Filter by all ISES Docs categories below or browse by year above
Select a 2025 summit below to view its ISES Docs
Select a 2024 summit below to view its ISES Docs
Select a 2023 summit below to view its ISES Docs
How Laser is Enabling The Power Semiconductor Roadmap
Jeroen van Borkulo
Head of Business & Marketing
ASMPT Semiconductor Solutions
BelGaN – Moving to The Next Chapter
Marnix Tack, Ph.D.
CTO & VP Business Development
ICeGaN: the Call of the GaN Revolution
Giorgia Longobardi, Ph.D.
Founder and CEO
Cambridge GaN Devices
The EDA breakthrough solution for SiC and GaN Front-End and Back-End
Luca Lillacci
General Manager
EDA Industries S.p.a
Opening Address
Lucilla Sioli
Director Artificial Intelligence and Digital Industry
EU Commission
Thin Film Solutions for Wide Bang Gap (WBG) Power Devices
Dr. Vinoth Sundaramoorthy
Product Marketing Manager
Evatec
The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem
Dr. Thomas Morgenstern
EVP Frontend IFAG FE
Infineon Technologies AG
Innoscience’s GaN Power Devices: Reliable, Price Competitive and Mass Manufactured
Denis Marcon, Ph.D.
General Manager and SVP
Innoscience
Process Control Trends for WBG Power Devices
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Dr. Christian Ohde
Global Product Director SC/FEC
mks | Atotech
GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?
Bas Verheijen
Senior Director GaN Technology and Operations
Nexperia
Customized Silicon and SOI Wafers Enabling Enhanced Power Devices
Dr. Atte Haapalinna
CTO
Okmetic Oy
Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection
Dr. Vamsi Velidandla
Senior Director, Product Management
Onto Innovation
SiC / IGBT Power Module Assembly & Test Equipment Solutions
Michael Koelbl
General Manager Pentamaster Automation Germany GmbH
Pentamaster Technology Sdn. Bhd.
Empowering Power Electronics Packaging Through Photonic Debonding
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
Future of SiC Power Modules in Automotive and Industrial Applications
Claus A Petersen
President
Semikron Danfoss GmbH
Innovative Traction Drives with SiC Semiconductors
Ladislav Sobotka, Ph.D.
Director of Engineering and R&D
Skoda Electric
Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive
Ph.D. Emmanuel Sabonnadière
VP Division Automotive & Industrial
Soitec
Addressing Testing Challenges for Power Modules and Three-Level Inverters
Elia Petrogalli
Sales Manager Semi & MEMS Business Unit
SPEA S.p.A.
Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?
Roland Shaw
President of Accel-RF
STAr Technologies
TEL: Moving Into the MAGIC Era of Semiconductors
Neil Armstrong
Director Sales Development
Tokyo Electron
Total Solution of Process Kits to Enabling an Efficient Supply Chain in FAB
Jimmy Tao
Marketing Director
Tessvida
Volkswagen Group – Power Electronics In-House Development
Alexander Krick
Executive Vice President
Volkswagen Group Technology
End of content
End of content