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Future of AI Hardware Enabled by Advanced Packaging
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD
Semiconductor Packaging for the AI Era
Roger St. Amand
CVP, Chiplets/FCBGA/fcCSP BU
Amkor Technology, Inc.
AP 2.5D & 3D FLI with True Residue-Free Fluxless TCB
Greg Clemons
Sr. Manager Business Development, USA
ASMPT Semiconductor Solutions
Future Packaging/System Challenges for AI Data Centers
Babak Sabi, Ph.D.
VP of Technology
AWS Annapurna Labs
The Emergence of 5PL: Enabling Revenue Growth & Structural Affordability via High Velocity Supply Chain Adaptability
Stuart Love
Director, Global Supply Chain
DSV Inventory Management Solutions
AI use cases in semiconductor data analytics and quality management
Bizhan Delgoshaei
Head of Custom Silicon Engineering Operation
Follow the Data: Timely and Targeted
Simi Sherman
VP of Research
International Semiconductor Industry Group (ISIG)
Understand the Present; Predict the Future
Simi Sherman
VP of Research
International Semiconductor Industry Group (ISIG)
AI Inspired. Systems Accelerated.
Kevin O’Buckley
SVP and GM Foundry Services
Intel Foundry
Front-end Semiconductor and Packaging Innovations to Enable an AI Era
Chet Lenox, Ph.D.
Fellow, Industry and Customer Collaboration
KLA
Is Heterogeneous Integration (HI) ready for Artificial Intelligence (AI)?
Madhavan Swaminathan, Ph.D.
Dept. Head Electrical Engineering
Penn State University
Open Innovation Strategy of Resonac, Co-Creative Chemical Company
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Enabling the Advanced Packaging industry with HVM solutions for next generation glass core substrates
Roland Rettenmeier
CSO
SCHMID Group
AI Sustainability Challenges & Solutions
Mark Bidinger
C&I Segment President
Schneider Electric
Advanced low cost chiplet package for HPC, AI
Nokibul Islam, Ph.D.
Senior Director Business Development
STATS ChipPAC
VC, Investor Network and Start Up Shark Tank Session_Amazing Cool Technology Corporation_USA_2025
Quick Tsai
Executive Director
Amazing Cool Technology Corporation
VC, Investor Network and Start Up Shark Tank Session_ATLANT 3D_USA_2025
Bonnie Tsim, Ph.D.
Head of Strategic Initiatives and Growth
ATLANT 3D
VC, Investor Network and Start Up Shark Tank Session_Kelvin Cooling_USA_2025
Catherine Liu
Co-Founder
Kelvin Cooling
VC, Investor Network and Start Up Shark Tank Session_Practical OTP Encryption_USA_2025
Hamid Sadjadpour Ph.D.
Founder
Practical OTP Encryption
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