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Microchannel particle deposition for MEMS & Sensors Applications
Thomas Russell
CEO and Co-Founder
Mesoline B.V.
How The Semiconductor Industry Is Poised to Enable The Metaverse
Dr. Ofer Shacham
VP, Head of Silicon, at Meta Reality Labs
Meta
Unlocking the Unseen: Polarization Image Sensing for Consumer Electronics
Rob Devlin, Ph.D.
Co-Founder & CEO
Metalenz
Japan’s Policy Trends in Semiconductor and Digital Industry Strategy
Hisashi Kanazashi
Director IT Division
Ministry of Economy, Trade and Industry (METI)
Future Opportunities: Semiconductors Packaging
Amarjit Sandhu
CVP of Assembly and Test, NAND Operations
Micron Technology
Innovations Driving HBM Roadmap
Boon Ong
Sr. Director of Advanced Packaging Technology Development
Micron Technology
Silicon Manufacturing and Packaging at MSFT in the Cloud/AI era
Sriram Srinivasan
Partner Silicon Packaging Technology
Microsoft
MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia
Thiagesh K Lingam
Senior Director
MIMOS
Electroless Metallization of power semiconductor devices – challenges and benefits 功率半导体器件的化学镀金属化—挑战与机遇
Dr. Stefan Pieper
Global Application Manager
mks | Atotech
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Dr. Christian Ohde
Global Product Director SC/FEC
mks | Atotech
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Dr. Stefan Pieper
Global Application Manager
mks | Atotech
Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow
Dr. Christian Ohde
Global Product Director SC/FEC
mks | Atotech
Invest in Oman
Mohammed bin Ali bin Mohammed Al Lawati
Director of Investment Promotion Department by Delegation
Ministry of Commerce, Industry & Investment Promotions (MOCIIP)
Fan-out Wafer Level MEMS Packaging for Automotive Applications
Senni Laaksonen
SVP Research and Development
Murata Manufacturing Co., Ltd.
High Performance MEMS Inertial Sensors Enabling Advanced Mobility
Senni Laaksonen
SVP Research and Development
Murata Manufacturing Co., Ltd.
Next-Generation GaN/SiC To Accelerate Electrification
Gene Sheridan
CEO
Navitas Semiconductor
Navigating the Dynamic Memory Market: Trends and Insights
Marco Mezger
COO & Executive Vice President
Neumonda
GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?
Bas Verheijen
Senior Director GaN Technology and Operations
Nexperia
Advancements in High-Power Module Packaging for Traction Inverters in Electric Vehicles
Achim Strass, Ph.D.
Senior Director Technology Scouting and Cooperation
Nexperia
The Power of Choice: Expanding the SiC Device Portfolio to Drive Market Growth
Katrin Feurle
Senior Director & General Manager SiC Discretes & Modules
Nexperia
Revolutionary Acoustic Microscopic Imaging (AMI) Technology for Wafer-Level and Advanced Packaging
Bryan Schackmuth
Senior Product Line Manager
Nordson TEST & INSPECTION
MEMS inertial sensors for navigation applications
Stefan Rombach
Head of MEMS
Northrop Grumman LITEF GmbH
Co-Packaged Optics: Powering the Next Generation of Data Center Connectivity for the AI Era
Liron Gantz, Ph.D.
Research Staff Member
NVIDIA
Customized Silicon and SOI Wafers Enabling Enhanced Power Devices
Dr. Atte Haapalinna
CTO
Okmetic Oy
Advanced Silicon Wafers for Optimized MEMS and RF Device Performance
Dr. Atte Haapalinna
CTO
Okmetic Oy
Transforming the Sensor Market through a New Topology for MEMS
Eric Aguilar
CEO
Omnitron Sensors
How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges
Tong Wu, Ph.D.
Leader of China Automotive Solution Team
onsemi
Transforming The Power World: The Wide-Bandgap Conversion
Pavel Freundlich
Chief Technology Officer & Vice President, Power Solutions Group
onsemi
Powering the Future of EVs by Driving Power Density
Dinesh Ramanathan, Ph.D.
Senior Vice President, Corporate Strategy
onsemi
Innovating Power for an Electrified, Intelligent World
B.Y. Park
Sr. Director, Product Division
onsemi
AICS Solutions to High Value Problems
Keith Best
Director, Product Marketing, Lithography
Onto Innovation
Challenges to enabling the transition from organic to glass core substrates as RDL approaches 2 µm l/s and beyond
Keith Best
Director, Product Marketing, Lithography
Onto Innovation
Meeting Challenges in MEMS with Advanced Metrology and Inspection Capabilities
Mike Rosa, Ph.D.
CMO & SVP Strategy
Onto Innovation
Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection
Dr. Vamsi Velidandla
Senior Director, Product Management
Onto Innovation
Process Control Challenges in Packaging for High Performance Computing Applications
Monita Pau, Ph.D.
Strategic Marketing Director, Advanced Packaging
Onto Innovation
Metrology and Inspection Solutions for SiC and GaN Power Devices
Jiangtao Hu
Sr. Director Product Marketing
Onto Innovation
The Special Economic Zones, Free Zones and Industrial Zones in Oman
Thuraiya Al Zarafy
Investment Promotion & Business Development – Acting Manager
OPAZ
How Optotune’s Products for Dynamic Light Control Benefit AR/VR Applications
Dr. David Leuenberger
Head of Product Management
Optotune
Innovative laser assisted bonding processes for next generation advanced packaging
Matthias Fettke
VP Advanced Packaging Equipment
PacTech
Is Heterogeneous Integration (HI) ready for Artificial Intelligence (AI)?
Madhavan Swaminathan, Ph.D.
Dept. Head Electrical Engineering
Penn State University
SiC / IGBT Power Module Assembly & Test Equipment Solutions
Michael Koelbl
General Manager Pentamaster Automation Germany GmbH
Pentamaster Technology Sdn. Bhd.
Power semiconductor Reliability Test & Handling Equipment Solutions
Alex Liew
SVP, Sales & Operations
Pentamaster Technology Sdn. Bhd.
Demands for sensor test from development to high-volume manufacturing
Ari Kuukkala
Development Manager
Pentamaster Technology Sdn. Bhd.
LOW COST, SCALABLE and FLEXIBLE line for different types of IC Packaging (LGA, BGA, QFN, SiP, AiP, DrMOS, Power Invertor)
Jimmy Chew
Chief Executive
PEP Innovation
Smart tires : powerful sensors for modern mobility
Corrado Rocca
R&D Head, Cyber Unit
Pirelli
Opportunities and Challenges for Energy and Power Semiconductors in the AI Era
Alan Zhou, Ph.D.
CEO
Pixelworks
US Based Equipment Manufacturer For Compounds Semiconductor Applications
Yannick Pilloux
VP EMEA
Plasma-Therm
Silicon fab transformed through CHIPS: A new US 200mm foundry launches to deliver power innovation and high-volume manufacturing
Surya Iyer, Ph.D.
President & COO
Polar Semiconductor
Leveraging a robust and established technology from a partner, U.S. Power Foundry plans to offer advanced GaN device mass production at 200mm
Surya Iyer, Ph.D.
President & COO
Polar Semiconductor
Using MEMS and optics to create a unique solution for present and future applications
Jon Edwards
VP Business Development
PoLight ASA
Empowering Power Electronics Packaging Through Photonic Debonding
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
Wet Process Technology Roadmap for Power Device Manufacturing
Oliver Whear
Director of Semiconductor Technology
RENA Technologies
Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry
Shinichi Yoshioka
Senior Vice President and Chief Technology Officer
Renesas Electronics
Package Design and Reliability Need in Server Systems
Viresh Patel
VP Packaging Technology
Renesas Electronics
Renesas Automotive X-in-1 System Solution and Technology Driven by GaN
Johnny Guo
Director, Solutions
Renesas Electronics
Datacenter Trends and Power Architecture evolution
Pietro Scalia
Head of Power System Marketing and Architecture
Renesas Electronics
xEVs – From Power Semiconductors to the Power Ecosystem
Avinash Kashyap Ph.D
VP & GM of the Discrete & Wide Bandgap Power BU
Advanced Packaging/Substrate Materials and Open innovation Platform
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Holding Corporation
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Holding Corporation
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Holding Corporation
Advanced Packaging Materials Innovation through Co-creative Activities
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Holding Corporation
Open Innovation Strategy of Resonac, Co-Creative Chemical Company
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Holding Corporation
Going Vertical With MEMS: Unfolding System-Level Development Of Scanning Micromirror Technologies
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Silicon Austria Labs (SAL)
Leading a World Class Research Institute
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Silicon Austria Labs (SAL)
Heterogeneous Integration Platform for Next Generation Computing
Seung Wook Yoon, Ph.D, MBA
Package Group, Product Technology, CVP / Head of Group System LSI
Samsung Electronics
Powering the SIC Revolution with Vertical Integration
Ajay Poonjal Pai, Ph.D.
Director, Head of WBG Innovation & Application Engineering
Sanan Semiconductor
Enabling the Advanced Packaging industry with HVM solutions for next generation glass core substrates
Roland Rettenmeier
CSO
SCHMID Group
The Blueprint for Sustainable Fabs
Henri Berthe
Semiconductors Segment VP • Sales
Schneider Electric
AI Sustainability Challenges & Solutions
Mark Bidinger
C&I Segment President
Schneider Electric
Future of SiC Power Modules in Automotive and Industrial Applications
Claus A Petersen
President
Semikron Danfoss GmbH
Advanced packaging essential for full utilization of SiC semiconductors
Dominic Dorfner, Ph.D.
President & CEO
Semikron Danfoss GmbH
SITRI – MEMS Sensor and SiPh R&D Pilot Line Platform
Bo Cui
Senior Director of Research
Shanghai Industrial Technology Research Institute (SITRI)
Unfolding the Future: Driving Research and Innovation for Automotive Applications 未来展望：推动汽车应用的研究与创新
Angeline Tee
Senior Management | Strategic Planning & Partnership Management
Silicon Austria Labs (SAL)
MEMS at the crossroads of innovation – Converging with emerging technologies
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Silicon Austria Labs (SAL)
The Camera Module Industry and the Opportunity for MEMS and Micro-Manufacturing
Dr. Siavash Pourkamali
Founder & CEO
Silicon Dynamix
Empowering Europe’s Semiconductor Future – chances and challenges
Frank Bösenberg
Managing Director
Silicon Saxony
More than Moore Emerging Technologies for the Sensing Needs in EV
Eloi Marigo, Ph.D.
Senior Manager
SilTerra
Monolithic CMOS-MEMS Foundry Convergence: Unlocking the Future of Piezoelectric Sensors and Emerging Technologies
Eloi Marigo, Ph.D.
Senior Manager
SilTerra
Plating of Through-Glass-Vias
Marcus Elmar Lang
CTO
Simetric Semiconductor Solutions Co., Ltd.
Semiconductors: Powering the Future and Driving the Global Economy
Robert Quinn
Founder
SIMEU
Challenges and Opportunities of the Semiconductors Industry in the MENA Region: An Egyptian Perspective
Dr. Hisham Haddara
Chairman and Founder
SiWare Systems
SK Siltron CSS navigating the global uncertainties with advances in 200mm technology and readiness
Edward Chen
VP Commercial
SK Siltron CSS
Innovative Traction Drives with SiC Semiconductors
Ladislav Sobotka, Ph.D.
Director of Engineering and R&D
Skoda Electric
High-tech HV IGBT and SiC Modules Designed for Railway Applications
Ladislav Sobotka, Ph.D.
Director of Engineering and R&D
Skoda Electric
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