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Piezoelectric MEMS Platform for Sensing and RF Applications
Dr. Yul Koh
Senior Scientist
Institute of Microelectronics, A*STAR
Silicon Photonics and its Challenges
Arjun Kumar Kantimahanti
R&D Engineer
Broadcom
Zero Emission Becomes Real in Next-Generation Mobility
CS Chua
President & Managing Director
Infineon Technologies AG
Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging
Teng Chow Ooi
Sr Director Program Office
Intel Corporation
Panel Level Packaging Requires the Same Wet Process Performance As Wafer Level Packaging
Herbert Oetzlinger
VP, Panel Product Line Head • Panel Product Management
Lam Research Corporation
Future Opportunities: Semiconductors Packaging
Amarjit Sandhu
CVP of Assembly and Test, NAND Operations
Micron Technology
MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia
Thiagesh K Lingam
Senior Director
MIMOS
More than Moore Emerging Technologies for the Sensing Needs in EV
Eloi Marigo, Ph.D.
Senior Manager
SilTerra
Western Digital’s Semiconductor Odyssey: Charting a Course for Innovation and Business Growth
YT Chin
Senior Director, Flash Backend Engineering
Western Digital
Global Vehicle Electrification Trends and BEV Opportunities in the Developing World
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Yole Group
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