Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.
Wilson Hong
CTO & Partner
Wilson Hong, Chair of ISIG China, Partner and CTO of Wuxi Leapers Semiconductor. He has 20 years R&D experience on power electronic engineering, software engineering, electric drive system and high voltage architecture in EV.
He used to be senior director in NIO, built the power electronic and software team from 1 person in 2015 to ~200 people in 2023. He led the team to deliver over 1.6 million inverters with several classes and different semiconductors, incl. first highest NEDC efficiency SiC Inverter, first 3-in-1 240kW IM system, first 3-in-1 160kW PM system and 4-in-1 HV ECU.
He hold over 50 power electronic, software, electric drive system patents cross China, US and EU. He won the first Prize and second Prize of Science and Technology Progress of China Association of Automobile Manufacturers in 2021 and 2024.
He is now working on power module advanced packaging, super charging and AI power.
Company Profile
Wuxi Leapers Semiconductor Co., Ltd. brings together experienced professionals at home and abroad, including wafer process and device design, module packaging design, product application, marketing and product operation. Major products include high-reliability SiC and IGBT modules for new energy vehicles and industrial applications. Products are used in new energy vehicles, smart grids, renewable energy, industrial motor drives, medical equipment, power supplies and other scenarios and fields; the company is headquartered in Wuxi, China, and has a research and development center in Japan.We adopts innovative packaging materials and processing technology to provide complete module application solutions for the miniaturization, efficiency and light weight of electric drive systems and inverters for new energy vehicles. Meet the needs of high-performance, high-reliability new energy vehicles and high-end industrial power semiconductor modules.
KT Lee
Vice President of FCBGA Business
KT Lee – Vice President, FC-BGA Business, LG Innotek / As Vice President of LG Innotek’s FC-BGA business (since 2022), I lead the development of advanced semiconductor substrates, focusing on smart factory implementation and yield innovation to strengthen competitiveness in AI and data center markets. With over 25 years of expertise in semiconductor substrate technologies—including FCCSP and SiP—I have successfully driven large-scale manufacturing, process innovation, and factory setup at LG Electronics and LG Innotek, delivering significant business growth through cutting-edge technology and operational excellence. I hold a Bachelor’s and Master’s in Materials Science and Engineering from Sungkyunkwan University and an MBA from Aalto University, Finland. As a certified Master Black Belt (MBB) in Six Sigma from LG Electronics, I specialize in statistical process optimization. In 2021, I was honored with the Presidential Commendation at the Korea Industrial Technology R&D Awards for advancing semiconductor substrate technology and enhancing national industrial competitiveness. My leadership and technical expertise continue to drive LG Innotek’s leadership in high-performance substrates for next-generation electronics.
Company Profile
LG Innotek is a global leader in advanced electronic components and materials, renowned for its innovative solutions in semiconductors, displays, and IoT. Founded in 1970 as part of the LG Group, the company specializes in high-performance components such as camera modules, 3D sensing modules, semiconductor packages, and LED products. LG Innotek is a key supplier to major technology brands, providing critical components for smartphones, automotive electronics, and high-speed connectivity solutions. The company is at the forefront of developing cutting-edge technologies, including FC-BGA, RF-SiP, FCCSP, and glass substrates, which support next-generation applications in 5G/6G, autonomous driving, and electric vehicles. With a strong focus on R&D, LG Innotek continues to pioneer advancements that drive the future through collaboration with global electronics and semiconductors customers.
Weiping (Bill) Li, Ph.D.
Former CEO and Founder of Yibu Semiconductor
Weiping Li is a seasoned executive in the semiconductor and IT industry with vast experience both in the US and China. He founded Yibu Semiconductor in 2020 that pioneered Si bridge chiplet packaging in China. Prior to that, he served as the Senior Vice President with Unigroup and was the Chairman of the Board of its subsidiary, Unimos. He was Vice President of Jiangsu Changjiang Electronics Technolgy (JCET) for 8 years before Unigroup. He also worked in the US at Amkor, Motorola SPS and Delphi Delco in R&D and product management roles.
Weiping Li held a Ph.D. degree from Georgia Institute of Technology in Materials Science and Engineering. He received the “Extinguished Alumni in Engineering Award” from the same school in 2012. He has over one hundred of patents and numerous technical and industrial publications/talks in electronics packaging.
Company Profile
Established in 2010, the International SemiconductorIndustry (I.S.I.G.) is a prestigious & trusted associationwithin the semiconductor industry, renowned fororchestrating major regional summits across the globe,ranging from the U.S, the Middle East & Asia via ourdivision, the International Semiconductor ExecutiveSummits (I.S.E.S.). Our summits are fully endorsed bylocal governments and leading companies in all areas ofthe semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries.
Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.
Gang Duan, Ph.D.
Executive Vice President
Gang Duan currently serves as Executive Vice President at Samsung Electro-Mechanics America, and is responsible for package substrate technology marketing and application engineering. Prior to his current role, Gang was the Sr. Director of Backend Area and a Sr. Principal Engineer in Substrate Packaging Technology Development at Intel Foundry, leading pathfinding and development efforts in EMIB/EMIB-TSV die embedding, High-Density Interconnect organic/glass substrate backend, and glass carrier-based packaging backend processes. In recognition of his innovative and pioneering contributions, Gang was honored as the 2024 Intel Inventor of the year. He holds 325+ US issued/pending patents (600+ globally) in IC packaging processes, architectures, and materials. Gang has published 50+ technical papers in highly regarded academic journals and industry conferences, garnering over 5000 citations. He received his Ph.D. in Materials Science, and his M.S. in Electrical Engineering from the California Institute of Technology (Caltech).
Company Profile
Founded in 1973, Samsung Electro-Mechanics has grown into a world-class company that develops and produces major electronic components.
In our early days, we established the foundation for the self-reliant component industry in Korea through audio and video component production. In the 1980s, we expanded into materials and computer components, and our focus moved on to developing promising next-generation products, such as components for computer chips, mobile communication devices, and optical devices in the 1990s. Since the 2000s, we have been producing MLCC (Multilayer Ceramic Capacitors), power inductors, camera and communication modules, and substrates with world-class core technologies in materials, high-frequency wireless communication, and precision mechanics.
Samsung Electro-Mechanics focuses on investment and development of technological convergence to advance our core products to the highest quality and plans to continuously expand our business portfolio through product development in the growing field of AI computing. We will also nurture our next-generation growth engines early on our way to become the No.1 company in the electronic components industry.
Koukou Suu, Ph.D.
Chief Executive Officer
Dr.Koukou Suu graduated and received Ph.D degree in material science from Tohoku University in 1988 and 1993 respectively. He joined ULVAC, Inc. in 1993 and until 2023 served as GM of Institute of Semiconductor Technologies and Executive Officer responsible for Global Market and Technology Strategy as well as President and CEO of ULVAC’s operations in North America and Europe. He joined Entegris Inc. in beginning of 2024 and served as President of Entegris’ Japan operations. In August of 2025, he founded and is serving as CEO of TechBiz Nexus, Inc. envisioning enhancing industry collaborations for future semiconductor technology innovations and business developments. He is Executive Advisor of Gaianixx Inc. and Adjunct Professor of University of South Australia as well as SIMIT of Chinese Academy of Science.
Company Profile
TechBiz Nexus,Inc. was founded in August of 2025 envisioning promote industry collaborations for future semiconductor technology innovations and business developments. The company is focusing on areas such as Heterogeneous Integration/Advanced Packaging, in-memory computing/non-volatile memory, power and communication/compound semiconductor/photonics as well as MEMS/Sensor in terms of materials, processing and integration.
End of content
End of content