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The New Packaging Math: 2x + 4y = 1
Wolfgang Sauter
Customer Solutions Architect, Packaging
Marvell Technology
Harnessing the Benefit of Precious Metals Deposition While Managing Total Cost of Ownership
Richard Oliveri
VP, General Manager
Materion
Keynote: Benchmarking What Matters: Driving Fab Excellence Through Data-Driven Comparison
Ariel Meyuhas
Founding Partner & COO
MAX I.E.G.
ICT Investments Opportunities in Oman
Fahad Sultan Al Abri
Director General of ICT Stimulations & Future Skills
Ministry of Transport, Communications and Information Technology (MTCIT)
Welcome Speech
Dr. Ali Amur Ali Al Shidhani
Undersecretary of Communications and Information Technology
Ministry of Transport, Communications and Information Technology (MTCIT)
AI Computing on Edge Devices
Bor-Sung Liang, Ph.D
Senior Director, Corporate Strategy & Strategic Technology
MediaTek
AI Computing in Large-Scale Era – The Golden Age of AI and IC
Bor-Sung Liang, Ph.D
Senior Director, Corporate Strategy & Strategic Technology
MediaTek
MEMS Infinity supports device commercialization in AI Era
Hiroshi Miyajima, Ph.D.
Fellow ICT Division
MEMS Infinity / Sumitomo Precision Products
Disruptive MEMS Power Technology – The Ideal Switch for Power applications
Yalcin Bulut
COO
Menlo Microsystems Inc.
The path to quantum sensor wafer level manufacturing
Sristy Agrawal, Ph.D.
CEO & Co-founder
Mesa Quantum Systems
About Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors
Thomas Russell
CEO and Co-Founder
Mesoline B.V.
Microchannel particle deposition for MEMS & Sensors Applications
Thomas Russell
CEO and Co-Founder
Mesoline B.V.
How The Semiconductor Industry Is Poised to Enable The Metaverse
Dr. Ofer Shacham
VP, Head of Silicon, at Meta Reality Labs
Meta
Unlocking the Unseen: Polarization Image Sensing for Consumer Electronics
Rob Devlin, Ph.D.
Co-Founder & CEO
Metalenz
Japan’s Policy Trends in Semiconductor and Digital Industry Strategy
Hisashi Kanazashi
Director IT Division
Ministry of Economy, Trade and Industry (METI)
Future Opportunities: Semiconductors Packaging
Amarjit Sandhu
CVP of Assembly and Test, NAND Operations
Micron Technology
Innovations Driving HBM Roadmap
Boon Ong
Sr. Director of Advanced Packaging Technology Development
Micron Technology
Silicon Manufacturing and Packaging at MSFT in the Cloud/AI era
Sriram Srinivasan
Partner Silicon Packaging Technology
Microsoft
MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia
Thiagesh K Lingam
Senior Director
MIMOS
Electroless Metallization of power semiconductor devices – challenges and benefits 功率半导体器件的化学镀金属化—挑战与机遇
Dr. Stefan Pieper
Global Application Manager
mks | Atotech
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Dr. Christian Ohde
Global Product Director SC/FEC
mks | Atotech
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Dr. Stefan Pieper
Global Application Manager
mks | Atotech
Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow
Dr. Christian Ohde
Global Product Director SC/FEC
mks | Atotech
Invest in Oman
Mohammed bin Ali bin Mohammed Al Lawati
Director of Investment Promotion Department by Delegation
Ministry of Commerce, Industry & Investment Promotions (MOCIIP)
Fan-out Wafer Level MEMS Packaging for Automotive Applications
Senni Laaksonen
SVP Research and Development
Murata Manufacturing Co., Ltd.
High Performance MEMS Inertial Sensors Enabling Advanced Mobility
Senni Laaksonen
SVP Research and Development
Murata Manufacturing Co., Ltd.
Project-based Talent Development for MEMS Industry – a case study
Yuandong Gu, Ph.D.
Vice President
National Innovation Center par Excellence
Seamless MEMS-CMOS Integration Enabled by TSRI’s Design and Service Platform
Yi Chiu, Ph.D.
Professor
National Yang Ming Chiao Tung University
Next-Generation GaN/SiC To Accelerate Electrification
Gene Sheridan
CEO
Navitas Semiconductor
Navigating the Dynamic Memory Market: Trends and Insights
Marco Mezger
COO & Executive Vice President
Neumonda
GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?
Bas Verheijen
Senior Director GaN Technology and Operations
Nexperia
Advancements in High-Power Module Packaging for Traction Inverters in Electric Vehicles
Achim Strass, Ph.D.
Senior Director Technology Scouting and Cooperation
Nexperia
The Power of Choice: Expanding the SiC Device Portfolio to Drive Market Growth
Katrin Feurle
Senior Director & General Manager SiC Discretes & Modules
Nexperia
Revolutionary Acoustic Microscopic Imaging (AMI) Technology for Wafer-Level and Advanced Packaging
Bryan Schackmuth
Senior Product Line Manager
Nordson TEST & INSPECTION
Commercialization of MEMS-based ultrasonics
David Horsley, Ph.D.
Professor
Northeastern University
MEMS inertial sensors for navigation applications
Stefan Rombach
Head of MEMS
Northrop Grumman LITEF GmbH
Co-Packaged Optics: Powering the Next Generation of Data Center Connectivity for the AI Era
Liron Gantz, Ph.D.
Research Staff Member
NVIDIA
Customized Silicon and SOI Wafers Enabling Enhanced Power Devices
Dr. Atte Haapalinna
CTO
Okmetic Oy
Advanced Silicon Wafers for Optimized MEMS and RF Device Performance
Dr. Atte Haapalinna
CTO
Okmetic Oy
Transforming the Sensor Market through a New Topology for MEMS
Eric Aguilar
CEO
Omnitron Sensors
How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges
Tong Wu, Ph.D.
Leader of China Automotive Solution Team
onsemi
Transforming The Power World: The Wide-Bandgap Conversion
Pavel Freundlich
Chief Technology Officer & Vice President, Power Solutions Group
onsemi
Powering the Future of EVs by Driving Power Density
Dinesh Ramanathan, Ph.D.
Senior Vice President, Corporate Strategy
onsemi
Innovating Power for an Electrified, Intelligent World
B.Y. Park
Sr. Director, Product Division
onsemi
AICS Solutions to High Value Problems
Keith Best
Director, Product Marketing, Lithography
Onto Innovation
Challenges to enabling the transition from organic to glass core substrates as RDL approaches 2 µm l/s and beyond
Keith Best
Director, Product Marketing, Lithography
Onto Innovation
Meeting Challenges in MEMS with Advanced Metrology and Inspection Capabilities
Mike Rosa, Ph.D.
CMO & SVP Strategy
Onto Innovation
Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection
Dr. Vamsi Velidandla
Senior Director, Product Management
Onto Innovation
Process Control Challenges in Packaging for High Performance Computing Applications
Monita Pau, Ph.D.
Strategic Marketing Director, Advanced Packaging
Onto Innovation
Metrology and Inspection Solutions for SiC and GaN Power Devices
Jiangtao Hu
Sr. Director Product Marketing
Onto Innovation
The Special Economic Zones, Free Zones and Industrial Zones in Oman
Thuraiya Al Zarafy
Investment Promotion & Business Development – Acting Manager
OPAZ
How Optotune’s Products for Dynamic Light Control Benefit AR/VR Applications
Dr. David Leuenberger
Head of Product Management
Optotune
Innovative laser assisted bonding processes for next generation advanced packaging
Matthias Fettke
VP Advanced Packaging Equipment
PacTech
Seeing the invisible: real-time chemistry revealed in your wet bench with next generation semiconductor infrared spectroscopy
Lennon Lee, Ph.D.
CEO
Paeonia Innovations
Is Heterogeneous Integration (HI) ready for Artificial Intelligence (AI)?
Madhavan Swaminathan, Ph.D.
Dept. Head Electrical Engineering
Penn State University
SiC / IGBT Power Module Assembly & Test Equipment Solutions
Michael Koelbl
General Manager Pentamaster Automation Germany GmbH
Pentamaster Technology Sdn. Bhd.
Power semiconductor Reliability Test & Handling Equipment Solutions
Alex Liew
SVP, Sales & Operations
Pentamaster Technology Sdn. Bhd.
Demands for sensor test from development to high-volume manufacturing
Ari Kuukkala
Development Manager
Pentamaster Technology Sdn. Bhd.
LOW COST, SCALABLE and FLEXIBLE line for different types of IC Packaging (LGA, BGA, QFN, SiP, AiP, DrMOS, Power Invertor)
Jimmy Chew
Chief Executive
PEP Innovation
Smart tires : powerful sensors for modern mobility
Corrado Rocca
R&D Head, Cyber Unit
Pirelli
Opportunities and Challenges for Energy and Power Semiconductors in the AI Era
Alan Zhou, Ph.D.
CEO
Pixelworks
US Based Equipment Manufacturer For Compounds Semiconductor Applications
Yannick Pilloux
VP EMEA
Plasma-Therm
Silicon fab transformed through CHIPS: A new US 200mm foundry launches to deliver power innovation and high-volume manufacturing
Surya Iyer, Ph.D.
President & COO
Polar Semiconductor
Leveraging a robust and established technology from a partner, U.S. Power Foundry plans to offer advanced GaN device mass production at 200mm
Surya Iyer, Ph.D.
President & COO
Polar Semiconductor
Using MEMS and optics to create a unique solution for present and future applications
Jon Edwards
VP Business Development
PoLight ASA
Empowering Power Electronics Packaging Through Photonic Debonding
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
Wet Process Technology Roadmap for Power Device Manufacturing
Oliver Whear
Director of Semiconductor Technology
RENA Technologies
Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry
Shinichi Yoshioka
Senior Vice President and Chief Technology Officer
Renesas Electronics Corporation
Package Design and Reliability Need in Server Systems
Viresh Patel
VP Packaging Technology
Renesas Electronics Corporation
Renesas Automotive X-in-1 System Solution and Technology Driven by GaN
Johnny Guo
Director, Solutions
Renesas Electronics Corporation
Datacenter Trends and Power Architecture evolution
Pietro Scalia
Head of Power System Marketing and Architecture
Renesas Electronics Corporation
xEVs – From Power Semiconductors to the Power Ecosystem
Avinash Kashyap Ph.D
VP & GM of the Discrete & Wide Bandgap Power BU
Advanced Packaging/Substrate Materials and Open innovation Platform
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Advanced Packaging Materials Innovation through Co-creative Activities
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Open Innovation Strategy of Resonac, Co-Creative Chemical Company
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Going Vertical With MEMS: Unfolding System-Level Development Of Scanning Micromirror Technologies
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Silicon Austria Labs (SAL)
Leading a World Class Research Institute
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Silicon Austria Labs (SAL)
Heterogeneous Integration Platform for Next Generation Computing
Seung Wook Yoon, Ph.D, MBA
Package Group, Product Technology, CVP / Head of Group System LSI
Samsung
Powering the SIC Revolution with Vertical Integration
Ajay Poonjal Pai, Ph.D.
Director, Head of WBG Innovation & Application Engineering
Sanan Semiconductor
Enabling the Advanced Packaging industry with HVM solutions for next generation glass core substrates
Roland Rettenmeier
CSO
SCHMID Group
Presentation (Cost): Operationalizing Sustainability: Aligning Cost and Carbon in Semiconductor Manufacturing
Yi Fung Bess Ng, Ph.D.
Associate Principal (Sustainability Business)
Schneider Electric
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