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Epitaxy: The lithography of GaN

Dr. Rodney Pelzel photo

Dr. Rodney Pelzel

CTO

IQE

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Raw material impact on the transition to 200mm SiC device production

Dr. Sigmar Schoser photo

Dr. Siegmar Schoser

Project Director Cooperation and external Sourcing

Bosch

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How do we plan to rock the challenges in E-Mobility transformation?-A first of its kind joint venture undertaking

Dr. Stefan Hain

Head of Power Semiconductor Development

ZF Friedrichshafen AG

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SiC wafer dicing with multi-beam laser: optimal process quality and minimized cost

Kees-Jan Leliveld photo

Kees-Jan Leliveld

Managing Director of ASMPT ALSI and Vice President ASMPT Semiconductor Solutions

ASMPT Limited

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GaN: Empower the next Big Wave

Tamara Baksht photo

Tamara Baksht

CEO

VisIC Technologies

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Power Electronics market expansion

Claire Troadec

More than Moore Business Line Director

Yole Group

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Is Europe ready to lead the GaN revolution?

Dr. Marnix Tack photo

Dr. Marnix Tack

CTO & VP Business Development

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Introducing Silicon Interposers for Power Applications

Ahmed Ammar

Co-Founder, Head of Product

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Isolation – APackage requirement

Ralf Keggenhoff

Global Director Application Engineering Semiconductor Business Unit

Littelfuse

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GaN-on-Si technology for efficient RF front-ends

Bertrand Parvais

Principal Member of Technical Staff

imec

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