Select a 2025 summit below to view its ISES Docs

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

This Summit’s documents will be available shortly after the summit concludes.

Accelerating MEMS Product Validation and Commercialization with IME ScAlN MEMS Platform

Angeline Tee photo

Angeline Tee

Deputy Director Business Development

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Breaking Barriers with Glass: A New Era in Semiconductor Integration

Sung Jin Kim, Ph.D.

CTO

Absolics

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Hybrid Bonding: Innovation to Adoption

Abul Nuruzzaman photo

Abul Nuruzzaman

VP, Technology and IP Licensing

Adeia

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A 360 View of Semiconductor Test from AI and Security Perspective

Michael Chang photo

Michael Chang

VP & GM, Advantest Cloud Solutions

Advantest

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Considerations in Producing Reliable Known Good Die (KGD) from Wide-Bandgap Wafers

Vernon Rogers

EVP Sales & Marketing

Aehr Test Systems

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The Role of Extrinsic (Early Life) Failures and Stabilization Stress and Burn-In During the Production of Silicon Carbide and Gallium Nitride Power Semiconductors

Gayn Erickson photo

Gayn Erickson

President & CEO

Aehr Test Systems

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NPU as the core of AI application: Market & Trends

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Axel Bialke

SVP Asia

aiMotive

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Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics

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Aziza Dada

Sector VP

Airspace

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The necessity to have the right logistics partner in South East Asia to support the Global Supply Chain

Brandon Kennedy

Global Managing Director, High-Tech & Industrials

Airspace

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Bringing Semiconductor Value Chain to the Kingdom of Saudi Arabia – Now and Future 将半导体价值链引入沙特阿拉伯王国——现在与未来

Sunil Banwari

CEO Semiconductor

Ajlan & Bros Megaprojects

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Disruption of the semiconductor industry

Markus Bolte, Ph.D.

Partner

AlixPartners

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Disruptions in Semiconductor Supply Chain

Michael Mo photo

Michael Mo

Partner and Managing Director

AlixPartners

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Global Automotive Outlook 全球汽车发展展望

Janet Tang

Partner & Managing Director

AlixPartners

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Disruption in Semiconductor Industry

Janet Tang

Partner & Managing Director

AlixPartners

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SiC Power Devices: The Core Technology Solution Reshaping the New Energy Landscape

Heming Li

Product Marketing VP

Alpha Power Solutions (Shanghai) Ltd.

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From Prototyping to Advanced Manufacturing of Sensors and Optical Components for Automotive Applications. 从原型设计到汽车应用中传感器和光学元件的高级制造。

Maksym Plakhotnyuk, Ph.D.

CEO & Founder

ATLANT 3D

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Enabling AI revolution through innovations in Advanced Packaging and Chiplet Technology

Deepak Kulkarni

Senior Fellow Advanced Packaging

AMD

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HPC, AI, Chiplets, heterogeneous integration

Mark Fuselier photo

Mark Fuselier

SVP Technology & Product Engineering

AMD

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Generative AI Driven Advanced Packaging and Materials Innovation

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Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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Advanced Packaging: Enabling Moore’s Law’s Next Frontier

Raja Swaminathan, Ph.D.

CVP, Advanced Packaging

AMD

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Innovation to Enable More Compute From Each Transistor

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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Designing for Tomorrow : Evolving Challenges in Semiconductor Design

J-Wing Teh

Director of Silicon & Systems Design Engineering

AMD

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Future of AI Hardware Enabled by Advanced Packaging

Raja Swaminathan, Ph.D.

CVP, Advanced Packaging

AMD

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Future of AI Hardware Enabled by Advanced Packaging

Raja Swaminathan, Ph.D.

CVP, Advanced Packaging

AMD

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AMEC Company Update and Offshore Manufacturing Plan

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Pat Walsh

Managing Director NA/EU

AMEC

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New Challenges for MEMS and Sensor Packaging

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Adrian Arcedera

SVP Memory, MEMS and Sensor Business Unit

Amkor Technology, Inc.

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Chiplets and System Integration – Key Concepts and Implementation

Jianmin Li photo

Jianmin Li

Packaging R&D Director, Amkor Technology China, Inc.

Amkor Technology, Inc.

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System-level Packaging: Challenges and Solutions

Dr. JinYoung Khim photo

Dr. JinYoung Khim

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Semiconductor Packaging for the AI Era

Roger St. Amand

CVP, Chiplets/FCBGA/fcCSP BU

Amkor Technology, Inc.

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An OSAT Perspective of the Power Semiconductor Market

Michael Johnson

Sr Director, Power Discrete & Modules

Amkor Technology, Inc.

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An OSAT Perspective of the Power Semiconductor Market

Katsumi Furuse photo

Katsumi Furuse

Sr. Manager Wirebond/Power BU Power

Amkor Technology, Inc.

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Advance Packaging for Automotive MEMS and Sensors

Stefan Martens

Sr Director, MEMS and Sensor BU

Amkor Technology, Inc.

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An OSAT Perspective of the Power Semiconductor Market OSAT对电力半导体市场的视角

Troy Lin

Director, Product Marketing

Amkor Technology, Inc.

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Innovative Packages, Big Power: The Rise of Advanced Power Packaging

David Clark

VP Product Marketing

Amkor Technology, Inc.

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Do AI Factories Dream of MEMS Sheep?

Nick Renaud-Bezot

Senior Manager, MEMS and Sensor BU

Amkor Technology, Inc.

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Semiconductor Packaging Technologies in the AI Era

Dr. JinYoung Khim photo

Dr. JinYoung Khim

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Illuminating and complementing: Light-Based Sensing

Dr. Roland Helm

Senior Vice President, Head of Integrated Optical Sensing

ams OSRAM

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RISC-V Accelerating ML Innovation and Beyond

Samuel Chiang photo

Samuel Chiang

Deputy Technical Director

Andes Technology

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Opening Gas Sensing Possibilities with Silicon Photonics-Based Sensors

Dr. Tristan Rousselle

Founder & CEO

Aryballe

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Enabling the AI Era

Choon Khoon Lim

SVP and CEO, Business Group Advanced Packaging

ASMPT Semiconductor Solutions

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Co-Packaged Optics and Solutions for High Volume manufacturing

Dr. Johann Weinhändler photo

Dr. Johann Weinhändler

Managing Director

ASMPT Semiconductor Solutions

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Valuation of Artificial Intelligence for Semiconductor Equipment

Jon Hander photo

Jon Hander

AVP Panel Products

ASMPT Semiconductor Solutions

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How Laser is Enabling The Power Semiconductor Roadmap

Jeroen van Borkulo photo

Jeroen van Borkulo

Head of Business & Marketing

ASMPT Semiconductor Solutions

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AP 2.5D & 3D FLI with True Residue-Free Fluxless TCB

Greg Clemons

Sr. Manager Business Development, USA

ASMPT Semiconductor Solutions

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SiC wafer dicing with multi-beam laser: optimal process quality and minimized cost

Kees-Jan Leliveld photo

Kees-Jan Leliveld

Managing Director of ASMPT ALSI and Vice President ASMPT Semiconductor Solutions

ASMPT Semiconductor Solutions

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REALITY Twin vs. Digital Twin: Revolutionizing Industrial Remote Management

CJ Hsieh photo

CJ Hsieh

COO

ASPEED

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The LIVE 3D Digital Twin for the GCC

CJ Hsieh photo

CJ Hsieh

COO

ASPEED

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Turning Metaverse to Photorealistic Digital Twins for Driving Smart Factory Innovations

CJ Hsieh photo

CJ Hsieh

COO

ASPEED

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Piezoelectric MEMS Platform for Sensing and RF Applications

Dr. Yul Koh photo

Dr. Yul Koh

Senior Scientist

IME A*Star

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Tackling the Power Wall-Next Level of Integration Technologies in PCB and Substrates

Hong (Rainbow) Yuan

VP of Technology

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

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Transforming Industries at the Atomic Scale: The Power of Atomic Scale Advanced Manufacturing and the Advanced Innovation Ecosystems

Maksym Plakhotnyuk, Ph.D.

CEO & Founder

ATLANT 3D

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Atomic-Layer Advanced Manufacturing

Maksym Plakhotnyuk, Ph.D.

CEO & Founder

ATLANT 3D

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Atomic-Scale Manufacturing for Next-Gen Advanced Packaging

Maksym Plakhotnyuk, Ph.D.

CEO & Founder

ATLANT 3D

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The Future of Atomic Layer Advanced Manufacturing

Bonnie Tsim, Ph.D.

Head of Strategic Initiatives and Growth

ATLANT 3D

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The Development of Silicon Photonics in Optical Communications, and its Challenges

David Chang, Ph.D.

CTO

AuthenX. Inc

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Future Packaging/System Challenges for AI Data Centers

Babak Sabi, Ph.D.

VP of Technology

AWS Annapurna Labs

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Future Packaging/System Challenges for AI Data Centers

Babak Sabi, Ph.D.

VP of Technology

AWS Annapurna Labs

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Orbital Foundries for Next-Generation Semiconductors

Divya Panchanathan, P.h.D.

Global Lead for In-Space Semiconductors Commercialization

Axiom Space

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Optical I/O Technology for the Future of AI

Mark Wade, Ph.D.

CEO

Ayar Labs

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Next Generation Semiconductor Management

Dr. Karl Breidenbach photo

Dr. Karl Breidenbach

Associate Director, Global Lead Semiconductor Procurement

Boston Consulting Group

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BelGaN – Moving to The Next Chapter

Marnix Tack, Ph.D.

CTO & VP Business Development

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Assembly Technologies for the Front End

Chris Scanlan photo

Chris Scanlan

SVP Technology

Besi

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Crossbreeding of MEMS, CMOS, CSOI, Optics and Assembly

Dr. Stefan Majoni photo

Dr. Stefan Majoni

Director Foundry MEMS

Bosch

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Raw material impact on the transition to 200mm SiC device production

Dr. Sigmar Schoser photo

Dr. Siegmar Schoser

Project Director Cooperation and external Sourcing

Bosch

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Advances in MEMS Sensors & Technologies

Dr. Ando Feyh photo

Dr. Ando Feyh

MEMS Strategy Management, New Business and M&A

Bosch

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SiC – A Yin and Yang Perspective

Ralf Bornefeld

SVP Business Unit Power Semiconductors & Modules

Bosch

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Clear Sound, Clean Air: How disruptions in MEMS speakers and particulate matter sensors make our lives more comfortable and healthier.

Stefan Kimmerle, Ph.D.

VP Engineering

Bosch Sensortec

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Bosch advanced SiC chips and modules – Green engine to boost China EV development

Bruno Schuster

Director Power Semiconductors – Regional business development Asia Pacific

Bosch

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AI in MEMS Manufacturing – A collaborational challenge for the entire value chain

Dr. Florian Schuster

Director of Product Management

Bosch

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Driving Innovation, Ensuring Domestic Competitiveness, Increasing Supply Chain Resilience

Thorsten Scheer, Ph.D.

Regional President of the Bosch Automotive Electronics Division, North America

Bosch

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Silicon Photonics and its Challenges

Arjun Kumar Kantimahanti photo

Arjun Kumar Kantimahanti

R&D Engineer

Broadcom

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Optical I/O at Copper Scale and Cost

Near Margalit, Ph.D.

VP & GM

Broadcom

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ICeGaN: the Call of the GaN Revolution

Giorgia Longobardi, Ph.D.

Founder and CEO

Cambridge GaN Devices

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Driving the Future with GaN: From Myth to Reality

Henryk Dabrowski

SVP of Global Sales

Cambridge GaN Devices

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Photonic Fabric ™ : Designing silicon photonics for reliability, scale and deployment

Ankur Aggarwal, Ph.D.

VP of Advanced Packaging & Supply Chain

Celestial AI

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CHINA 2024_Post Show Report

No linked agenda item found.

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CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Update

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Dan Berger

Associate Director

CHIPS for America R&D Office

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WBG Pilot Line

Francesco La Via

Research Director

CNR-IMM

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The future of Advanced Packaging Inspection is X-ray

Enrico Härtel photo

Enrico Härtel

Director Global Key Account Management

Comet

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Static Control for Better Yield for AI & HPC Devices in Manufacturing

Joshua Yoo

President

Core Insight, Inc.

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Glass Substrates for Advanced Packaging

Dr. Xavier Lafosse photo

Dr. Xavier Lafosse

Commercial Technology Director, Advanced Optics

Corning Incorporated

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The Emergence of 5PL: Enabling Revenue Growth & Structural Affordability via High Velocity Supply Chain Adaptability

Stuart Love

Director, Global Supply Chain

DSV Inventory Management Solutions

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The EDA breakthrough solution for SiC and GaN Front-End and Back-End

Luca Lillacci photo

Luca Lillacci

General Manager

EDA Industries S.p.a

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EV Charging Infrastructure Challenges

Nuno Delgado

Electric Mobility Director

Efacec

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A IoT Based Solution for Gas Leak Map

Pierre Jallon photo

Pierre Jallon

CTO

eLichens

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Mix and Matching Chiplets with the Economics of PCB Design

Ramin Farjadrad photo

Ramin Farjadrad

Co-Founder & CEO

Eliyan

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Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging

Laurent Giai-Miniet photo

Laurent Giai-Miniet

CEO

ERS electronic GmbH

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Unleashing the Power of AI: Opportunities and Challenges Ahead

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Dr. Justin Chueh

Director Monolithic and Heterogeneous Integration Department

Etron Technology Inc.

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Enhancing Europe’s Leadership in MEMS & Sensors: Seizing Opportunities with the EU Chips Act

Pierre Chastanet

Head of Unit of “Microelectronics and Photonics Industry” Unit, DG CNECT

EU Commission

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Opening Address

Lucilla Sioli photo

Lucilla Sioli

Director Artificial Intelligence and Digital Industry

EU Commission

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Navigating Public Funding Opportunities for Europe’s Semiconductor Industry

Marc Isabelle, Ph.D.

Founder & CEO

european economics

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EVATEC – Mastering Deposition Technologies from Core to Package

Maurus Tschirky

Senior Strategic Marketing Manager

Evatec

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Thinfilm Technology for Heat Dissipation Layers in HPC Applications

Ralph Zoberbier

CMO

Evatec

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Thin Film Solutions for Wide Bang Gap (WBG) Power Devices

Dr. Vinoth Sundaramoorthy photo

Dr. Vinoth Sundaramoorthy

Product Marketing Manager

Evatec

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Wall Street Perspectives on the Semiconductor Market

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Tom Stokes

Senior Managing Director

Evercore

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eVTOL marketing trend 低空飞行器未来市场趋势

KeDa Xu

Founder & CEO

Falcon Sichuan Aviation Technology Co. Ltd

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Dry Laser Cleaning Solution

Simon Duval, Ph.D.

CTO & Co-Founder

Femtum

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Si Schottky Photodiodes: New Horizons for Short Wavelength Infrared (SWIR) Sensing

Dr. Sandro Koch photo

Dr. Sandro Koch

Business Unit Manager Acoustic Sensors and Systems

Fraunhofer Institute for Photonic Microsystems

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European Chips Act (EUCA) and the FMD Pilot line “Advanced Heterogenous Systems Integrations (AHSI)”

Dr. Michael Eritt

Head of Department Engineering

Fraunhofer Institute for Photonic Microsystems

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APECS Research Pilot Line for advanced heterointegration innovations in the MEMS Industry

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Jörg Amelung

Deputy Institute Director Division, Director Engineering, Manufacturing & Test

Fraunhofer Institute for Photonic Microsystems

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