Select a 2025 summit below to view its ISES Docs

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

Disruption of the semiconductor industry

Markus Bolte, Ph.D.

Partner

AlixPartners

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Future of AI Hardware Enabled by Advanced Packaging

Raja Swaminathan, Ph.D.

CVP, Advanced Packaging

AMD

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Semiconductor Packaging for the AI Era

Roger St. Amand

CVP, Chiplets/FCBGA/fcCSP BU

Amkor Technology, Inc.

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AP 2.5D & 3D FLI with True Residue-Free Fluxless TCB

Greg Clemons

Sr. Manager Business Development, USA

ASMPT Limited

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Future Packaging/System Challenges for AI Data Centers

Babak Sabi, Ph.D.

VP of Technology

AWS Annapurna Labs

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Optical I/O at Copper Scale and Cost

Near Margalit, Ph.D.

VP & GM

Broadcom

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The Emergence of 5PL: Enabling Revenue Growth & Structural Affordability via High Velocity Supply Chain Adaptability

Stuart Love

Director, Global Supply Chain

DSV Inventory Management Solutions

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AI use cases in semiconductor data analytics and quality management

Bizhan Delgoshaei

Head of Custom Silicon Engineering Operation

Google

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Follow the Data: Timely and Targeted

Simi Sherman

VP of Research

International Semiconductor Industry Group (I.S.I.G.)

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Understand the Present; Predict the Future

Simi Sherman

VP of Research

International Semiconductor Industry Group (I.S.I.G.)

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AI Inspired. Systems Accelerated.

Kevin O’Buckley

SVP and GM Foundry Services

Intel Foundry

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Front-end Semiconductor and Packaging Innovations to Enable an AI Era

Chet Lenox, Ph.D.

Fellow, Industry and Customer Collaboration

KLA

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Is Heterogeneous Integration (HI) ready for Artificial Intelligence (AI)?

Madhavan Swaminathan, Ph.D.

Dept. Head Electrical Engineering

Penn State University

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Open Innovation Strategy of Resonac, Co-Creative Chemical Company

Hidenori Abe

CTO, Semiconductor Materials, Resonac Holdings Corporation

Resonac Corporation

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Enabling the Advanced Packaging industry with HVM solutions for next generation glass core substrates

Roland Rettenmeier

CSO

SCHMID Group

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AI Sustainability Challenges & Solutions

Mark Bidinger

C&I Segment President

Schneider Electric

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Advanced low cost chiplet package for HPC, AI

Nokibul Islam, Ph.D.

Senior Director Business Development

STATS ChipPAC

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VC, Investor Network and Start Up Shark Tank Session_Amazing Cool Technology Corporation_USA_2025

Quick Tsai

Executive Director

Amazing Cool Technology Corporation

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VC, Investor Network and Start Up Shark Tank Session_ATLANT 3D_USA_2025

Bonnie Tsim, Ph.D.

Head of Strategic Initiatives and Growth

ATLANT 3D

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VC, Investor Network and Start Up Shark Tank Session_Kelvin Cooling_USA_2025

Catherine Liu

Co-Founder

Kelvin Cooling

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VC, Investor Network and Start Up Shark Tank Session_Practical OTP Encryption_USA_2025 

Hamid Sadjadpour Ph.D.

Founder

Practical OTP Encryption

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