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Advanced Packaging: Enabling Moore’s Law’s Next Frontier
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD
Valuation of Artificial Intelligence for Semiconductor Equipment
Jon Hander
AVP Panel Products
ASMPT Limited
The future of Advanced Packaging Inspection is X-ray
Enrico Härtel
Director Global Key Account Management
Comet
Mix and Matching Chiplets with the Economics of PCB Design
Ramin Farjadrad
Co-Founder & CEO
Eliyan
Wall Street Perspectives on the Semiconductor Market
Tom Stokes
Senior Managing Director
Evercore
Greater Phoenix: A Global Destination for Industrial Innovation
Chris Camacho
President & CEO
Greater Phoenix Economic Council (GPEC)
Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap
Oreste Donzella
Executive Vice President and Chief Strategy Officer
KLA
Advancing the Semiconductor Industry, TOGETHER
Andrew Goh
CVP & GM, Advanced Packaging Customer Operations
Lam Research Corporation
The New Packaging Math: 2x + 4y = 1
Wolfgang Sauter
Customer Solutions Architect, Packaging
Marvell Technology
Advanced Silicon Wafers for Optimized MEMS and RF Device Performance
Dr. Atte Haapalinna
CTO
Okmetic Oy
AICS Solutions to High Value Problems
Keith Best
Director, Product Marketing, Lithography
Onto Innovation
Package Design and Reliability Need in Server Systems
Viresh Patel
VP Packaging Technology
Renesas Electronics
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
CTO, Semiconductor Materials, Resonac Holdings Corporation
Resonac Corporation
Revitalizing Domestic Semiconductor Manufacturing: Challenges, Opportunities and Emerging Applications
Thomas Sonderman
President & CEO
SkyWater Technology
Are New CS Markets Pushing Reliability Culture Shift?
Roland Shaw
President of Accel-RF
STAr Technologies
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