2-3 December 2025
Tokyo
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K.C. Hsu
VP, Research & Development / Integrated Interconnect & Packaging
TSMC

Kangwook Lee, Ph.D.
SVP and Head of Packaging Development
SK Hynix

Bret Street
Senior Director of Advanced Packaging
Micron Technology

Dr. Bill En
CVP, Foundry Technology and Operations
AMD

Rahul Manepalli, Ph.D.
Intel Fellow & Vice President : Advanced Packaging Technology Development
Intel Corporation

Kuan-Neng Chen, Ph.D.
Dean/Chair Professor
NYCU

Radha Nagarajan, Ph.D.
SVP & CTO, Optics/Data Center Engineering
Marvell Technology

Mark Wade, Ph.D.
CEO and Co-Founder
Ayar Labs

Monita Pau, Ph.D.
Strategic Marketing Director, Advanced Packaging
Onto Innovation

Eric Lee
CEO
Scientech

Dr. Johann Weinhändler
Managing Director
ASMPT Semiconductor Solutions

Robert Wanninger
Senior Vice President Business Unit Advanced Backend Solutions
SUSS

Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge

Matthias Fettke
VP Advanced Packaging Equipment
PacTech

Michael Mo
Partner and Managing Director
AlixPartners
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