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AI Computing on Edge Devices
Bor-Sung Liang, Ph.D
Senior Director, Corporate Strategy & Strategic Technology
MediaTek
Innovative laser assisted bonding processes for next generation advanced packaging
Matthias Fettke
VP Advanced Packaging Equipment
PacTech
Generative AI and Chiplet: Impact on semiconductor industry and position of Taiwan
Jérôme Azemar
Custom Project Business Development Director
Yole Group
RISC-V Accelerating ML Innovation and Beyond
Samuel Chiang
Deputy Technical Director
Andes Technology
Co-Packaged Optics and Solutions for High Volume manufacturing
Dr. Johann Weinhändler
Managing Director
ASMPT Limited
Micro LED Technology and Platform Trend
Sam Chen
Senior Director
Unikorn Semiconductor Corporation
State-of-the art solutions for AI Chip manufacturing
Robert Wanninger
Senior Vice President Business Unit Advanced Backend Solutions
SUSS
The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
Generative AI Driven Advanced Packaging and Materials Innovation
Dr. Bill En
CVP, Foundry Technology and Operations
AMD
Disruptions in Semiconductor Supply Chain
Michael Mo
Partner and Managing Director
AlixPartners
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