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This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

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SiC Power Devices: The Core Technology Solution Reshaping the New Energy Landscape

Heming Li

Product Marketing VP

Alpha Power Solutions (Shanghai) Ltd.

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Tackling the Power Wall-Next Level of Integration Technologies in PCB and Substrates

Hong (Rainbow) Yuan

VP of Technology

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

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Bosch advanced SiC chips and modules – Green engine to boost China EV development

Bruno Schuster

Director Power Semiconductors – Regional business development Asia Pacific

Bosch

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Driving the Future with GaN: From Myth to Reality

Henryk Dabrowski

SVP of Global Sales

Cambridge GaN Devices

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eVTOL marketing trend 低空飞行器未来市场趋势

KeDa Xu

Founder & CEO

Falcon Sichuan Aviation Technology Co. Ltd

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Power Semiconductors – The silent Heroes of the future power grid

Tobias Keller

Vice President, Head of global Product Mgt., Portfolio & Marketing

Hitachi Energy Ltd.

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Humanoid Robot and the Application of Semiconductor in It

Jingran Cheng

Software Development Manager

Humanoid Robot Shanghai Co., Ltd.

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Discussion on Chip Applications in the Era of Smart Electric Vehicles

Haoran Jiang

Vice Dean of Research Institute

iCAR Auto

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Small Components, Big Impact: From Power to Signal Integrity for AI Servers by Nexperia

Irene Deng

SVP

Nexperia

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Powering the Future of EVs by Driving Power Density

Dinesh Ramanathan, Ph.D.

Senior Vice President, Corporate Strategy

onsemi

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Opportunities and Challenges for Energy and Power Semiconductors in the AI Era

Alan Zhou, Ph.D.

CEO

Pixelworks

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Renesas Automotive X-in-1 System Solution and Technology Driven by GaN

Johnny Guo

Director, Solutions

Renesas Electronics

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Advanced Packaging Materials Innovation through Co-creative Activities

Hidenori Abe

Executive director, Electronics Business Headquarters and CTO for semiconductor materials

Resonac Holding Corporation

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Plating of Through-Glass-Vias

Marcus Elmar Lang

CTO

Simetric Semiconductor Solutions Co., Ltd.

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Technological development and application, challenges and future trends of SiC power devices

Jun Shi, Ph.D.

Power Module Division Deputy General Manager

Yangzhou Yangjie Electronic Technology Co., Ltd

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Innovations in Power Electronics for xEV and Data Center Applications: The Evolving Roles of Silicon, SiC, and GaN

Gary Huang

Corporate VP, Asia

Yole Group

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