Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.
CJ Hsieh
COO
Experiences:
- Advisory board, ISES Taiwan
- Co-chair of Test Committee, SEMI Taiwan
- General Manager, INTEL Innovation Tech. Ltd.
- Spokesperson, INTEL Taiwan
- Consulting Committee, National QUEMOY University
- VP of Global Operations, LANTIQ Deutschland GmbH
- GM & VP of Professional Services Lab, SPIROX Corp.
- AVP of ASIC Design Services and Production Turnkey, FARADAY Tech. Corp.
- Technical Manager of CPU / Memory Design, UMC
- Project Leader of EDA DFT, SYNTEST Tech. Ltd.
Education:
- MSEE, University of Southern California, Los Angeles, USA
Company Profile
Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.
ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.
Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.
Fore more information, please visit https://www.aspeedtech.com/ and https://cupola360.com/.
Ray Yang
Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)
Ray Yang is consulting director at Industry, Science and Technology International Strategy Center of ITRI (Industrial Technology Research Institute), which is one of influential think tanks in Taiwan. Ray is currently also appointed by ITRI HQ as BD director at Office of Business Development. Ray is responsible for emerging technology and market dynamics research especially about semiconductors as well as industry-related geo-political issues.
Ray has more than 30 years’ experience with semiconductor industry, and had been advisor to Horizon 2020 “NanoElectronics Roadmap for Europe: Identification and Dissemination” 3-years’ project, and continues to serve as international advisor to Horizon Europe project “International Cooperation on Semiconductors” since 2024. Ray is serving as committee member at SEMI Taiwan Packaging & Testing, Smart Manufacturing, and MEMS & Sensors committees. He is also appointed as vice-chair of semiconductor supply-chain committee in CIECA (Chinese International Economic Cooperation Association) of Taiwan.
Ray’s analysis and commentary have been featured in the New York Times, the Wall Street Journal, Al Jazeera, Deutsche Welle, Reuters, among others. He also appeared on Taiwan’s media such as Central News Agency, Radio Taiwan International, United Daily News, and has provided commentary for ERA TV, a Taiwanese broadcast media outlet.
Ray holds a MBA from Tel-Aviv International School of Management in Israel, and receives bachelor degree of electrical engineering with honor from National Tsing Hua University of Taiwan in 1986.
Company Profile
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.
Akshay Singh Ph.D.
VP, Advanced Packaging Technology Development
Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He leads a global team that is responsible for delivering advanced memory packaging solutions for HBM, high performance compute and AI/ML applications. Dr. Singh joined Micron in 2006 as an interposer materials engineer and since then has held number of positions of increasing responsibility in packaging design, integration and technology development. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA.
Dr. Singh has authored several keynote publications and patents and has served as an invited panel speaker at several conferences. Dr. Singh holds master’s and doctorate degrees in mechanical engineering from Louisiana State University, bachelor’s degree in mechanical engineering from Maharaja Sayajirao University and is a graduate of the Stanford Graduate School of Business Executive Program.
Education:
- Stanford Graduate School of Business Executive Program, Stanford University
- PhD and MS, Mechanical Engineering, Louisiana State University
- BE, Mechanical Engineering, Maharaja Sayajirao University
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
Jian Zhang
VP, Engineering
Jian is a semiconductor industry veteran with more than 25 years of experience in process technology development, foundry operations, product engineering. Jian has extensive experience in leading and integrating global teams from various regions and businesses, having spent more than a decade in the U.S. and Asia.
Jian is the Vice President in Qualcomm, leading the Product Test Engineering (PTE) in APAC, responsible for new product test development, characterization, and test deployment, yield management, integrating and optimizing performance for all products across the BUs. She also oversees technical and management coordination with the PTE teams in the U.S.
Prior to Qualcomm, Jian served as VP of technology at NXP, responsible for technology roadmap planning and execution, both for in-house fabs and foundries. She also partnered with foundry and internal teams to ensure all new products and foundry processes would meet the automotive quality requirements and work
Jian held various management positions, including Global Foundries and Hewlett Packard. She holds master’s and bachelor’s degree in Electrical Engineering from Purdue University
Company Profile
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Eric Lee
CEO
Eric Lee is the CEO of Scientech Corp. and Chairman of Yayatech. He joined Scientech in 2004, following nearly a decade at UMC, where he held positions in both Taiwan and Singapore from 1995 to 2004.
In addition to his leadership roles at Scientech and Yayatech, Eric serves as President of the International Semiconductor Executive Summit (ISES) Taiwan. He is also a part-time professor in the Advanced Packaging Master’s Program at National Taiwan University of Science and Technology.
Eric contributes actively to the industry through his roles as a member of the SEMI Taiwan Advanced Packaging Committee and as a director of the Taiwan Electronic Equipment Industry Association.
Company Profile
Scientech Corporation was established in Taipei, Taiwan in 1979.
What we do: Industries we serve: Semiconductor (front-end, back-end and GaAs), Flat Panel Display, LED, Data Storage, Scientific Instruments and high-tech related industries.
Being a leading semiconductor equipment and wafer reclaim supplier in Taiwan, Scientech Corporation has launched the development of wet process equipment in 2003. Scientech has successively supported customers in LED, Mini/Micro LED, compound semi and power components such as IGBT, SiC and GaN industries, as well as advanced packaging process such as Bumping, Fan-out, Chip-On-Wafer and so on. Our wet process equipment has been successfully verified in the latest Chiplet’s 2.5D/3D packaging process technology and smoothly introduced into mass production.
Samuel Liu
VP
Company Profile
Skymizer provides AI-on-chip system software subscription services, including compilers, calibrators, runtime systems, and various AI models (Model Zoo) to the complete source code of the basic application (application). Skymizer also provides customize software and relevant source code for the IC design company.
Yu-Po Wang, Ph.D.
Vice President, R&D Center
Yu-Po Wang received Ph.D. in Mechanical Engineering from Binghamton University, State University of New York , U.S.A.
In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore.
He joins SPIL in 1998 and leads the R&D Package Application and Technology Support Team in substrate/package design, material characterization and advanced package.
Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has over 83 patents in US.
IEEE Electronics Packaging Society Board of Governors (BoG) member from 2025
IEEE Electronics Packaging Society Taipei Chapter Executive Committee from 2025
Company Profile
Kam Lee
Senior Director, Advanced Packaging Technology and Service
Kam currently serves as Senior Director at TSMC Advanced Packaging Technology and Service, which he joined in 2022. He specifically manages the TSMC Testing RD, Testing operations and backend turnkey operations. He has extensive experience in semiconductor industry, having worked 27 years at Intel, in various roles in technology development, product development and high volume manufacturing. He previously held the role of Vice President of Intel product development and engineering.
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
Yu-Hua Chen, Ph.D.
VP Carrier SBU/RD Division
Education:
- Ph.D. Chemistry, 2001, National Taiwan University
Experience:
- 2012~2021, Vice President, Unimicron Technology Corp.
- Advanced substrate, panel level RDL and glass substrate Technology
- 2001~2012, Deputy R&D Director. ITRI/EOSL
- 3DIC, wafer level stacked & 8” and 12” CIS TSV package technology
- Chip embedded in rigid and flexible substrate technology
- Flexible LED lighting package technology
Company Profile
Founded in 1990, Unimicron is a world leading company of printed circuit board (PCB) and IC carrier (substrate) manufacturing. Major products include PCBs, high density interconnection (HDI) boards, flexible PCBs, rigid flex PCBs, and IC substrates. Product applications include AI, HPC data center infrastructure (server, networking), smartphones, PC/NB, optical modules, automotive and more. Unimicron’s global footprint encompass manufacturing sites and/or service centers in Taiwan, China, Germany, Japan and Thailand, delivering high value-added, high quality and high productivity innovation and services to our global customers.
Unimicron’s high-end substrate solutions, FCBGA and FCCSP, provide our valued customers the technologies crucial in meeting today’s fast-growing development of AI, HPC applications. Our customer-oriented service, high quality standards, and innovative breakthroughs have helped Unimicron achieve the honor of No.1 ranking among the global substrate suppliers by market share for the 9th consecutive year since Y2016.
Marvin Liao, Ph.D.
Advisory Board Member
Education :
- Ph.D., Materials Science, University of Texas, USA, 1989
- Bachelor, Materials Science, Tsing Hua University, Taiwan, 1979
Experience :
- TSMC, Advanced Packaging Technology and Service, 2011 ~ 2022
- TSMC, Special Project, 2009 ~ 2010
- TSMC, Fab 6 Director, 2003 ~ 2009
- Chartered Semiconductor, 1997 ~ 2002 (Singapore)
- Applied Materials, 1994 ~ 1997 (USA)
- SGS Thomson Microelectronics, 1990 ~1994 (USA)
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Thomas Stenger
Senior Vice President, Head of Business Line Functional Materials
Thomas Stenger is Senior Vice President, heading the Functional Materials Business Line at Heraeus Precious Metals. He holds a Master’s degree in Industrial Engineering and has 20 years of experience in the precious metals industry. He served in various roles, always dedicated to enhancing Heraeus’ materials business across diverse sectors such as Automotive, Medical, PV, or Semiconductor. Thomas is dedicated to driving innovation and developing material solutions that empower industries to achieve the next technological advancements.
Company Profile
Heraeus Precious Metals is globally leading in the precious metals industry. The company is part of the Heraeus Group and covers the value chain from trading to precious metals products to refining and recycling. It has extensive expertise in all platinum group metals as well as gold and silver. With more than 3,000 employees at 17 sites worldwide, Heraeus Precious Metals offers a broad portfolio of products that are essential for many industries such as the automotive, chemicals, semiconductor, pharmaceutical, hydrogen and jewelry industry.
Heraeus offers top-quality solutions and products based on many years of experience and technical expertise. They are a reliable development partner for customers and find the best solutions for their requirements. One area for precious metals in semiconductors is the use of special alloys for semiconductor wafer testing, also known as probing. Heraeus offers a wide range of probe pin materials, from precipitation-hardened PdAgCu alloys to high-strength PtNi alloys. Probe pin materials made by Heraeus can be applied to any probe card type.
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