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Next-Generation Silicon Photonics and 3-D Technologies for Scaling AI Systems
Joris Van Campenhout
R&D Program Director
imec
New Foundry MEMS Ecosystem Accelerator
Doug Sparks
Vice President Business Development
InchFab
Vibration sensors with AI for in industry applications
Dr. Jacob Hsu
CTO of Smart Sensing & Systems Technology Center
Industrial Technology Research Institute (ITRI)
Innovating For A Greener Future: The Role Of MEMS Microphones In Driving Sustainable And Energy Efficient Consumer Electronics
Gunar Lorenz, Ph.D.
Senior Director Technical Marketing Sensors
Infineon Technologies AG
The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem
Dr. Thomas Morgenstern
EVP Frontend IFAG FE
Infineon Technologies AG
Fu Lu Shou – The Three Lucky Stars of Power
Mark Nils Münzer
Distinguished Engineer Innovation & Emerging Technologies Automotive High Power
Infineon Technologies AG
Zero Emission Becomes Real in Next-Generation Mobility
CS Chua
President & Managing Director
Infineon Technologies AG
EV market trends and the status-quo of automotive power semiconductors.
Stefan Obersriebnig
SVP High Voltage Modules
Infineon Technologies AG
How will Generative AI shape the future of MEMS Microphones?
Aldo Bruno
Technical Lead MEMS Sensor System Competence Team
Infineon Technologies AG
We power AI: High density solutions for AI accelerators
Athar Zaidi
SVP & GM, Power ICs and Connectivity Systems
Infineon Technologies AG
The Future of Advanced Semiconductor Manufacturing
Kok Tiong Ng
SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd
Infineon Technologies AG
Understanding “who spoke when?”: High SNR MEMS Microphones and the Evolution of AI Understanding
Roberto Condorelli
Director of Marketing
Infineon Technologies AG
From Concept to Application: INL’s Breakthroughs in MEMS Technology
Filipe Alves
Staff Researcher
INL (International Iberian Nanotechnology Laboratory)
Mass Manufacturing 8-inch GaN-on-Si Power Devices: the Next Generation of Power Switching Technology
Denis Marcon, Ph.D.
General Manager
Innoscience
Innoscience’s GaN Power Devices: Reliable, Price Competitive and Mass Manufactured
Denis Marcon, Ph.D.
General Manager
Innoscience
Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging
Teng Chow Ooi
Sr Director Program Office
Intel Corporation
AI Inspired. Systems Accelerated.
Kevin O’Buckley
SVP and GM Foundry Services
Intel Foundry
I.S.I.G. Accelerator Program
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (I.S.I.G.)
ISES EU POWER 2024_Post Show Report
No linked agenda item found.
ISES POWER EU 2023-Post Show Report
No linked agenda item found.
Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective
Dr. Ming-Der Shieh
CTO of Electronic and Optoelectronic System Research Laborations (EOSL)
Industrial Technology Research Institute (ITRI)
Heterogeneous Integration Enabled by Advanced Chiplet Packaging
Dr. Yang Cheng
Senior Director Design Service BU
JCET
Semiconductor Innovations Across a More Diversified End Market
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Optimizing Interconnect Density with New Packaging Technologies
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Process Control Trends for WBG Power Devices
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Front-end Semiconductor and Packaging Innovations to Enable an AI Era
Chet Lenox, Ph.D.
Fellow, Industry and Customer Collaboration
KLA
Advancing the Semiconductor Industry, TOGETHER
Andrew Goh
CVP & GM, Advanced Packaging Customer Operations
Lam Research Corporation
Panel Level Packaging Requires the Same Wet Process Performance As Wafer Level Packaging
Herbert Oetzlinger
VP Business Development
Lam Research Corporation
Isolation – APackage requirement
Ralf Keggenhoff
Global Director Application Engineering Semiconductor Business Unit
Littelfuse
Introducing Silicon Interposers for Power Applications
Ahmed Ammar
Co-Founder, Head of Product
A Game-Changer for AI and HPC Substrates: A Novel Interconnect Technology
Rozalia Beica
Chief Commercial Officer
MEMS Global Landscape Overview and Challenges
Dr. Douglas Sparks
President
M2N Technologies LLC
The New Packaging Math: 2x + 4y = 1
Wolfgang Sauter
Customer Solutions Architect, Packaging
Marvell Technology
Harnessing the Benefit of Precious Metals Deposition While Managing Total Cost of Ownership
Richard Oliveri
VP, General Manager
Materion
ICT Investments Opportunities in Oman
Fahad Sultan Al Abri
Director General of ICT Stimulations & Future Skills
Ministry of Transport, Communications and Information Technology (MTCIT)
Welcome Speech
Dr. Ali Amur Ali Al Shidhani
Undersecretary of Communications and Information Technology
Ministry of Transport, Communications and Information Technology (MTCIT)
AI Computing on Edge Devices
Bor-Sung Liang, Ph.D
Senior Director, Corporate Strategy & Strategic Technology
MediaTek
AI Computing in Large-Scale Era – The Golden Age of AI and IC
Bor-Sung Liang, Ph.D
Senior Director, Corporate Strategy & Strategic Technology
MediaTek
Disruptive MEMS Power Technology – The Ideal Switch for Power applications
Yalcin Bulut
COO
Menlo Microsystems Inc.
The path to quantum sensor wafer level manufacturing
Sristy Agrawal, Ph.D.
CEO & Co-founder
Mesa Quantum Systems
About Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors
Thomas Russell
CEO and Co-Founder
Mesoline
How The Semiconductor Industry Is Poised to Enable The Metaverse
Dr. Ofer Shacham
VP, Head of Silicon, at Meta Reality Labs
Meta
Unlocking the Unseen: Polarization Image Sensing for Consumer Electronics
Rob Devlin, Ph.D.
Co-Founder & CEO
Metalenz
Japan’s Policy Trends in Semiconductor and Digital Industry Strategy
Hisashi Kanazashi
Director IT Division
Ministry of Economy, Trade and Industry (METI)
Future Opportunities: Semiconductors Packaging
Amarjit Sandhu
CVP of Assembly and Test, NAND Operations
Micron Technology, Inc.
Innovations Driving HBM Roadmap
Boon Ong
Sr. Director of Advanced Packaging Technology Development
Micron Technology, Inc.
Silicon Manufacturing and Packaging at MSFT in the Cloud/AI era
Sriram Srinivasan
Partner Silicon Packaging Technology
Microsoft
MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia
Thiagesh K Lingam
Senior Director
MIMOS
Electroless Metallization of power semiconductor devices – challenges and benefits 功率半导体器件的化学镀金属化—挑战与机遇
Dr. Stefan Pieper
Global Application Manager
mks | Atotech
Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow
Dr. Christian Ohde
Global Product Director SC/FEC
mks | Atotech
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Dr. Christian Ohde
Global Product Director SC/FEC
mks | Atotech
Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices
Dr. Stefan Pieper
Global Application Manager
mks | Atotech
Invest in Oman
Mohammed bin Ali bin Mohammed Al Lawati
Director of Investment Promotion Department by Delegation
Ministry of Commerce, Industry & Investment Promotions (MOCIIP)
Fan-out Wafer Level MEMS Packaging for Automotive Applications
Senni Laaksonen
SVP Research and Development
Murata Manufacturing Co., Ltd.
Next-Generation GaN/SiC To Accelerate Electrification
Gene Sheridan
CEO
Navitas Semiconductor
Navigating the Dynamic Memory Market: Trends and Insights
Marco Mezger
COO & Executive Vice President
Neumonda
GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?
Bas Verheijen
Senior Director GaN Technology and Operations
Nexperia
The Power of Choice: Expanding the SiC Device Portfolio to Drive Market Growth
Katrin Feurle
Senior Director & General Manager SiC Discretes & Modules
Nexperia
Revolutionary Acoustic Microscopic Imaging (AMI) Technology for Wafer-Level and Advanced Packaging
Bryan Schackmuth
Senior Product Line Manager
Nordson TEST & INSPECTION
MEMS inertial sensors for navigation applications
Stefan Rombach
Head of MEMS
Northrop Grumman LITEF GmbH
Advanced Silicon Wafers for Optimized MEMS and RF Device Performance
Dr. Atte Haapalinna
CTO
Okmetic Oy
Customized Silicon and SOI Wafers Enabling Enhanced Power Devices
Dr. Atte Haapalinna
CTO
Okmetic Oy
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