Select a 2025 summit below to view its ISES Docs

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

Microchannel particle deposition for MEMS & Sensors Applications

Thomas Russell

CEO and Co-Founder

Mesoline B.V.

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How The Semiconductor Industry Is Poised to Enable The Metaverse

Dr. Ofer Shacham photo

Dr. Ofer Shacham

VP, Head of Silicon, at Meta Reality Labs

Meta

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Unlocking the Unseen: Polarization Image Sensing for Consumer Electronics

Rob Devlin, Ph.D.

Co-Founder & CEO

Metalenz

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Japan’s Policy Trends in Semiconductor and Digital Industry Strategy

Hisashi Kanazashi photo

Hisashi Kanazashi

Director IT Division

Ministry of Economy, Trade and Industry (METI)

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Future Opportunities: Semiconductors Packaging

Amarjit Sandhu photo

Amarjit Sandhu

CVP of Assembly and Test, NAND Operations

Micron Technology, Inc.

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Innovations Driving HBM Roadmap

Boon Ong

Sr. Director of Advanced Packaging Technology Development

Micron Technology, Inc.

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Silicon Manufacturing and Packaging at MSFT in the Cloud/AI era

Sriram Srinivasan photo

Sriram Srinivasan

Partner Silicon Packaging Technology

Microsoft

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MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia

Thiagesh K Lingam photo

Thiagesh K Lingam

Senior Director

MIMOS

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Electroless Metallization of power semiconductor devices – challenges and benefits 功率半导体器件的化学镀金属化—挑战与机遇

Dr. Stefan Pieper

Global Application Manager

mks | Atotech

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Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow

Dr. Christian Ohde photo

Dr. Christian Ohde

Global Product Director SC/FEC

mks | Atotech

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Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

Dr. Christian Ohde photo

Dr. Christian Ohde

Global Product Director SC/FEC

mks | Atotech

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Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

Dr. Stefan Pieper

Global Application Manager

mks | Atotech

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Invest in Oman

Mohammed bin Ali bin Mohammed Al Lawati photo

Mohammed bin Ali bin Mohammed Al Lawati

Director of Investment Promotion Department by Delegation

Ministry of Commerce, Industry & Investment Promotions (MOCIIP)

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MSWS EU 2025 Agenda

No linked agenda item found.

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MSWS USA 2025 Agenda

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MSWS USA 2025_Post Show Report

No linked agenda item found.

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Fan-out Wafer Level MEMS Packaging for Automotive Applications

Senni Laaksonen

SVP Research and Development

Murata Manufacturing Co., Ltd.

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High Performance MEMS Inertial Sensors Enabling Advanced Mobility

Senni Laaksonen

SVP Research and Development

Murata Manufacturing Co., Ltd.

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MWS EU 2023 Agenda

No linked agenda item found.

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MWS EU 2023 Post Show Report

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MWS EU 2024 Agenda

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MWS EU 2024_Post Show Report

No linked agenda item found.

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Next-Generation GaN/SiC To Accelerate Electrification

Gene Sheridan

CEO

Navitas Semiconductor

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Navigating the Dynamic Memory Market: Trends and Insights

Marco Mezger photo

Marco Mezger

COO & Executive Vice President

Neumonda

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GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?

Bas Verheijen photo

Bas Verheijen

Senior Director GaN Technology and Operations

Nexperia

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Small Components, Big Impact: From Power to Signal Integrity for AI Servers by Nexperia

Irene Deng

SVP

Nexperia

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Advancements in High-Power Module Packaging for Traction Inverters in Electric Vehicles

Achim Strass, Ph.D.

Senior Director Technology Scouting and Cooperation

Nexperia

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The Power of Choice: Expanding the SiC Device Portfolio to Drive Market Growth

Katrin Feurle

Senior Director & General Manager SiC Discretes & Modules

Nexperia

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Revolutionary Acoustic Microscopic Imaging (AMI) Technology for Wafer-Level and Advanced Packaging

Bryan Schackmuth

Senior Product Line Manager

Nordson TEST & INSPECTION

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MEMS inertial sensors for navigation applications

Stefan Rombach

Head of MEMS

Northrop Grumman LITEF GmbH

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Co-Packaged Optics: Powering the Next Generation of Data Center Connectivity for the AI Era

Liron Gantz, Ph.D.

Research Staff Member

NVIDIA

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Advanced Silicon Wafers for Optimized MEMS and RF Device Performance

Dr. Atte Haapalinna photo

Dr. Atte Haapalinna

CTO

Okmetic Oy

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Customized Silicon and SOI Wafers Enabling Enhanced Power Devices

Dr. Atte Haapalinna photo

Dr. Atte Haapalinna

CTO

Okmetic Oy

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Scenario of Semi Industry Recovery

Akira Minamikawa photo

Akira Minamikawa

Senior Analyst

OMDIA

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Transforming the Sensor Market through a New Topology for MEMS

Eric Aguilar

CEO

Omnitron Sensors

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MEMS Breaks Through the AI Bottleneck

Eric Aguilar

CEO

Omnitron Sensors

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Transforming The Power World: The Wide-Bandgap Conversion

Pavel Freundlich

Chief Technology Officer & Vice President, Power Solutions Group

onsemi

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How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges

Tong Wu, Ph.D.

Leader of China Automotive Solution Team

onsemi

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Powering the Future of EVs by Driving Power Density

Dinesh Ramanathan, Ph.D.

Senior Vice President, Corporate Strategy

onsemi

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Innovating Power for an Electrified, Intelligent World

B.Y. Park

Sr. Director, Product Division

onsemi

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AICS Solutions to High Value Problems

Keith Best photo

Keith Best

Director, Product Marketing, Lithography

Onto Innovation

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Meeting Challenges in MEMS with Advanced Metrology and Inspection Capabilities

Mike Rosa, Ph.D.

CMO & SVP Strategy

Onto Innovation

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Challenges to enabling the transition from organic to glass core substrates as RDL approaches 2 µm l/s and beyond

Keith Best photo

Keith Best

Director, Product Marketing, Lithography

Onto Innovation

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Process Control Challenges in Packaging for High Performance Computing Applications

Monita Pau, Ph.D.

Strategic Marketing Director, Advanced Packaging

Onto Innovation

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Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection

Dr. Vamsi Velidandla photo

Dr. Vamsi Velidandla

Senior Director, Product Management

Onto Innovation

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Metrology and Inspection Solutions for SiC and GaN Power Devices

Jiangtao Hu

Sr. Director Product Marketing

Onto Innovation

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The Special Economic Zones, Free Zones and Industrial Zones in Oman

Thuraiya Al Zarafy photo

Thuraiya Al Zarafy

Investment Promotion & Business Development – Acting Manager

OPAZ

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How Optotune’s Products for Dynamic Light Control Benefit AR/VR Applications

Dr. David Leuenberger photo

Dr. David Leuenberger

Head of Product Management

Optotune

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Innovative laser assisted bonding processes for next generation advanced packaging

Matthias Fettke photo

Matthias Fettke

VP Advanced Packaging Equipment

PacTech

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Is Heterogeneous Integration (HI) ready for Artificial Intelligence (AI)?

Madhavan Swaminathan, Ph.D.

Dept. Head Electrical Engineering

Penn State University

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SiC / IGBT Power Module Assembly & Test Equipment Solutions

Michael Koelbl photo

Michael Koelbl

General Manager Pentamaster Automation Germany GmbH

Pentamaster Technology Sdn. Bhd.

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Power semiconductor Reliability Test & Handling Equipment Solutions

Alex Liew

SVP, Sales & Operations

Pentamaster Technology Sdn. Bhd.

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Demands for sensor test from development to high-volume manufacturing

Ari Kuukkala

Development Manager

Pentamaster Technology Sdn. Bhd.

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LOW COST, SCALABLE and FLEXIBLE line for different types of IC Packaging (LGA, BGA, QFN, SiP, AiP, DrMOS, Power Invertor)

Jimmy Chew

Chief Executive

PEP Innovation

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Smart tires : powerful sensors for modern mobility

Corrado Rocca

R&D Head, Cyber Unit

Pirelli

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Opportunities and Challenges for Energy and Power Semiconductors in the AI Era

Alan Zhou, Ph.D.

CEO

Pixelworks

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US Based Equipment Manufacturer For Compounds Semiconductor Applications

Yannick Pilloux photo

Yannick Pilloux

VP EMEA

Plasma-Therm

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Silicon fab transformed through CHIPS: A new US 200mm foundry launches to deliver power innovation and high-volume manufacturing

Surya Iyer, Ph.D.

President & COO

Polar Semiconductor

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Leveraging a robust and established technology from a partner, U.S. Power Foundry plans to offer advanced GaN device mass production at 200mm

Surya Iyer, Ph.D.

President & COO

Polar Semiconductor

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Using MEMS and optics to create a unique solution for present and future applications

Jon Edwards photo

Jon Edwards

VP Business Development

PoLight ASA

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Empowering Power Electronics Packaging Through Photonic Debonding

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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Move to GaN for high-efficiency inverters

Rupert Baines

CEO

QPT Ltd

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Transforming Industrial Manufacturing: Harnessing the Potential of Ultra High Viscosity Jetting for Functional Printing

Ramon Borrell photo

Ramon Borrell

CTO

Quantica

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Wet Process Technology Roadmap for Power Device Manufacturing

Oliver Whear

Director of Semiconductor Technology

RENA Technologies GmbH

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Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry

Shinichi Yoshioka photo

Shinichi Yoshioka

Senior Vice President and Chief Technology Officer

Renesas Electronics

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Package Design and Reliability Need in Server Systems

Viresh Patel photo

Viresh Patel

VP Packaging Technology

Renesas Electronics

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Renesas Automotive X-in-1 System Solution and Technology Driven by GaN

Johnny Guo

Director, Solutions

Renesas Electronics

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Datacenter Trends and Power Architecture evolution

Pietro Scalia

Head of Power System Marketing and Architecture

Renesas Electronics

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xEVs – From Power Semiconductors to the Power Ecosystem

Avinash Kashyap Ph.D

VP & GM of the Discrete & Wide Bandgap Power BU

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Advanced Packaging/Substrate Materials and Open innovation Platform

Hidenori Abe

Executive director, Electronics Business Headquarters and CTO for semiconductor materials

Resonac Holding Corporation

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Advanced Packaging Materials and Evaluation Platform at Resonac

Hidenori Abe

Executive director, Electronics Business Headquarters and CTO for semiconductor materials

Resonac Holding Corporation

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Advanced Packaging Materials and Evaluation Platform at Resonac

Hidenori Abe

Executive director, Electronics Business Headquarters and CTO for semiconductor materials

Resonac Holding Corporation

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Advanced Packaging Materials Innovation through Co-creative Activities

Hidenori Abe

Executive director, Electronics Business Headquarters and CTO for semiconductor materials

Resonac Holding Corporation

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Open Innovation Strategy of Resonac, Co-Creative Chemical Company

Hidenori Abe

Executive director, Electronics Business Headquarters and CTO for semiconductor materials

Resonac Holding Corporation

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Going Vertical With MEMS: Unfolding System-Level Development Of Scanning Micromirror Technologies

Mohssen Moridi, Ph.D.

Senior Executive Director & Head of the Microsystems Research Division

Silicon Austria Labs (SAL)

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Leading a World Class Research Institute

Mohssen Moridi, Ph.D.

Senior Executive Director & Head of the Microsystems Research Division

Silicon Austria Labs (SAL)

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Heterogeneous Integration Platform for Next Generation Computing

Seung Wook Yoon, Ph.D, MBA

Package Group, Product Technology, CVP / Head of Group System LSI

Samsung Electronics

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Powering the SIC Revolution with Vertical Integration

Ajay Poonjal Pai, Ph.D.

Director, Head of WBG Innovation & Application Engineering

Sanan Semiconductor

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Enabling the Advanced Packaging industry with HVM solutions for next generation glass core substrates

Roland Rettenmeier

CSO

SCHMID Group

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The Blueprint for Sustainable Fabs

Henri Berthe

Semiconductors Segment VP • Sales

Schneider Electric

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AI Sustainability Challenges & Solutions

Mark Bidinger

C&I Segment President

Schneider Electric

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Wet Process and TBDB for Heterogeneous Integration

Eric Lee

CEO

Scientech

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The Challenges of Heterogeneous Integration

Eric Lee

CEO

Scientech

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SEA 2024_Post Show Report

No linked agenda item found.

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Advanced packaging essential for full utilization of SiC semiconductors

Dominic Dorfner, Ph.D.

President & CEO

Semikron Danfoss GmbH

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Future of SiC Power Modules in Automotive and Industrial Applications

Claus A Petersen photo

Claus A Petersen

President

Semikron Danfoss GmbH

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SITRI – MEMS Sensor and SiPh R&D Pilot Line Platform

Bo Cui

Senior Director of Research

Shanghai Industrial Technology Research Institute (SITRI)

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Unfolding the Future: Driving Research and Innovation for Automotive Applications 未来展望:推动汽车应用的研究与创新

Angeline Tee

Senior Management | Strategic Planning & Partnership Management

Silicon Austria Labs (SAL)

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MEMS at the crossroads of innovation – Converging with emerging technologies

Mohssen Moridi, Ph.D.

Senior Executive Director & Head of the Microsystems Research Division

Silicon Austria Labs (SAL)

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The Camera Module Industry and the Opportunity for MEMS and Micro-Manufacturing

Dr. Siavash Pourkamali photo

Dr. Siavash Pourkamali

Founder & CEO

Silicon Dynamix

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Empowering Europe’s Semiconductor Future – chances and challenges

Frank Bösenberg

Managing Director

Silicon Saxony

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More than Moore Emerging Technologies for the Sensing Needs in EV

Eloi Marigo, Ph.D.

Senior Manager

SilTerra

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Monolithic CMOS-MEMS Foundry Convergence: Unlocking the Future of Piezoelectric Sensors and Emerging Technologies

Eloi Marigo, Ph.D.

Senior Manager

SilTerra

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Plating of Through-Glass-Vias

Marcus Elmar Lang

CTO

Simetric Semiconductor Solutions Co., Ltd.

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Semiconductors: Powering the Future and Driving the Global Economy

Robert Quinn photo

Robert Quinn

Founder

SIMEU

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Challenges and Opportunities of the Semiconductors Industry in the MENA Region: An Egyptian Perspective

Dr. Hisham Haddara photo

Dr. Hisham Haddara

Chairman and Founder

SiWare Systems

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SK Siltron CSS navigating the global uncertainties with advances in 200mm technology and readiness

Edward Chen

VP Commercial

SK Siltron CSS

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Innovative Traction Drives with SiC Semiconductors

Ladislav Sobotka, Ph.D.

Director of Engineering and R&D

Skoda Electric

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High-tech HV IGBT and SiC Modules Designed for Railway Applications

Ladislav Sobotka, Ph.D.

Director of Engineering and R&D

Skoda Electric

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