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eVTOL marketing trend 低空飞行器未来市场趋势
KeDa Xu
Founder & CEO
Falcon Sichuan Aviation Technology Co. Ltd
Si Schottky Photodiodes: New Horizons for Short Wavelength Infrared (SWIR) Sensing
Dr. Sandro Koch
Business Unit Manager Acoustic Sensors and Systems
Fraunhofer Institute for Photonic Microsystems
European Chips Act (EUCA) and the FMD Pilot line “Advanced Heterogenous Systems Integrations (AHSI)”
Dr. Michael Eritt
Head of Department Engineering
Fraunhofer Institute for Photonic Microsystems
APECS Research Pilot Line for advanced heterointegration innovations in the MEMS Industry
Jörg Amelung
Deputy Institute Director Division, Director Engineering, Manufacturing & Test
Fraunhofer Institute for Photonic Microsystems
Advanced low inductance SiC Power Module with 3D wiring technology
Thomas Heinzel
Head of Semiconductor Technical Division
Fuji Electric Europe GmbH
Beyond the Sensor: How Driver ASICs Unlock Next-Gen MEMS Performance in HMI Applications
Ruby Yan, Ph.D.
Business Unit Director – Display, Sensor, Security
GlobalFoundries
Digital: The New Key Strategy of Advanced Manufacturing
Yvonne Keil
Senior Director GF Operations India/Malaysia
GlobalFoundries
Sensors and Systems in an AI first world
Michael Pate, Ph.D.
Director of Audio Technology Development
AI use cases in semiconductor data analytics and quality management
Bizhan Delgoshaei
Head of Custom Silicon Engineering Operation
Greater Phoenix: A Global Destination for Industrial Innovation
Chris Camacho
President & CEO
Greater Phoenix Economic Council (GPEC)
Greater Phoenix: Semiconductor Excellence on the Global Stage
Chris Camacho
President & CEO
Greater Phoenix Economic Council (GPEC)
Optimizing the Ecosystem for the Semiconductor Industry Gyeonggi Province of Korea
So Jung Yoo
Director, Investment Promotion Division
Gyeonggi Province
Advanced Probing Materials for Semiconductor Testing
Matthias Wegner, Ph.D.
Head of Innovation
Heraeus Precious Metals
Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective
Rainer Kaesmaier, Ph.D.
Managing Director Semiconductors
Hitachi Energy Ltd.
Power Semiconductors – The silent Heroes of the future power grid
Tobias Keller
Vice President, Head of global Product Mgt., Portfolio & Marketing
Hitachi Energy Ltd.
Humanoid Robot and the Application of Semiconductor in It
Jingran Cheng
Software Development Manager
Humanoid Robot Shanghai Co., Ltd.
Understand the Present; Predict the Future
Simi Sherman
VP of Research
International Semiconductor Industry Group (ISIG)
Track the Tariffs; Timely and Targeted Data
Simi Sherman
VP of Research
International Semiconductor Industry Group (ISIG)
Follow the Data: Timely and Targeted
Simi Sherman
VP of Research
International Semiconductor Industry Group (ISIG)
Discussion on Chip Applications in the Era of Smart Electric Vehicles
Haoran Jiang
Vice Dean of Research Institute
iCAR Auto
Semiconductor Market Outlook: Investment and Innovation Accelerate Next Growth Cycle
Mario Morales
Group VP, Enabling Technologies and Semiconductors
IDC
GaN-on-Si technology for efficient RF front-ends
Bertrand Parvais
Principal Member of Technical Staff
imec
imec SiPh technologies for scaling AI Systems
Maarten Willems
Vice President of Global Business Development
imec
Next-Generation Silicon Photonics and 3-D Technologies for Scaling AI Systems
Joris Van Campenhout
R&D Program Director
imec
New Foundry MEMS Ecosystem Accelerator
Doug Sparks
Vice President Business Development
InchFab
A new MEMS manufacturing paradigm – democratized fabrication
Mitchell Hsing, Ph.D.
CEO
InchFab
Vibration sensors with AI for in industry applications
Dr. Jacob Hsu
CTO of Smart Sensing & Systems Technology Center
Industrial Technology Research Institute (ITRI)
Innovating For A Greener Future: The Role Of MEMS Microphones In Driving Sustainable And Energy Efficient Consumer Electronics
Gunar Lorenz, Ph.D.
Senior Director Technical Marketing Sensors
Infineon Technologies AG
The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem
Dr. Thomas Morgenstern
EVP Frontend IFAG FE
Infineon Technologies AG
Fu Lu Shou – The Three Lucky Stars of Power
Mark Nils Münzer
Distinguished Engineer Innovation & Emerging Technologies Automotive High Power
Infineon Technologies AG
Zero Emission Becomes Real in Next-Generation Mobility
CS Chua
President & Managing Director
Infineon Technologies AG
EV market trends and the status-quo of automotive power semiconductors.
Stefan Obersriebnig
SVP High Voltage Modules
Infineon Technologies AG
How will Generative AI shape the future of MEMS Microphones?
Aldo Bruno
Technical Lead MEMS Sensor System Competence Team
Infineon Technologies AG
We power AI: High density solutions for AI accelerators
Athar Zaidi
SVP & GM, Power ICs and Connectivity Systems
Infineon Technologies AG
The Future of Advanced Semiconductor Manufacturing
Kok Tiong Ng
SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd
Infineon Technologies AG
Innovation That Scales: Aligning Semiconductor Breakthroughs with Automotive Value Creation
Stefan Obersriebnig
SVP High Voltage Modules
Infineon Technologies AG
Wired for Intelligence: SWI3S—The New Interface Standard for Ambient AI
Gunar Lorenz, Ph.D.
Senior Director Technical Marketing Sensors
Infineon Technologies AG
Understanding “who spoke when?”: High SNR MEMS Microphones and the Evolution of AI Understanding
Roberto Condorelli
Director of Marketing
Infineon Technologies AG
From Concept to Application: INL’s Breakthroughs in MEMS Technology
Filipe Alves
Staff Researcher
INL (International Iberian Nanotechnology Laboratory)
Innoscience’s GaN Power Devices: Reliable, Price Competitive and Mass Manufactured
Denis Marcon, Ph.D.
General Manager and SVP
Innoscience
Mass Manufacturing 8-inch GaN-on-Si Power Devices: the Next Generation of Power Switching Technology
Denis Marcon, Ph.D.
General Manager and SVP
Innoscience
Fast-Tracking PiezoMEMS: From Concept to Manufacturing Readiness
Zhu Yao, Ph.D.
Head of MEMS Department
Institute of Microelectronics, A*STAR
Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging
Teng Chow Ooi
Sr Director Program Office
Intel Corporation
Keynote (Yield): Optimizing Yield at Scale Using Digital Twins
Prashanth Aprameyan
GM Silicon Business Line (Advanced Technologies)
Intel Foundry
AI Inspired. Systems Accelerated.
Kevin O’Buckley
SVP and GM Foundry Services
Intel Foundry
I.S.I.G. Accelerator Program
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (ISIG)
ISES EU POWER 2024_Post Show Report
No linked agenda item found.
ISES POWER EU 2023-Post Show Report
No linked agenda item found.
Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective
Dr. Ming-Der Shieh
CTO of Electronic and Optoelectronic System Research Laborations (EOSL)
Industrial Technology Research Institute (ITRI)
Heterogeneous Integration Enabled by Advanced Chiplet Packaging
Dr. Yang Cheng
Senior Director Design Service BU
JCET
Optimizing Interconnect Density with New Packaging Technologies
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Process Control Trends for WBG Power Devices
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Semiconductor Innovations Across a More Diversified End Market
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap
Oreste Donzella
Executive Vice President and Chief Strategy Officer
Front-end Semiconductor and Packaging Innovations to Enable an AI Era
Chet Lenox, Ph.D.
Fellow, Industry and Customer Collaboration
KLA
Panel Level Packaging Requires the Same Wet Process Performance As Wafer Level Packaging
Herbert Oetzlinger
VP, Panel Product Line Head • Panel Product Management
Lam Research Corporation
Advancing the Semiconductor Industry, TOGETHER
Andrew Goh
CVP & GM, Advanced Packaging Customer Operations
Lam Research Corporation
From Electrons to Photons: A Lightmatter Perspective on 3D Photonic Interconnect
Ritesh Jain
SVP, Engineering & Operations
Lightmatter
Isolation – APackage requirement
Ralf Keggenhoff
Global Director Application Engineering Semiconductor Business Unit
Littelfuse
Introducing Silicon Interposers for Power Applications
Ahmed Ammar
Co-Founder, Head of Product
A Game-Changer for AI and HPC Substrates: A Novel Interconnect Technology
Rozalia Beica
Chief Commercial Officer
MEMS Global Landscape Overview and Challenges
Dr. Douglas Sparks
President
M2N Technologies LLC
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