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Revisiting the Necessity and Challenges of Glass Substrates in 3DIC Advanced Packaging
Kinya Ichikawa
Technical Director
3DIC Research Lab
Advancing AI with Energy Efficient Strategies
Deepak Kulkarni, Ph.D.
Senior Fellow Advanced Packaging
AMD
Advanced Packaging Solutions with Direct Atomic Layer Processing (DALP®) Technology
Maksym Plakhotnyuk, Ph.D.
CEO & Founder
ATLANT 3D
Orbital Manufacturing of Next-Generation Semiconductors
Koichi Wakata
Astronaut and Chief Technology Officer
Axiom Space
The Digital Sales Room – The Future of Manufacturing Sales
Nobuaki Watanabe
VP, Centric PXM APAC
Centric Software
Advancing Mobility and Sustainability: DENSO’s Vision for Next-Generation Power Devices and Integrated Power Electronics
Kazuoki Matsugatani, P.h.D.
Senior Director, R&D Center
DENSO CORPORATION
Opening Speech: Latest Trends in Japan’s Semiconductor Strategy
Tomoshige Nambu
Director for IT Industry Division
Ministry of Economy, Trade and Industry (METI)
Exploring the Present and Future of AMHS in Semiconductor Fabs
Daisuke Murata
President and CEO
Murata Machinery
Power Challenges for Next-Generation Vehicles and Murata’s Pursuit of Technological Innovation
Hiroshi Iwatsubo
CTO and Executive Deputy President
Murata Manufacturing
The Future of Computing – a future vision of AI for semiconductors
Norishige (Noly) Morimoto
Vice President and Chief Technology Officer
IBM Japan
Imec’s nanoelectronics research platform: Collaborative approach for breakthrough innovations
Lode Lauwers, Ph.D.
Senior Vice President Business Development and Strategy
imec
New Silicon cycle can be expected
Akira Minamikawa
Senior Consulting Advisor
Informa TechTarget
Memory Bandwidth is All You Need
Takahiro Ogura
President of AI Computing Division
Preferred Networks
Driving the Future of Semiconductor Innovation: AI-Enabled Advanced Nodes and Japan’s Leap Forward
Kazunari Ishimaru, Ph.D.
Senior Managing Executive Officer & CTO, IEEE Fellow
Rapidus Corporation
Tailoring through glass via (TGV) dimensions for glass-core panel substrates
Holger H. Kuehnlein, P.h.D.
SVP Technology
RENA Technologies
Renesas Powering the Future of Robotics
Gaurang Shah
Vice President, Division
Renesas Electronics Corporation
Open Innovation Strategy of Resonac, Co-Creative Chemical Company
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Brightening the Future with Advanced Semiconductor Packaging Technologies
Yasushi Araki
Corporate Officer
SHINKO
Smart Materials, Smarter Systems: Enabling 3D Integration with Engineered Substrates
Christophe Maleville, Ph.D.
Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation
Soitec
TOPPAN’s Challenge in Advanced Semiconductor Packaging
Akihiko Furuya
Executive Officer, Head of Semiconductor Subdivision, Electronics Division
TOPPAN
AI-driven Advanced Packaging – trends, market view and a Japanese perspective
Dimitrios Damianos Ph.D.
Senior Manager Consulting
Yole Group
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