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Considerations in Producing Reliable Known Good Die (KGD) from Wide-Bandgap Wafers
Vernon Rogers
EVP Sales & Marketing
Aehr Test Systems
GaN-on-Si technology for efficient RF front-ends
Bertrand Parvais
Principal Member of Technical Staff
imec
SiC wafer dicing with multi-beam laser: optimal process quality and minimized cost
Kees-Jan Leliveld
Managing Director of ASMPT ALSI and Vice President ASMPT Semiconductor Solutions
ASMPT Limited
EV market trends and the status-quo of automotive power semiconductors.
Stefan Obersriebnig
SVP High Voltage Modules
Infineon Technologies AG
D3GaN as a solution for Electric Car Inverter
Tamara Baksht
CEO
VisIC Technologies
SiC and GaN in future Volkswagen Group applications
Alexander Krick
EVP Technical Development
Volkswagen Group Components
Powering the SIC Revolution with Vertical Integration
Dr. Ajay Poonjal Pai
Director of WBG Innovation & Application Engineering
Sanan Semiconductor
EV Charging Infrastructure Challenges
Nuno Delgado
Electric Mobility Director
Efacec
Navigating Public Funding Opportunities for Europe’s Semiconductor Industry
Marc Isabelle, Ph.D.
Founder & CEO
european economics
Raw material impact on the transition to 200mm SiC device production
Dr. Siegmar Schoser
Project Director Cooperation and external Sourcing
Bosch
Advanced packaging essential for full utilization of SiC semiconductors
Dr. Dominic Dorfner
Senior Vice President Automotive Division
Semikron Danfoss
Wide-bandgap solutions enabling new possibilities in automotive and industrial market
Manuel Gaertner
Director Wide Band Gap & Electrification
STMicroelectronics
Transforming The Power World: The Wide-Bandgap Conversion
Pavel Freundlich
Chief Technology Officer & Vice President, Power Solutions Group
onsemi
Isolation – APackage requirement
Ralf Keggenhoff
Global Director Application Engineering Semiconductor Business Unit
Littelfuse
How do we plan to rock the challenges in E-Mobility transformation?-A first of its kind joint venture undertaking
Dr. Stefan Hain
Head of Power Semiconductor Development
ZF Friedrichshafen AG
Power Electronics market expansion
Claire Troadec
More than Moore Business Line Director
Yole Group
Introducing Silicon Interposers for Power Applications
Ahmed Ammar
Co-Founder, Head of Product
A foundry perspective on Wide Bandgap semiconductors
David Auffret
Automotive Marketing Manager
X-FAB
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