Select a 2025 summit below to view its ISES Docs

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

Hybrid Bonding: Innovation to Adoption

Abul Nuruzzaman photo

Abul Nuruzzaman

VP, Technology and IP Licensing

Adeia

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A 360 View of Semiconductor Test from AI and Security Perspective

Michael Chang photo

Michael Chang

VP & GM, Advantest Cloud Solutions

Advantest

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Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics

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Aziza Dada

Sector VP

Airspace

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Innovation to Enable More Compute From Each Transistor

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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Turning Metaverse to Photorealistic Digital Twins for Driving Smart Factory Innovations

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CJ Hsieh

COO

ASPEED

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Unleashing the Power of AI: Opportunities and Challenges Ahead

Dr. Justin Chueh photo

Dr. Justin Chueh

Director Monolithic and Heterogeneous Integration Department

Etron Technology Inc.

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Thinfilm Technology for Heat Dissipation Layers in HPC Applications

Ralph Zoberbier

CMO

Evatec

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Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective

Dr. Ming-Der Shieh photo

Dr. Ming-Der Shieh

CTO of Electronic and Optoelectronic System Research Laborations (EOSL)

Industrial Technology Research Institute (ITRI)

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AI Computing in Large-Scale Era – The Golden Age of AI and IC

Dr. Bor-Sung Liang photo

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

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How The Semiconductor Industry Is Poised to Enable The Metaverse

Dr. Ofer Shacham photo

Dr. Ofer Shacham

VP, Head of Silicon, at Meta Reality Labs

Meta

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Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow

Dr. Christian Ohde photo

Dr. Christian Ohde

Global Product Director SC/FEC

mks | Atotech

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Navigating the Dynamic Memory Market: Trends and Insights

Marco Mezger photo

Marco Mezger

COO & Executive Vice President

Neumonda

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Process Control Challenges in Packaging for High Performance Computing Applications

Monita Pau, Ph.D.

Strategic Marketing Director, Advanced Packaging

Onto Innovation

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Heterogeneous Integration Platform for Next Generation Computing

Dr. Seungwook Yoon photo

Seung Wook Yoon, Ph.D, MBA

CVP Business Development Team, AVP

Samsung Electronics

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From Hyperscale Models to Heterogeneous SoCs: Industrializing Neural Network Deployment with ONNC

Luba Tang photo

Luba Tang

CEO

Skymizer Taiwan, Inc.

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3DIC W2W and D2W Hybrid Bonding

Thomas Schmidt photo

Thomas Schmidt

Product Manager, Bonder Division

SUSS

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