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Raw material impact on the transition to 200mm SiC device production
Dr. Siegmar Schoser
Project Director Cooperation and external Sourcing
Bosch
How do we plan to rock the challenges in E-Mobility transformation?-A first of its kind joint venture undertaking
Dr. Stefan Hain
Head of Power Semiconductor Development
ZF Friedrichshafen AG
SiC wafer dicing with multi-beam laser: optimal process quality and minimized cost
Kees-Jan Leliveld
Managing Director of ASMPT ALSI and Vice President ASMPT Semiconductor Solutions
ASMPT Semiconductor Solutions
Power Electronics market expansion
Claire Troadec
More than Moore Business Line Director
Yole Group
Is Europe ready to lead the GaN revolution?
Marnix Tack, Ph.D.
CTO & VP Business Development
Introducing Silicon Interposers for Power Applications
Ahmed Ammar
Co-Founder, Head of Product
Isolation – APackage requirement
Ralf Keggenhoff
Global Director Application Engineering Semiconductor Business Unit
Littelfuse
GaN-on-Si technology for efficient RF front-ends
Bertrand Parvais
Principal Member of Technical Staff
imec
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