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Select a 2024 summit below to view its ISES TV videos
Select a 2023 summit below to view its ISES TV videos
Welcome Speech
Greater Phoenix: A Global Destination for Industrial Innovation
Chris Camacho
President & CEO
Greater Phoenix Economic Council (GPEC)
Unleash Product Innovations with 3DFabric
Dr. Jun He
VP Quality & Reliability, Advanced Packaging Technology & Service
TSMC
Advanced Packaging: Enabling Moore’s Law’s Next Frontier
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD
Processing Innovations to Address the Manufacturing Challenges of Heterogeneous Integration
Len Tedeschi
VP & GM Core Packaging Products
Applied Materials
Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap
Oreste Donzella
Executive Vice President and Chief Strategy Officer
A 360 View of Semiconductor Test from AI and Security Perspective
Claudionor Coelho
Chief AI Officer, SVP of Engineering
Advantest
Package Design and Reliability Need in Server Systems
Viresh Patel
VP Packaging Technology
Renesas Electronics Corporation
Navigating Through a Correction in the Semiconductor Market
Mario Morales
Group VP, Enabling Technologies and Semiconductors
IDC
Not All Nanograined Copper Is Created Equal
Dr. Yun Zhang
Founder & CEO
Shinhao Materials
Valuation of Artificial Intelligence for Semiconductor Equipment
Jon Hander
AVP Panel Products
ASMPT Semiconductor Solutions
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
AICS Solutions to High Value Problems
Keith Best
Director, Product Marketing, Lithography
Onto Innovation
Workforce Diversity Initiatives in the CHIPS Act Panel Session
Amy Leong
Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions
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