Select a 2025 summit below to view its ISES Docs

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

Chiplets and System Integration – Key Concepts and Implementation

Jianmin Li photo

Jianmin Li

Packaging R&D Director, Amkor Technology China, Inc.

Amkor Technology, Inc.

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SiC – A Yin and Yang Perspective

Ralf Bornefeld photo

Ralf Bornefeld

SVP Power Semiconductors & Modules

Bosch

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Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging

Laurent Giai-Miniet photo

Laurent Giai-Miniet

CEO

ERS electronic GmbH

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Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective

Rainer Kaesmaier, Ph.D.

Managing Director Semiconductors

Hitachi Energy Ltd.

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Fu Lu Shou – The Three Lucky Stars of Power

Mark Nils Münzer photo

Mark Nils Münzer

Distinguished Engineer Innovation & Emerging Technologies Automotive High Power

Infineon Technologies AG

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Heterogeneous Integration Enabled by Advanced Chiplet Packaging

Dr. Yang Cheng photo

Dr. Yang Cheng

Senior Director Design Service BU

JCET

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Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

Dr. Stefan Pieper

Global Application Manager

mks | Atotech

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How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges

Tong Wu, Ph.D.

Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications

onsemi

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Advanced Packaging Materials and Evaluation Platform at Resonac

Hidenori Abe

CTO, Semiconductor Materials, Resonac Holdings Corporation

Resonac Corporation

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Innovation in Power & Energy Management is Key to Support a Sustainable Future

Francesco Muggeri photo

Francesco Muggeri

VP Marketing & Applications, Power Discrete & Analog, China, STMicroelectronics

STMicroelectronics

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Tailored Solutions for the Semiconductor Industry Powered by TRUMPF

Dariusz Czaja photo

Dariusz Czaja

Managing Director of TRUMPF Huettinger Asia

TRUMPF Huettinger

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GaN HEMT for Electric Car Inverter: Breakthroughs and Challenges

Jim Jian photo

Jim Jian

VP Sales APAC and NA

VisIC Technologies

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The Challenges in Getting a Reliable SiC Device

Dr. Hongchao Liu photo

Dr. Hongchao Liu 刘红超

SVP/Chief Scientist

Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)

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Memory and Processors for Chiplet Designs

Simone Bertolazzi, PhD. photo

Simone Bertolazzi, PhD.

Principal Technology & Market Analyst

Yole Intelligence

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Semiconductors and Sustainability – Why Going Green is Chip Driven

Julian Fieres photo

Julian Fieres

Vice President Transformation, Strategy, Sustainability & Digitalization

ZF Friedrichshafen AG

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