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Innovative Packages, Big Power: The Rise of Advanced Power Packaging
David Clark
VP Product Marketing
Amkor Technology, Inc.
Advanced low inductance SiC Power Module with 3D wiring technology
Thomas Heinzel
Head of Semiconductor Technical Division
Fuji Electric Europe GmbH
Innovation That Scales: Aligning Semiconductor Breakthroughs with Automotive Value Creation
Stefan Obersriebnig
SVP High Voltage Modules
Infineon Technologies AG
Wet Process Technology Roadmap for Power Device Manufacturing
Oliver Whear
Director of Semiconductor Technology
RENA Technologies
Datacenter Trends and Power Architecture evolution
Pietro Scalia
Head of Power System Marketing and Architecture
Renesas Electronics
Empowering Europe’s Semiconductor Future – chances and challenges
Frank Bösenberg
Managing Director
Silicon Saxony
High-tech HV IGBT and SiC Modules Designed for Railway Applications
Ladislav Sobotka, Ph.D.
Director of Engineering and R&D
Skoda Electric
Power Modules at the Crossroads: Enabling Scalable EV Innovation
Kai Konrad
Director Global Semiconductor Purchasing
Stellantis
STMicroelectronics: three decades of SiC innovation leading to 200mm production and full vertical integration
Manuel Gaertner
Director Wide Band Gap & Electrification
STMicroelectronics
Modeling tools for optimization semiconductor manufacturing processes: from material to device
Andrey Smirnov
Director of Business Development
STR
Market outlook and technology trends for power devices in xEV and beyond
Milan Rosina, Ph.D.
Principal Analyst, Power Electronics & Batteries
Yole Group
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