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Breaking Barriers with Glass: A New Era in Semiconductor Integration
Sung Jin Kim, Ph.D.
CTO
Absolics
Atomic-Scale Manufacturing for Next-Gen Advanced Packaging
Maksym Plakhotnyuk, Ph.D.
CEO & Founder
ATLANT 3D
Photonic Fabric ™ : Designing silicon photonics for reliability, scale and deployment
Ankur Aggarwal, Ph.D.
VP of Advanced Packaging & Supply Chain
Celestial AI
Optimizing the Ecosystem for the Semiconductor Industry Gyeonggi Province of Korea
So Jung Yoo
Director, Investment Promotion Division
Gyeonggi Province
imec SiPh technologies for scaling AI Systems
Maarten Willems
Vice President of Global Business Development
imec
From Electrons to Photons: A Lightmatter Perspective on 3D Photonic Interconnect
Ritesh Jain
SVP, Engineering & Operations
Lightmatter
Advancements in High-Power Module Packaging for Traction Inverters in Electric Vehicles
Achim Strass, Ph.D.
Senior Director Technology Scouting and Cooperation
Nexperia
Co-Packaged Optics: Powering the Next Generation of Data Center Connectivity for the AI Era
Liron Gantz, Ph.D.
Research Staff Member
NVIDIA
Innovating Power for an Electrified, Intelligent World
B.Y. Park
Sr. Director, Product Division
onsemi
Invest in Your Future – Invest in Suwon! The Powerhouse of Opportunity in the Suwon Free Economic Zone
Jean Lim
Deputy Director of Investment Promotion Team/Business Attraction Division
SUWON CITY
Advanced Power Packaging for AI Power solution: UTAC’s Thermally Enhanced QFN and 3D Module Solutions for Optimized Efficiency and Integration
Michael Choi
VP of Business Development
UTAC Group
HOW LONG AI WILL FUEL THE SEMICONDUCTOR INDUSTRY?
Emilie Jolivet
Computing, Software & Memory Director
Yole Group
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