Select a 2025 summit below to view its ISES Docs

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

The necessity to have the right logistics partner in South East Asia to support the Global Supply Chain

Brandon Kennedy

Global Managing Director, High-Tech & Industrials

Airspace

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Designing for Tomorrow : Evolving Challenges in Semiconductor Design

J-Wing Teh

Director of Silicon & Systems Design Engineering

AMD

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Semiconductor Packaging Technologies in the AI Era

Dr. JinYoung Khim photo

Dr. JinYoung Khim

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AI in MEMS Manufacturing – A collaborational challenge for the entire value chain

Dr. Florian Schuster

Director of Product Management

Bosch

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Digital: The New Key Strategy of Advanced Manufacturing

Yvonne Keil

Senior Director GF Operations India/Malaysia

GlobalFoundries

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The Future of Advanced Semiconductor Manufacturing

Kok Tiong Ng

SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd

Infineon Technologies AG

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I.S.I.G. Accelerator Program

Salah Nasri

CEO and Co-Founder

International Semiconductor Industry Group (I.S.I.G.)

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InvestPenang

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Harnessing the Benefit of Precious Metals Deposition While Managing Total Cost of Ownership

Richard Oliveri

VP, General Manager

Materion

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LOW COST, SCALABLE and FLEXIBLE line for different types of IC Packaging (LGA, BGA, QFN, SiP, AiP, DrMOS, Power Invertor)

Jimmy Chew

Chief Executive

PEP Innovation

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The Blueprint for Sustainable Fabs

Henri Berthe

Semiconductors Segment VP • Sales

Schneider Electric

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SoC Design with AI: Unlocking Innovation, Efficiency, Complexity Management, and Foundry Collaboration

Michael Woon Chin Liew

Senior Principal Engineer

StarFive Technology International Sdn. Bhd.

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Impact of Generative AI in Advanced Packaging

Dr. Yik Yee Tan photo

Yik Yee Tan, PhD

Senior Technology & Market Analyst, Semiconductor Packaging

Yole Group

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