Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

Mr. K.C. Hsu is Vice President of Integrated Interconnect & Packaging at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies, including 3D IC and advanced packaging. He possesses more than 30 years’ experience in the semiconductor industry.

Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University and his M.S. in Technology Management from National Chiao Tung University.

Dr. Lee has been one of critical leaders who are leading the era of 3D TSV stack memory such as HBM (High Bandwidth Memory) in semiconductor industry.

He has contributed broadly to, and led teams in, 3D integration/packaging R&D including core technology/product development/reliability study and mass production for HBM over 27 years.

Dr. Lee received the Ph.D. degree in machine intelligence and systems engineering from Tohoku University, Japan, in 2000. During his doctoral research at Tohoku University,Dr. Lee proposed a new 3D-IC integration technology to achieve 3D devices with high performance and multi-functionality, leading this field in the world.

From 2001 to 2002, he was a Postdoctoral Researcher with the Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA.

He worked with Memory Division, Samsung Electronics Ltd., Korea, as a Principal Engineer from 2002 to 2008.

From 2008 to 2016, he worked with the New Industry Creation Hatchery Center (NICHe), Tohoku University, Japan, as a Professor.

From 2017 to 2018, he worked with R&D center, Amkor Technology Korea, as a VP.

He joined SK hynix 2018 and currently Senior VP, Head of PKG Development at SK Hynix, Korea.

Dr. Lee has led many interdisciplinary R&D programs on 3D integration, including integration of various materials and devices to achieve 3D devices/systems with high performance and new functionality, 3D-IC reliability research to investigate the impacts of 3D integration on the device performance and reliability, unique hybrid integration of nano-materials with Si, and product development of 3D stack DRAM such as high-bandwidth memory (HBM). For over 27 years at universities and industries in Japan, US, and Korea, Dr. Lee has made exceptional technical contributions to and lasting impacts on 3D integration technology and 3D product development in broad fields, such as material science, materials characterization/analysis, semiconductor device/process, electrical packaging, and Si micro-machining.

Dr. Lee has authored more than 230 scientific publications (peered journals, international conferences), co-edited 4 books, and given 43 tutorial/invited/keynote talks in international conferences including IEEE IEDM, IEEE IRPS, VLSI Symposium, plus 23 US patent publications.

He has served as a frequent reviewer for a number of journals, including IEEE EDL, IEEE T- ED, IEEE CPMT, and technical program committees of international conferences, including IEEE ECTC, IEEE IRPS, IEEE EDTM, IEEE 3D SIC.

He is a Senior Member of IEEE.

Bret Street has over three decades of semiconductor packaging experience. He currently holds over 165 issued U.S. patents. He currently serves as Senior Director of Advanced Packaging Technology Development at Micron Technology Inc. in Taiwan. His team focuses on advanced packaging solutions to enable current and future Micron products like Micron’s industry-leading HBM3e and future HBM/Heterogeneous-enabled products. Over his career, Bret has served in technical leadership roles across Assembly, Test, Probe, Product Engineering, and Advanced Package Technology Development. His packaging solutions span Flip Chip, Imager, 3D TSV, Logic/Memory (HMC), High Bandwidth HBM2e, and HBM3e products. Bret has developed a broad skill set enabling products from the design, development, manufacturing, and mass production stages.

26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and other substrate technologies. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.

Dr. Kuan-Neng Chen is Dean of International College of Semiconductor Technology and Chair Professor at Institute of Electronics at National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, as well as his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). Dr. Chen has held several prominent positions including Vice President for International Affairs, Associate Dean of International College of Semiconductor Technology at NYCU, Program Director of the Micro-Electronics Program at National Science and Technology Council in Taiwan, Adjunct R&D Director at Industrial Technology and Research Institute (ITRI), and Research Staff Member at IBM Thomas J. Watson Research Center.

Dr. Chen has received numerous awards and honors throughout his career, including IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST/NSTC Outstanding Research Award (twice), MOST/NSTC Futuristic Breakthrough Technology Award (twice), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored over 400 publications, including 3 books and 7 book chapters, and holds 88 patents. Dr. Chen served as Guest Editor for the MRS Bulletin, IEEE Transactions on Components, Packaging, and Manufacturing Technology, and Materials Science in Semiconductor Processing, and has held leadership roles in various conferences and committees, such as IEEE IITC General Chair. Dr. Chen is Fellow of National Academy of Inventors (NAI), IEEE, IET, IMAPS, and CIEE and member of Phi Tau Phi Scholastic Honor Society.

Additionally, Dr. Chen is Specially Appointed Professor at Institute of Tokyo Science (previously Tokyo Tech). His current research interests focus on three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.

Dr. Radha Nagarajan is Senior Vice President and Chief Technology Officer of Marvell’s Optical and Cloud Connectivity Group. In this role, he manages the development of the company’s optical platform technology and products. Radha joined Marvell from Inphi, where he served as the Senior Vice President and Chief Technology Officer of Platforms.

Radha has been awarded more than 240 US patents and is a Fellow of the IEEE, OSA and IET (UK). In 2006, he was awarded the IEEE/LEOS Aron Kressel Award and in 2022, the IPRM (Indium Phosphide and Related Materials) Award, in recognition of breakthrough work in the development and manufacturing of large scale photonic integrated circuits. In 2023, Radha was named to Electro Optics’ The Photonics100 2024 which honors the industry’s most innovative people. Radha holds a B.Eng. from the National University of Singapore, M.Eng. from the University of Tokyo, and Ph.D. from the University of California, Santa Barbara, all in Electrical Engineering.

Mark is Chief Executive Officer and Co-Founder of Ayar Labs. His prior roles at Ayar Labs include Chief Technology Officer and Senior Vice President of Engineering. He is recognized as a pioneer in photonics technologies and, prior to founding the company, led the team that designed the optics in the world’s first processor to communicate using light. He and his co-founders invented breakthrough technology at MIT and UC Berkeley from 2010-2015 which led to the formation of Ayar Labs. He holds a PhD from University of Colorado.

Monita Pau is currently Strategic Marketing Director for Advanced Packaging at Onto Innovation. She works with business leaders and executives to drive strategic planning and leads the development of collaborative initiatives to drive growth and innovation. With over 15 years of experience, her expertise spans across frontend and backend of line process control solutions as well as specialty materials for advanced packaging and assembly. Prior to joining Onto, she held various positions in applications engineering, marketing and strategic business development at DuPont and KLA. Monita holds a Ph.D. degree in Chemistry from Stanford University.

Eric Lee is the CEO of Scientech Corp. and Chairman of Yayatech. He joined Scientech in 2004, following nearly a decade at UMC, where he held positions in both Taiwan and Singapore from 1995 to 2004.

In addition to his leadership roles at Scientech and Yayatech, Eric serves as President of the International Semiconductor Executive Summit (ISES) Taiwan. He is also a part-time professor in the Advanced Packaging Master’s Program at National Taiwan University of Science and Technology.

Eric contributes actively to the industry through his roles as a member of the SEMI Taiwan Advanced Packaging Committee and as a director of the Taiwan Electronic Equipment Industry Association.

Holds an Electrical Engineering Degree from the DAG Technikum in Würzburg/Germany , an MBA from the Open University Business School in Milton Keynes/UK and am Ph.D in Economics from the Trinity Colleges in Dublin. He has over 30 years global Sales and Marketing experience in the semiconductor equipment industry. During his career he was working with Lam Research, Datacon, Oerlikon Systems and ASMPT AMICRA.

Robert Wanninger is Senior Vice President of the Advanced Backend Solutions (ABS) business unit at SUSS. With leading equipment and process solutions for Imaging, Coating and Bonding applications, SUSS ABS business unit is well positioned to serve the semiconductor industry. Robert brings ~25 years of experience in semiconductor industry. Prior to joining SUSS in 2021, he has worked over 20 years at Infineon in various management positions and spend two years in Korea as COO of LS Power Semitech. He holds a PhD in Chemistry from the University of Regensburg, Germany.

Vikram Turkani, serves as the Director of Technology Partnerships and Strategic Business Development at PulseForge Inc., a prominent technology company specializing in advanced packaging solutions based in Austin, Texas. In this pivotal role, Vikram is instrumental in steering the development and implementation of cutting-edge technologies at PulseForge. Through close collaboration with global technology partners, he ensures the successful transition of these state-of-the-art solutions into practical applications within the market.

Beyond driving the development of innovative technologies, Vikram actively engages with PulseForge’s customers, facilitating the seamless adoption of these innovations on a large scale. In addition to his professional pursuits, Vikram enjoys hiking Texas hill country and exploring the vibrant Austin food scene.

• Holding a Master´s degree in Laser- and Optical Technology from the University of Applied Science Ernst Abbe in Jena Germany
• Expertise in integrating optical waveguides into thin glass sheets for photonic packaging and in laser bonding of photonic components acquired during his work at Fraunhofer IZM and IOF
• He was jointly responsible for the production of the 1st generation of electrostatic chucks for ASML EUV lithography systems and worked for 8 years as leading senior product manager in the E-static Chuck production center in Berlin
• For more than 10 years he is active in the field of semi-conductor packaging for PacTech. He is a specialist for laser-assisted bonding technologies and holds more than 50 patens and publications

Michael is a proven business leader specializing in helping organizations drive business improvement through operation transformation and create sustainable growth. He brings more than 20 years of experience in strategy development and value creation and has served clients across a full spectrum of businesses, including high-tech and semiconductor sectors. Prior to joining AlixPartners, Michael was a Partner at EY-Parthenon and headed its strategy-to-transformation operation service line in APAC, He also held leadership roles in McKinsey, Johnson & Johnson and SAP. Michael holds a master’s degree in business administration from the IMD in Switzerland.

Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

Dr. Yu-Wen Huang is an experienced technologist and system supply chain professional with more than 27 years of working in outsourced semiconductors industry. He is currently the Intel Hsinchu site manager, responsible for site operations and engaged in advanced packaging R&D. Prior to his current undertaking, he was instrumental in driving the assessment and adoption of the China Supply Chain ecosystem that supports various IA platforms like tablets, smart phones, and PC products in China. He led the Global Tech Ecosystem (GTE) Operations team that helped grow Client Computing China biz by enabling China Tech Ecosystem (CTE) ODMs to adopt IA PC roadmap platforms and achieve continuous revenue growth. In 2015 Yu-Wen’s was awarded the prestigious Intel Achievement Award (IAA) for being part of the team that drove 40Mu shipment of IA tablets in China. Before taking the China assignment in 2008, he had been managed Taiwan assembly/test outsourcing operations involving top tier foundries and OSATs for 8 years. Dr. Huang received his Ph.D. in Industrial Engineering from State University of New York, Binghamton. He then joined Institute of Microelectronics (IME), Singapore as Member of Technical Staff from 1997 to 2000, with primary focus on MCM-D module development, UBM characterization, and flip chip bumping process development. He also led FCBGA development programs in the IME initiated consortium.