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Memory Bandwidth is All You Need
Takahiro Ogura
President of AI Computing Division
Preferred Networks
An AI-Semiconductor Nexus: Custom 3D-Stacked Memory & Accelerated Materials Discovery
Karim Hamzaoui
VP of Global Business Development
Preferred Networks
Empowering Power Electronics Packaging Through Photonic Debonding
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes
Vikram Turkani
Director, Technology Partnerships and Strategic Business Development
PulseForge
Driving the Future of Semiconductor Innovation: AI-Enabled Advanced Nodes and Japan’s Leap Forward
Kazunari Ishimaru, Ph.D.
Senior Managing Executive Officer & CTO, IEEE Fellow
Rapidus Corporation
Wet Process Technology Roadmap for Power Device Manufacturing
Oliver Whear
Director of Semiconductor Technology
RENA Technologies
Tailoring through glass via (TGV) dimensions for glass-core panel substrates
Holger H. Kuehnlein, P.h.D.
SVP Technology
RENA Technologies
Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry
Shinichi Yoshioka
Senior Vice President and Chief Technology Officer
Renesas Electronics Corporation
Package Design and Reliability Need in Server Systems
Viresh Patel
VP Packaging Technology
Renesas Electronics Corporation
Renesas Powering the Future of Robotics
Gaurang Shah
Vice President, Division
Renesas Electronics Corporation
Renesas Automotive X-in-1 System Solution and Technology Driven by GaN
Johnny Guo
Director, Solutions
Renesas Electronics Corporation
Datacenter Trends and Power Architecture evolution
Pietro Scalia
Head of Power System Marketing and Architecture
Renesas Electronics Corporation
xEVs – From Power Semiconductors to the Power Ecosystem
Avinash Kashyap Ph.D
VP & GM of the Discrete & Wide Bandgap Power BU
Building the Semiconductor Innovation Ecosystem in Saudi Arabia
Ahmad Alfaifi, Ph.D.
Senior Expert
Research Development and Innovation Authority
Advanced Packaging/Substrate Materials and Open innovation Platform
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Open Innovation Strategy of Resonac, Co-Creative Chemical Company
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Advanced Packaging Materials Innovation through Co-creative Activities
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Open Innovation Strategy of Resonac, Co-Creative Chemical Company
Hidenori Abe
Executive director, Electronics Business Headquarters and CTO for semiconductor materials
Resonac Corporation
Going Vertical With MEMS: Unfolding System-Level Development Of Scanning Micromirror Technologies
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Silicon Austria Labs (SAL)
Leading a World Class Research Institute
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Silicon Austria Labs (SAL)
Heterogeneous Integration Platform for Next Generation Computing
Seung Wook Yoon, Ph.D, MBA
Package Group, Product Technology, CVP / Head of Group System LSI
Samsung
Powering the SIC Revolution with Vertical Integration
Ajay Poonjal Pai, Ph.D.
Director, Head of WBG Innovation & Application Engineering
Sanan Semiconductor
Transforming Challenges into Opportunities: The Journey of the First Saudi Fab
Abdullah Alshehri, Ph.D.
Business Development Unit Manager
Saudi Electronic Materials Company
Enabling the Advanced Packaging industry with HVM solutions for next generation glass core substrates
Roland Rettenmeier
CSO
SCHMID Group
Presentation (Cost): Operationalizing Sustainability: Aligning Cost and Carbon in Semiconductor Manufacturing
Yi Fung Bess Ng, Ph.D.
Associate Principal (Sustainability Business)
Schneider Electric
The Blueprint for Sustainable Fabs
Henri Berthe
Semiconductors Segment VP • Sales
Schneider Electric
AI Sustainability Challenges & Solutions
Mark Bidinger
C&I Segment President
Schneider Electric
Case Study (Cost): Redefining Facilities Operations and Cost Efficiency at Intel with AI-Empowered Analytics
Sean Tropsa
Principal Solution Consultant
Seeq
Future of SiC Power Modules in Automotive and Industrial Applications
Claus A Petersen
President
Semikron Danfoss GmbH
Advanced packaging essential for full utilization of SiC semiconductors
Dominic Dorfner, Ph.D.
President & CEO
Semikron Danfoss GmbH
Intelligent Gas Sensing at Scale: From Electrified Mobility to Smart Energy
Hossain Fahad, Ph.D.
Chief Executive Officer
Serinus Labs
SITRI – MEMS Sensor and SiPh R&D Pilot Line Platform
Bo Cui
Senior Director of Research
Shanghai Industrial Technology Research Institute (SITRI)
Building a MEMS and Optoelectronics Platform to Enable Technological and Industrial Innovation
Wei Wang, Ph.D.
Senior Director
Shanghai Industrial Technology Research Institute (SITRI)
Brightening the Future with Advanced Semiconductor Packaging Technologies
Yasushi Araki
Corporate Officer
SHINKO
Unfolding the Future: Driving Research and Innovation for Automotive Applications 未来展望：推动汽车应用的研究与创新
Angeline Tee
Senior Management | Strategic Planning & Partnership Management
Silicon Austria Labs (SAL)
The Future of MEMS – Pathways for Innovation and Collaboration
Christina Hirschl, Ph.D.
CEO
Silicon Austria Labs (SAL)
MEMS at the crossroads of innovation – Converging with emerging technologies
Mohssen Moridi, Ph.D.
Senior Executive Director & Head of the Microsystems Research Division
Silicon Austria Labs (SAL)
The Camera Module Industry and the Opportunity for MEMS and Micro-Manufacturing
Dr. Siavash Pourkamali
Founder & CEO
Silicon Dynamix
Empowering Europe’s Semiconductor Future – chances and challenges
Frank Bösenberg
Managing Director
Silicon Saxony
More than Moore Emerging Technologies for the Sensing Needs in EV
Eloi Marigo, Ph.D.
Senior Manager
SilTerra
MEMS-CMOS Integration: Process Innovation Enabling the Future Experiences
Timothy Lee
Senior Director, Business Development
SilTerra
Monolithic CMOS-MEMS Foundry Convergence: Unlocking the Future of Piezoelectric Sensors and Emerging Technologies
Eloi Marigo, Ph.D.
Senior Manager
SilTerra
Plating of Through-Glass-Vias
Marcus Elmar Lang
CTO
Simetric Semiconductor Solutions Co., Ltd.
Semiconductors: Powering the Future and Driving the Global Economy
Robert Quinn
Founder
SIMEU
Challenges and Opportunities of the Semiconductors Industry in the MENA Region: An Egyptian Perspective
Dr. Hisham Haddara
Chairman and Founder
SiWare Systems
SK Siltron CSS navigating the global uncertainties with advances in 200mm technology and readiness
Edward Chen
VP Commercial
SK Siltron CSS
Innovative Traction Drives with SiC Semiconductors
Ladislav Sobotka, Ph.D.
Director of Engineering and R&D
Skoda Electric
High-tech HV IGBT and SiC Modules Designed for Railway Applications
Ladislav Sobotka, Ph.D.
Director of Engineering and R&D
Skoda Electric
From Hyperscale Models to Heterogeneous SoCs: Industrializing Neural Network Deployment with ONNC
Luba Tang
CEO
Skymizer Taiwan, Inc.
Revitalizing Domestic Semiconductor Manufacturing: Challenges, Opportunities and Emerging Applications
Thomas Sonderman
President & CEO
SkyWater Technology
Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive
Ph.D. Emmanuel Sabonnadière
VP Division Automotive & Industrial
Soitec
Smart Materials, Smarter Systems: Enabling 3D Integration with Engineered Substrates
Christophe Maleville, Ph.D.
Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation
Soitec
MEMS Test Equipment Standardization: New Opportunities for OSATs and IDMs
Marco Pratillo
Sales Manager Semi & MEMS Test Equipment BU
SPEA S.p.A.
Addressing Testing Challenges for Power Modules and Three-Level Inverters
Elia Petrogalli
Sales Manager Semi & MEMS Business Unit
SPEA S.p.A.
Ensuring Performance and Accuracy: Production Testing Strategies for Next-Generation Environmental Sensors
Marco Pratillo
Sales Manager Semi & MEMS Test Equipment BU
SPEA S.p.A.
Navigating the Complexities of Wafer Level Chip Scale Package (WLCSP) MEMS Testing
Oleg Fotteler
International Sales & Support – Management
SPEA S.p.A.
Ensuring Power Semiconductor Reliability: Testing SiC Semiconductor Devices at KGD Level 确保功率半导体的可靠性：在KGD（良品芯片）级别测试SiC半导体器件
Yuanli Sun
General Manager, SPEA China
SPEA S.p.A.
Ensuring Power Semiconductor Reliability: Testing SiC Semiconductor Devices at KGD Level
Higor Batagin
Sales Manager – Semi & MEMS Business Unit
SPEA S.p.A.
Coping with complexity – a flexible test system for a wide range of digital sensors
Ingolf Leidert
Product Manager Device Testing
SPEKTRA GmbH Dresden
Are New CS Markets Pushing Reliability Culture Shift?
Roland Shaw
President of Accel-RF
STAr Technologies
Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?
Roland Shaw
President of Accel-RF
STAr Technologies
SoC Design with AI: Unlocking Innovation, Efficiency, Complexity Management, and Foundry Collaboration
Michael Woon Chin Liew
Senior Principal Engineer
StarFive Technology International Sdn. Bhd.
Advanced low cost chiplet package for HPC, AI
Nokibul Islam, Ph.D.
Senior Director Business Development
STATS ChipPAC
Power Modules at the Crossroads: Enabling Scalable EV Innovation
Kai Konrad
Director Global Semiconductor Purchasing
Stellantis
StethX Acoustic Wearable Patch for Monitoring and Diagnosis of Cardio-Pulmonary Conditions
Farrokh Ayazi, Ph.D.
Founder & CEO
StethX Microsystems
The Seismic Patch for Cardiovascular and Pulmonary Monitoring and Diagnosis
Farrokh Ayazi, Ph.D.
Founder & CEO
StethX Microsystems
Innovation in Power & Energy Management is Key to Support a Sustainable Future
Francesco Muggeri
Vice President, Power Discrete and Analog Products China
STMicroelectronics
It is not only about AI in MEMS and sensors
Tarik Souibes
Product Marketing Director
STMicroelectronics
Wide-bandgap solutions enabling new possibilities in automotive and industrial market
Manuel Gaertner
Director Wide Band Gap & Electrification
STMicroelectronics
Semiconductor Strategies for the Transition to Sustainable Energy and Mobility 向可持续能源和移动转型的半导体战略
Dino Costanzo
Application Director and head of Motor Control Competence Center in AP.
STMicroelectronics
STMicroelectronics: three decades of SiC innovation leading to 200mm production and full vertical integration
Manuel Gaertner
Director Wide Band Gap & Electrification
STMicroelectronics
MEMS leadership in turbulent times
Anton Hofmeister
Group Vice President – GM Central R&D
STMicroelectronics
Enhancing human perception – sensors of the future as extensions of our five senses
Anton Hofmeister
Group Vice President – GM Central R&D
STMicroelectronics
Modeling tools for optimization semiconductor manufacturing processes: from material to device
Andrey Smirnov
Director of Business Development
STR
Tracking Startups Fundraise and The Challenges in the MEMS Market & ecosystem in a post-covid era
Ahmed Ben Slimane
Managing Director
Strategic Semiconductors
State-of-the art solutions for AI Chip manufacturing
Robert Wanninger
Senior Vice President Business Unit Advanced Backend Solutions
SUSS
3DIC W2W and D2W Hybrid Bonding
Thomas Schmidt
Product Manager, Bonder Division
SUSS
Invest in Your Future – Invest in Suwon! The Powerhouse of Opportunity in the Suwon Free Economic Zone
Jean Lim
Deputy Director of Investment Promotion Team/Business Attraction Division
SUWON CITY
TEL: Moving Into the MAGIC Era of Semiconductors
Neil Armstrong
Director Sales Development
Tokyo Electron
From an Idea to a Sensor Product: Micro Needle Case Study
Jared Crawford
Senior Integration Engineer
Teledyne MEMS
Optimizing Cost and Quality Through Test Mobility Across Insertions
Rick Burns
President Semiconductor Test Division
Teradyne
Total Solution of Process Kits to Enabling an Efficient Supply Chain in FAB
Jimmy Tao
Marketing Director
Tessvida
Power & AI
Ahmad Bahai, Ph.D.
Senior Vice President and Chief Technology Officer
Texas Instruments
TOPPAN’s Challenge in Advanced Semiconductor Packaging
Akihiko Furuya
Executive Officer, Head of Semiconductor Subdivision, Electronics Division
TOPPAN
Laser Beam Scanner Projection Displays For Consumer AR Glasses – Key MEMS Design Considerations.
Dr. Manuel Dorfmeister
Head of MEMS and e-Software department
TriLite
Tailored Solutions for the Semiconductor Industry Powered by TRUMPF
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
TRUMPF Huettinger
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