Select a 2025 summit below to view its ISES Docs

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

The Blueprint for Sustainable Fabs

Henri Berthe

Semiconductors Segment VP • Sales

Schneider Electric

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AI Sustainability Challenges & Solutions

Mark Bidinger

C&I Segment President

Schneider Electric

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Wet Process and TBDB for Heterogeneous Integration

Eric Lee

CEO

Scientech

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The Challenges of Heterogeneous Integration

Eric Lee

CEO

Scientech

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SEA 2024_Post Show Report

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Case Study (Cost): Redefining Facilities Operations and Cost Efficiency at Intel with AI-Empowered Analytics

Sean Tropsa

Principal Solution Consultant

Seeq

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Future of SiC Power Modules in Automotive and Industrial Applications

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Claus A Petersen

President

Semikron Danfoss GmbH

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Advanced packaging essential for full utilization of SiC semiconductors

Dominic Dorfner, Ph.D.

President & CEO

Semikron Danfoss GmbH

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Intelligent Gas Sensing at Scale: From Electrified Mobility to Smart Energy

Hossain Fahad, Ph.D.

Chief Executive Officer

Serinus Labs

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SITRI – MEMS Sensor and SiPh R&D Pilot Line Platform

Bo Cui

Senior Director of Research

Shanghai Industrial Technology Research Institute (SITRI)

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Building a MEMS and Optoelectronics Platform to Enable Technological and Industrial Innovation

Wei Wang, Ph.D.

Senior Director

Shanghai Industrial Technology Research Institute (SITRI)

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Unfolding the Future: Driving Research and Innovation for Automotive Applications 未来展望:推动汽车应用的研究与创新

Angeline Tee

Senior Management | Strategic Planning & Partnership Management

Silicon Austria Labs (SAL)

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The Future of MEMS – Pathways for Innovation and Collaboration

Christina Hirschl, Ph.D.

CEO

Silicon Austria Labs (SAL)

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MEMS at the crossroads of innovation – Converging with emerging technologies

Mohssen Moridi, Ph.D.

Senior Executive Director & Head of the Microsystems Research Division

Silicon Austria Labs (SAL)

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The Camera Module Industry and the Opportunity for MEMS and Micro-Manufacturing

Dr. Siavash Pourkamali photo

Dr. Siavash Pourkamali

Founder & CEO

Silicon Dynamix

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Empowering Europe’s Semiconductor Future – chances and challenges

Frank Bösenberg

Managing Director

Silicon Saxony

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More than Moore Emerging Technologies for the Sensing Needs in EV

Eloi Marigo, Ph.D.

Senior Manager

SilTerra

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MEMS-CMOS Integration: Process Innovation Enabling the Future Experiences

Timothy Lee

Senior Director, Business Development

SilTerra

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Monolithic CMOS-MEMS Foundry Convergence: Unlocking the Future of Piezoelectric Sensors and Emerging Technologies

Eloi Marigo, Ph.D.

Senior Manager

SilTerra

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Plating of Through-Glass-Vias

Marcus Elmar Lang

CTO

Simetric Semiconductor Solutions Co., Ltd.

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Semiconductors: Powering the Future and Driving the Global Economy

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Robert Quinn

Founder

SIMEU

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Challenges and Opportunities of the Semiconductors Industry in the MENA Region: An Egyptian Perspective

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Dr. Hisham Haddara

Chairman and Founder

SiWare Systems

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SK Siltron CSS navigating the global uncertainties with advances in 200mm technology and readiness

Edward Chen

VP Commercial

SK Siltron CSS

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Innovative Traction Drives with SiC Semiconductors

Ladislav Sobotka, Ph.D.

Director of Engineering and R&D

Skoda Electric

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High-tech HV IGBT and SiC Modules Designed for Railway Applications

Ladislav Sobotka, Ph.D.

Director of Engineering and R&D

Skoda Electric

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From Hyperscale Models to Heterogeneous SoCs: Industrializing Neural Network Deployment with ONNC

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Luba Tang

CEO

Skymizer Taiwan, Inc.

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Revitalizing Domestic Semiconductor Manufacturing: Challenges, Opportunities and Emerging Applications

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Thomas Sonderman

President & CEO

SkyWater Technology

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Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive

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Ph.D. Emmanuel Sabonnadière

VP Division Automotive & Industrial

Soitec

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Sound Generation by Active Modulation of Ultrasound

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Moti Margalit

CEO

SonicEdge

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MEMS Test Equipment Standardization: New Opportunities for OSATs and IDMs

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Marco Pratillo

Sales Manager Semi & MEMS Test Equipment BU

SPEA S.p.A.

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Addressing Testing Challenges for Power Modules and Three-Level Inverters

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Elia Petrogalli

Sales Manager Semi & MEMS Business Unit

SPEA S.p.A.

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Ensuring Performance and Accuracy: Production Testing Strategies for Next-Generation Environmental Sensors

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Marco Pratillo

Sales Manager Semi & MEMS Test Equipment BU

SPEA S.p.A.

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Navigating the Complexities of Wafer Level Chip Scale Package (WLCSP) MEMS Testing

Oleg Fotteler

International Sales & Support – Management

SPEA S.p.A.

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Ensuring Power Semiconductor Reliability: Testing SiC Semiconductor Devices at KGD Level 确保功率半导体的可靠性:在KGD(良品芯片)级别测试SiC半导体器件

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Yuanli Sun

General Manager, SPEA China

SPEA S.p.A.

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Ensuring Power Semiconductor Reliability: Testing SiC Semiconductor Devices at KGD Level

Higor Batagin

Sales Manager – Semi & MEMS Business Unit

SPEA S.p.A.

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Coping with complexity – a flexible test system for a wide range of digital sensors

Ingolf Leidert

Product Manager Device Testing

SPEKTRA GmbH Dresden

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Are New CS Markets Pushing Reliability Culture Shift?

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Roland Shaw

President of Accel-RF

STAr Technologies

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Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?

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Roland Shaw

President of Accel-RF

STAr Technologies

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SoC Design with AI: Unlocking Innovation, Efficiency, Complexity Management, and Foundry Collaboration

Michael Woon Chin Liew

Senior Principal Engineer

StarFive Technology International Sdn. Bhd.

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Advanced low cost chiplet package for HPC, AI

Nokibul Islam, Ph.D.

Senior Director Business Development

STATS ChipPAC

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Power Modules at the Crossroads: Enabling Scalable EV Innovation

Kai Konrad

Director Global Semiconductor Purchasing

Stellantis

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StethX Acoustic Wearable Patch for Monitoring and Diagnosis of Cardio-Pulmonary Conditions

Farrokh Ayazi, Ph.D.

Founder & CEO

StethX Microsystems

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The Seismic Patch for Cardiovascular and Pulmonary Monitoring and Diagnosis

Farrokh Ayazi, Ph.D.

Founder & CEO

StethX Microsystems

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Innovation in Power & Energy Management is Key to Support a Sustainable Future

Francesco Muggeri

Vice President, Power Discrete and Analog Products China

STMicroelectronics

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It is not only about AI in MEMS and sensors

Tarik Souibes

Product Marketing Director

STMicroelectronics

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Wide-bandgap solutions enabling new possibilities in automotive and industrial market

Manuel Gaertner

Director Wide Band Gap & Electrification

STMicroelectronics

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Semiconductor Strategies for the Transition to Sustainable Energy and Mobility 向可持续能源和移动转型的半导体战略

Dino Costanzo

Application Director and head of Motor Control Competence Center in AP.

STMicroelectronics

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STMicroelectronics: three decades of SiC innovation leading to 200mm production and full vertical integration

Manuel Gaertner

Director Wide Band Gap & Electrification

STMicroelectronics

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MEMS leadership in turbulent times

Anton Hofmeister

Group Vice President – GM Central R&D

STMicroelectronics

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Enhancing human perception – sensors of the future as extensions of our five senses

Anton Hofmeister

Group Vice President – GM Central R&D

STMicroelectronics

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Modeling tools for optimization semiconductor manufacturing processes: from material to device

Andrey Smirnov

Director of Business Development

STR

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Tracking Startups Fundraise and The Challenges in the MEMS Market & ecosystem in a post-covid era

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Ahmed Ben Slimane

Managing Director

Strategic Semiconductors

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State-of-the art solutions for AI Chip manufacturing

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Robert Wanninger

Senior Vice President Business Unit Advanced Backend Solutions

SUSS

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3DIC W2W and D2W Hybrid Bonding

Thomas Schmidt photo

Thomas Schmidt

Product Manager, Bonder Division

SUSS

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Invest in Your Future – Invest in Suwon! The Powerhouse of Opportunity in the Suwon Free Economic Zone

Jean Lim

Deputy Director of Investment Promotion Team/Business Attraction Division

SUWON CITY

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Taiwan 2025_Post Show Report

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Sensing Hope at the Edge

Peter Hartwell, Ph.D.

VP, Engineering

TDK InvenSense

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TEL: Moving Into the MAGIC Era of Semiconductors

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Neil Armstrong

Director Sales Development

Tokyo Electron

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BioMEMS

Collin Twanow photo

Collin Twanow

Director, Technology

Teledyne MEMS

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From an Idea to a Sensor Product: Micro Needle Case Study

Jared Crawford

Senior Integration Engineer

Teledyne MEMS

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Optimizing Cost and Quality Through Test Mobility Across Insertions

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Rick Burns

President Semiconductor Test Division

Teradyne

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Test Challenges in the AI & Chiplet era

Srinivas Chinamilli photo

Srini Chinamilli

Co Founder & CEO

Tessolve

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Total Solution of Process Kits to Enabling an Efficient Supply Chain in FAB

Jimmy Tao photo

Jimmy Tao

Marketing Director

Tessvida

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Power & AI

Ahmad Bahai, Ph.D.

Senior Vice President and Chief Technology Officer

Texas Instruments

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Laser Beam Scanner Projection Displays For Consumer AR Glasses – Key MEMS Design Considerations.

Dr. Manuel Dorfmeister photo

Dr. Manuel Dorfmeister

Head of MEMS and e-Software department

TriLite

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Tailored Solutions for the Semiconductor Industry Powered by TRUMPF

Dariusz Czaja

Managing Director of TRUMPF Huettinger Asia

TRUMPF Huettinger

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Mastering Plasma Technology Application – focus on local support for the semiconductor industry 掌握等离子体技术应用 – 专注于半导体行业的本地支持

Pawel Ozimek, Ph.D EE

CTO, TRUMPF Huettinger and Managing Director, TRUMPF Huettinger Poland

TRUMPF Huettinger

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Department of Energy Activities & Perspectives on Powering the Transformation of Our Energy Future

Paul Syer

Technology Manager

U.S. Department of Energy Advanced Materials & Manufacturing Technologies Office

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Innovative Sputtering Technology for Piezo-MEMS and Other Advanced Functional Devices Manufacturing

Dr. Koukou Suu photo

Dr. Koukou Suu

Executive Officer and Senior Fellow of ULVAC, Inc / President and CEO of ULVAC Technologies, Inc

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Micro LED Technology and Platform Trend

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Sam Chen

Senior Director

Unikorn Semiconductor Corporation

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USA 2025_Post Show Report

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USA POWER 2024_Post Show Report

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USA POWER 2025_Post Show Report

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MEMS speakers – the ideal earphone tweeters

Jakob Spoetl

Head of Acoustics

Usound

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Advanced Power Packaging for AI Power solution: UTAC’s Thermally Enhanced QFN and 3D Module Solutions for Optimized Efficiency and Integration

Michael Choi

VP of Business Development

UTAC Group

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VC Shark Tank: MEMS and Sensors Startups _Alithia Power_MSWS_USA_2025

Cris Ugolini, Ph.D.

Founder & CEO

Alithia Power

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VC Shark Tank: MEMS and Sensors Startups _Cenfire_MSWS_USA_2025

No linked agenda item found.

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VC Shark Tank: MEMS and Sensors Startups _ChipHub_MSWS_USA_2025

Aftab Farooqi, Ph.D.

Founder & CEO

ChipHub

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VC Shark Tank: MEMS and Sensors Startups _sm24_MSWS_USA_2025

No linked agenda item found.

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VC Shark Tank: MEMS and Sensors Startups_Nitride Global_MSWS_USA_2025

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VC Shark Tank: MEMS and Sensors Startups_Numem_MSWS_USA_2025

Nilesh Gharia

Founder & CTO

Numem

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VC, Investor Network and Start Up Shark Tank Session_Amazing Cool Technology Corporation_USA_2025

Quick Tsai

Executive Director

Amazing Cool Technology Corporation

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VC, Investor Network and Start Up Shark Tank Session_ATLANT 3D_USA_2025

Bonnie Tsim, Ph.D.

Head of Strategic Initiatives and Growth

ATLANT 3D

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VC, Investor Network and Start Up Shark Tank Session_Kelvin Cooling_USA_2025

Catherine Liu

Co-Founder

Kelvin Cooling

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VC, Investor Network and Start Up Shark Tank Session_Practical OTP Encryption_USA_2025 

Hamid Sadjadpour Ph.D.

Founder

Practical OTP Encryption

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Enabling the AI Ecosystem with Power Semiconductors

Avinash Kashyap Ph.D.

SVP & Division Head

Vishay Intertechnology, Inc.

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GaN HEMT for Electric Car Inverter: Breakthroughs and Challenges

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Jim Jian

VP Sales APAC and NA

VisIC Technologies

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D3GaN as a solution for Electric Car Inverter

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Tamara Baksht, Ph.D.

CEO

VisIC Technologies

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Volkswagen Group – Power Electronics In-House Development

Alexander Krick

Executive Vice President

Volkswagen Group Technology

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SiC and GaN in future Volkswagen Group applications

Alexander Krick

Executive Vice President

Volkswagen Group Technology

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Opportunities in Commercial Vehicle Decarbonization 商用车辆的低碳机遇

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Vishnu Kumaresan​, Ph.D

Semiconductor Business Specialist & Segment Leader

Volvo Group

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High Voltage SiC MOSFET for renewable energy application with simpler design and higher power density 高电压SiC MOSFET用于可再生能源应用,具有更简单的设计和更高的功率密度。

Kevin Shen

Chief Strategy & Business Operation Officer

WeEn Semiconductors

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Western Digital’s Semiconductor Odyssey: Charting a Course for Innovation and Business Growth

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YT Chin

Senior Director, Flash Backend Engineering

Western Digital

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Alternative Career Paths Help the Semiconductor Industry Meet Workforce Needs

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Geoffrey Stoddart

Senior Vice President Global Business Development

WGNSTAR

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A foundry perspective on Wide Bandgap semiconductors

David Auffret

Automotive Marketing Manager

X-FAB

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Keynote: Powering the Age of AI – A Specialty Foundry’s Perspective on Artificial Intelligence

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Jörg Doblaski

CTO

X-FAB

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How foundry services can help to build customized solutions in an evolving SiC Market?

Rico Tillner

CEO, USA

X-FAB

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Micro Machines, Macro Impact: Powering Societal Change with European MEMS

Kees Wesdorp, Ph.D.

Chairman of the Board XIVER Group

XIVER Mems Foundry

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New Generation AI glasses and Micro Cooling Technology

Joseph Jiang

CEO & Co-Founder

xMEMS Labs

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Technological development and application, challenges and future trends of SiC power devices

Jun Shi, Ph.D.

Power Module Division Deputy General Manager

Yangzhou Yangjie Electronic Technology Co., Ltd

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