rainer Kaesmaier, Ph.D.

Managing Director Semiconductors


Dr. Hongchao Liu 刘红超

SVP/Chief Scientist


Joseph Roybal

Senior Vice President of Global Backend Operations


Oreste Donzella

Executive Vice President and Chief Strategy Officer


Denis Marcon

General Manager


Dr. Marnix Tack

CTO & VP Business Development


Christophe Maleville

CTO and Senior EVP Innovation


Jian Zhang

VP, Engineering


Ray Yang

Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)


Wei-Chung Lo, Ph.D

Deputy General Director, Electronic & Optoelectronic System Research Laboratories (EOSL)


Seung Wook Yoon, Ph.D, MBA

CVP Business Development Team, AVP


Akshay Singh Ph.D.

VP, Advanced Packaging Technology Development


Eric Lee

CEO


Yu-Hua Chen, Ph.D.

VP Carrier SBU/RD Division


Deepak Kulkarni

Senior Fellow Advanced Packaging


Curtis Zwenger


Thy Tran

Vice President of Global Front End Procurement


Geoffrey Stoddart

Senior Vice President Global Business Development


Tomomitsu Maoka

Chief Strategy Officer


Dr. Koukou Suu

President, Entegris Japan


Kangwook Lee, Ph.D.

SVP and Head of PKG Development


Robert Ferguson

President and CEO


Jason Zee

Global Vice President, General Manager of the Storage and System Level Test Group at Teradyne, China Managing Director


Dr. Yemin Dong

General Manager


Jörg Doblaski

CTO


Volker Herbig

VP BU Microsystems


CS Tan

VP GM


Joshua Yoo

President of Core Insight, President of ISES Korea


Wolfgang Knitterscheidt

CEO & Owner


Amy Leong

CEO


Wilson Hong

Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering


Kok Tiong Ng

SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd


Primit Parikh, Ph.D.

VP GAN


Najwa Khazal

Chief Operating Officer


Joseph Chou

General Manager


Achim Strass, Ph.D.

Head of Worldwide Technology Scouting


Haiying Duanmu

Deputy Secretary General of MIA / Director of VAIA special committee


Aasutosh Dave

Chief Commercial Officer


Wee Seng Ang

Executive Director


Jörg Amelung

Deputy Institute Director Division, Director Engineering, Manufacturing & Test


Sandra Vos, Ph.D.

Engineering Director, Pressure and Flow Industrial and Medical Sensors – TE Sensors


Amr Darwish

Senior Director of Product Marketing & Market Development


Mohssen Moridi, Ph.D.

Senior Executive Director & Head of the Microsystems Research Division


Ralph Zoberbier

CMO


Dr. Alan Zhou

CEO, Shanghai


Julian Kornprobst

MEMS Sensor System Competence Team Business Lead


Tamara Baksht

CEO


Yvonne Keil

Senior Director GF Operations India/Malaysia


Henri Berthe

Semiconductors Segment VP • Sales


Sharon Ko Mei Wan

Managing Director


Dr. Riccardo Nicoloso


Thomas Stenger

Senior Vice President, Head of Business Line Functional Materials


Avinash Kashyap Ph.D.

SVP & Division Head


Simone Ferri

Analog, Power, MEMS and Sensors Group Vice-President, MEMS sub-group General Manager


Roland Rettenmeier

CSO


Christine Dunbar

Head of Strategic Business Development


Ariel Meyuhas

Founding Partner & COO


Habib Hichri, Ph.D.

EVP, Senior Fellow, Global Applications and Business Development

End of content

End of content