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Innovation to Enable More Compute From Each Transistor
Dr. Bill En
CVP, Foundry Technology and Operations
AMD
Now is the Time to Re-imagine Memory Centric Computing
Steve Pawlowski
CVP Advanced Memory Systems
Micron Technology
Unleash Product Innovations with 3DFabric
Kam Lee
Senior Director, Advanced Packaging Technology and Service
TSMC
Heterogeneous Integration Platform for Next Generation Computing
Seung Wook Yoon, Ph.D, MBA
Package Group, Product Technology, CVP / Head of Group System LSI
Samsung
New Energy to Semiconductor – Heterogeneous Integration Packaging
Dr. C.P. Hung
Corporate VP RD
ASE
A 360 View of Semiconductor Test from AI and Security Perspective
Michael Chang
VP & GM, Advantest Cloud Solutions
Advantest
Hybrid Bonding: Innovation to Adoption
Abul Nuruzzaman
VP, Technology and IP Licensing
Adeia
GaN is Accelerating e-Mobility
Stephen Coates
GM & VP Global Operations
GaN Systems
Opportunities and Challenges for Power Semiconductor Industry. How can Taiwan Supply Chain Help?
Andy Chuang
Consultant
Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics
Aziza Dada
Sector VP
Airspace
Process Control Challenges in Packaging for High Performance Computing Applications
Monita Pau, Ph.D.
Strategic Marketing Director, Advanced Packaging
Onto Innovation
Challenges and Solution of FLI Technologies in various HI Packaging Architetures
Nelson Fan
VP of AP Product Portfolio Management and Business Development
ASMPT Semiconductor Solutions
Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow
Dr. Christian Ohde
Global Product Director SC/FEC
mks | Atotech
3DIC W2W and D2W Hybrid Bonding
Thomas Schmidt
Product Manager, Bonder Division
SUSS
Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications
Elpin Goh
Sr. Director, Technical Marketing and Business Development, Specialty Technologies
Lam Research Corporation
Thinfilm Technology for Heat Dissipation Layers in HPC Applications
Ralph Zoberbier
CMO
Evatec
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