Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.
Boon Soo Lim
Vice President & General Manager, SDSM, Global Operations
BS Lim is the Vice President and General Manager of Sandisk Batu Kawan Manufacturing Operations. With over 25 years of experience in operations, process management, equipment, and planning, he plays a critical role in advancing Sandisk Storage Malaysia (SDSM) Solid State Drive Storage Operations.
He began his career in process engineering and rose through various roles, ultimately serving as Factory Manager in his previous company before joining Sandisk as a Senior Manager of Operations. Throughout his career, he has managed engineering in process, equipment, and new product introductions (NPI), as well as overseeing planning, warehousing, logistics, and overall operations. He also held full responsibility for operational cost control. Over his decade-long tenure at Sandisk/Western Digital, his exceptional leadership and expertise led to his progression through roles as Director, Senior Director, and now Vice President and General Manager of Operations, overseeing core areas of Manufacturing Operations, Process Engineering, Equipment Engineering, Planning & IE, Test Engineering, Automation & Analytics, WH/FG Management and Sustainability, driving high standards of efficiency and innovation.
He is a seasoned leader dedicated to elevating manufacturing processes and innovation. He continues to drive advancements in Sandisk Storage Malaysia (SDSM), helping to position the Penang facility as a leading center for high-quality flash memory production to meet global demand.
Company Profile
Sandisk, a global Flash and advanced memory technology innovator, understands how people and businesses consume data and relentlessly innovates to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in memory and storage semiconductors, we keep people and businesses moving forward with inspired innovations to actualize their potential.
As Sandisk embarks on its journey with its new corporate branding, the company continues to keep aspirations moving and pushing possibility forward, empowering people and businesses with data everywhere. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized for innovation, performance and quality.
Sandisk is on a journey to be an industry leader in sustainability, building from a strong foundation. Our commitment to environmental, social and responsible business has always been an integral part of Sandisk’s DNA. These focus areas guide the company to make meaningful decisions that benefit the business and have a positive impact on the environment, society, and key stakeholders.
Sandisk operates in several key sectors: Cloud & Data Center, Client Compute, Consumer & Gaming as well as Automotive, Mobile & IoT. These industries are central to the company’s broad portfolio, which includes storage solutions ranging from high-performance memory cards to enterprise-level data management, serving cloud providers to enterprises to consumers.
Wilson Hong
CTO & Partner
Wilson Hong, Chair of ISIG China, Partner and CTO of Wuxi Leapers Semiconductor. He has 20 years R&D experience on power electronic engineering, software engineering, electric drive system and high voltage architecture in EV.
He used to be senior director in NIO, built the power electronic and software team from 1 person in 2015 to ~200 people in 2023. He led the team to deliver over 1.6 million inverters with several classes and different semiconductors, incl. first highest NEDC efficiency SiC Inverter, first 3-in-1 240kW IM system, first 3-in-1 160kW PM system and 4-in-1 HV ECU.
He hold over 50 power electronic, software, electric drive system patents cross China, US and EU. He won the first Prize and second Prize of Science and Technology Progress of China Association of Automobile Manufacturers in 2021 and 2024.
He is now working on power module advanced packaging, super charging and AI power.
Company Profile
Wuxi Leapers Semiconductor Co., Ltd. brings together experienced professionals at home and abroad, including wafer process and device design, module packaging design, product application, marketing and product operation. Major products include high-reliability SiC and IGBT modules for new energy vehicles and industrial applications. Products are used in new energy vehicles, smart grids, renewable energy, industrial motor drives, medical equipment, power supplies and other scenarios and fields; the company is headquartered in Wuxi, China, and has a research and development center in Japan.We adopts innovative packaging materials and processing technology to provide complete module application solutions for the miniaturization, efficiency and light weight of electric drive systems and inverters for new energy vehicles. Meet the needs of high-performance, high-reliability new energy vehicles and high-end industrial power semiconductor modules.
KT Lee
Vice President of FCBGA Business
KT Lee – Vice President, FC-BGA Business, LG Innotek / As Vice President of LG Innotek’s FC-BGA business (since 2022), I lead the development of advanced semiconductor substrates, focusing on smart factory implementation and yield innovation to strengthen competitiveness in AI and data center markets. With over 25 years of expertise in semiconductor substrate technologies—including FCCSP and SiP—I have successfully driven large-scale manufacturing, process innovation, and factory setup at LG Electronics and LG Innotek, delivering significant business growth through cutting-edge technology and operational excellence. I hold a Bachelor’s and Master’s in Materials Science and Engineering from Sungkyunkwan University and an MBA from Aalto University, Finland. As a certified Master Black Belt (MBB) in Six Sigma from LG Electronics, I specialize in statistical process optimization. In 2021, I was honored with the Presidential Commendation at the Korea Industrial Technology R&D Awards for advancing semiconductor substrate technology and enhancing national industrial competitiveness. My leadership and technical expertise continue to drive LG Innotek’s leadership in high-performance substrates for next-generation electronics.
Company Profile
LG Innotek is a global leader in advanced electronic components and materials, renowned for its innovative solutions in semiconductors, displays, and IoT. Founded in 1970 as part of the LG Group, the company specializes in high-performance components such as camera modules, 3D sensing modules, semiconductor packages, and LED products. LG Innotek is a key supplier to major technology brands, providing critical components for smartphones, automotive electronics, and high-speed connectivity solutions. The company is at the forefront of developing cutting-edge technologies, including FC-BGA, RF-SiP, FCCSP, and glass substrates, which support next-generation applications in 5G/6G, autonomous driving, and electric vehicles. With a strong focus on R&D, LG Innotek continues to pioneer advancements that drive the future through collaboration with global electronics and semiconductors customers.
Weiping (Bill) Li, Ph.D.
Former CEO and Founder of Yibu Semiconductor
Weiping Li is a seasoned executive in the semiconductor and IT industry with vast experience both in the US and China. He founded Yibu Semiconductor in 2020 that pioneered Si bridge chiplet packaging in China. Prior to that, he served as the Senior Vice President with Unigroup and was the Chairman of the Board of its subsidiary, Unimos. He was Vice President of Jiangsu Changjiang Electronics Technolgy (JCET) for 8 years before Unigroup. He also worked in the US at Amkor, Motorola SPS and Delphi Delco in R&D and product management roles.
Weiping Li held a Ph.D. degree from Georgia Institute of Technology in Materials Science and Engineering. He received the “Extinguished Alumni in Engineering Award” from the same school in 2012. He has over one hundred of patents and numerous technical and industrial publications/talks in electronics packaging.
Company Profile
Established in 2010, the International SemiconductorIndustry (I.S.I.G.) is a prestigious & trusted associationwithin the semiconductor industry, renowned fororchestrating major regional summits across the globe,ranging from the U.S, the Middle East & Asia via ourdivision, the International Semiconductor ExecutiveSummits (I.S.E.S.). Our summits are fully endorsed bylocal governments and leading companies in all areas ofthe semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries.
Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.
Gang Duan, Ph.D.
Executive Vice President
Gang Duan currently serves as Executive Vice President at Samsung Electro-Mechanics America, and is responsible for package substrate technology marketing and application engineering. Prior to his current role, Gang was the Sr. Director of Backend Area and a Sr. Principal Engineer in Substrate Packaging Technology Development at Intel Foundry, leading pathfinding and development efforts in EMIB/EMIB-TSV die embedding, High-Density Interconnect organic/glass substrate backend, and glass carrier-based packaging backend processes. In recognition of his innovative and pioneering contributions, Gang was honored as the 2024 Intel Inventor of the year. He holds 325+ US issued/pending patents (600+ globally) in IC packaging processes, architectures, and materials. Gang has published 50+ technical papers in highly regarded academic journals and industry conferences, garnering over 5000 citations. He received his Ph.D. in Materials Science, and his M.S. in Electrical Engineering from the California Institute of Technology (Caltech).
Company Profile
Founded in 1973, Samsung Electro-Mechanics has grown into a world-class company that develops and produces major electronic components.
In our early days, we established the foundation for the self-reliant component industry in Korea through audio and video component production. In the 1980s, we expanded into materials and computer components, and our focus moved on to developing promising next-generation products, such as components for computer chips, mobile communication devices, and optical devices in the 1990s. Since the 2000s, we have been producing MLCC (Multilayer Ceramic Capacitors), power inductors, camera and communication modules, and substrates with world-class core technologies in materials, high-frequency wireless communication, and precision mechanics.
Samsung Electro-Mechanics focuses on investment and development of technological convergence to advance our core products to the highest quality and plans to continuously expand our business portfolio through product development in the growing field of AI computing. We will also nurture our next-generation growth engines early on our way to become the No.1 company in the electronic components industry.
End of content
End of content