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Disruption in Semiconductor Industry
Janet Tang
Partner & Managing Director
AlixPartners
Future of AI Hardware Enabled by Advanced Packaging
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD
The Development of Silicon Photonics in Optical Communications, and its Challenges
David Chang, Ph.D.
CTO
AuthenX. Inc
Future Packaging/System Challenges for AI Data Centers
Babak Sabi, Ph.D.
VP of Technology
AWS Annapurna Labs
Static Control for Better Yield for AI & HPC Devices in Manufacturing
Joshua Yoo
President of Core Insight, President of ISES Korea
Core Insight, Inc.
Advanced Probing Materials for Semiconductor Testing
Matthias Wegner, Ph.D.
Head of Innovation
Heraeus Precious Metals
Track the Tariffs; Timely and Targeted Data
Simi Sherman
VP of Research
International Semiconductor Industry Group (I.S.I.G.)
Next-Generation Silicon Photonics and 3-D Technologies for Scaling AI Systems
Joris Van Campenhout
R&D Program Director
imec
Innovations Driving HBM Roadmap
Boon Ong
Sr. Director of Advanced Packaging Technology Development
Micron Technology, Inc.
Revolutionary Acoustic Microscopic Imaging (AMI) Technology for Wafer-Level and Advanced Packaging
Bryan Schackmuth
Senior Product Line Manager
Nordson TEST & INSPECTION
AI Disruption and the Enabling Technology Pillars – Market Update
Romain Fraux
Chief Research Officer
Yole Group
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