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Chiplet Ecosystem Acceleration
K.C. Hsu
VP, Research & Development / Integrated Interconnect & Packaging
TSMC
HBM (High Bandwidth Memory) and Advanced Packaging Technology for AI Era
Kangwook Lee, Ph.D.
SVP and Head of PKG Development
SK Hynix
Powering the AI Revolution through Innovations in High Bandwidth Memory
Bret Street
Senior Director of Advanced Packaging
Micron Technology, Inc.
Generative AI Driven Advanced Packaging and Materials Innovation
Dr. Bill En
CVP, Foundry Technology and Operations
AMD
Advanced Packaging Technologies for Heterogenous Integration: Glass Core Package Substrate
Rahul Manepalli, Ph.D.
Intel Fellow; Director Substrate TD Module Engineering
Intel Corporation
Panel Session: Standardization for Chiplet and Advanced Packaging
Kuan-Neng Chen, Ph.D.
Dean/Chair Professor
NYCU
Heterogeneous Integration for Photonic Light Engines
Radha Nagarajan, Ph.D.
SVP & CTO
Marvell Technology
Enabling Metrology, Inspection and Lithography Technologies for AI and HPC Packaging
Monita Pau, Ph.D.
Strategic Marketing Director, Advanced Packaging
Onto Innovation
Co-Packaged Optics and Solutions for High Volume manufacturing
Dr. Johann Weinhändler
Managing Director
ASMPT Limited
State-of-the art solutions for AI Chip manufacturing
Robert Wanninger
Senior Vice President Business Unit Advanced Backend Solutions
SUSS
The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
Innovative laser assisted bonding processes for next generation advanced packaging
Matthias Fettke
VP Advanced Packaging Equipment
PacTech
Disruptions in Semiconductor Supply Chain
Michael Mo
Partner and Managing Director
AlixPartners
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