Filter by all ISES Docs categories below or browse by year above
Select a 2025 summit below to view its ISES Docs
Select a 2024 summit below to view its ISES Docs
Select a 2023 summit below to view its ISES Docs
Hybrid Bonding: Innovation to Adoption
Abul Nuruzzaman
VP, Technology and IP Licensing
Adeia
A 360 View of Semiconductor Test from AI and Security Perspective
Michael Chang
VP & GM, Advantest Cloud Solutions
Advantest
Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics
Aziza Dada
Sector VP
Airspace
Innovation to Enable More Compute From Each Transistor
Dr. Bill En
CVP, Foundry Technology and Operations
AMD
Unleashing the Power of AI: Opportunities and Challenges Ahead
Dr. Justin Chueh
Director Monolithic and Heterogeneous Integration Department
Etron Technology Inc.
Thinfilm Technology for Heat Dissipation Layers in HPC Applications
Ralph Zoberbier
CMO
Evatec
Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective
Dr. Ming-Der Shieh
CTO of Electronic and Optoelectronic System Research Laborations (EOSL)
Industrial Technology Research Institute (ITRI)
AI Computing in Large-Scale Era – The Golden Age of AI and IC
Bor-Sung Liang, Ph.D
Senior Director, Corporate Strategy & Strategic Technology
MediaTek
How The Semiconductor Industry Is Poised to Enable The Metaverse
Dr. Ofer Shacham
VP, Head of Silicon, at Meta Reality Labs
Meta
Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow
Dr. Christian Ohde
Global Product Director SC/FEC
mks | Atotech
Navigating the Dynamic Memory Market: Trends and Insights
Marco Mezger
COO & Executive Vice President
Neumonda
Process Control Challenges in Packaging for High Performance Computing Applications
Monita Pau, Ph.D.
Strategic Marketing Director, Advanced Packaging
Onto Innovation
Heterogeneous Integration Platform for Next Generation Computing
Seung Wook Yoon, Ph.D, MBA
Package Group, Product Technology, CVP / Head of Group System LSI
Samsung
From Hyperscale Models to Heterogeneous SoCs: Industrializing Neural Network Deployment with ONNC
Luba Tang
CEO
Skymizer Taiwan, Inc.
3DIC W2W and D2W Hybrid Bonding
Thomas Schmidt
Product Manager, Bonder Division
SUSS
End of content
End of content