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Accelerating MEMS Product Validation and Commercialization with IME ScAlN MEMS Platform
Angeline Tee
Deputy Director Business Development
Breaking Barriers with Glass: A New Era in Semiconductor Integration
Sung Jin Kim, Ph.D.
CTO
Absolics
Hybrid Bonding: Innovation to Adoption
Abul Nuruzzaman
VP, Technology and IP Licensing
Adeia
A 360 View of Semiconductor Test from AI and Security Perspective
Michael Chang
VP & GM, Advantest Cloud Solutions
Advantest
Considerations in Producing Reliable Known Good Die (KGD) from Wide-Bandgap Wafers
Vernon Rogers
EVP Sales & Marketing
Aehr Test Systems
Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics
Aziza Dada
Sector VP
Airspace
The necessity to have the right logistics partner in South East Asia to support the Global Supply Chain
Brandon Kennedy
Global Managing Director, High-Tech & Industrials
Airspace
Bringing Semiconductor Value Chain to the Kingdom of Saudi Arabia – Now and Future 将半导体价值链引入沙特阿拉伯王国——现在与未来
Sunil Banwari
CEO Semiconductor
Ajlan & Bros Megaprojects
Disruptions in Semiconductor Supply Chain
Michael Mo
Partner and Managing Director
AlixPartners
Global Automotive Outlook 全球汽车发展展望
Janet Tang
Partner & Managing Director
AlixPartners
Disruption in Semiconductor Industry
Janet Tang
Partner & Managing Director
AlixPartners
SiC Power Devices: The Core Technology Solution Reshaping the New Energy Landscape
Heming Li
Product Marketing VP
Alpha Power Solutions (Shanghai) Ltd.
From Prototyping to Advanced Manufacturing of Sensors and Optical Components for Automotive Applications. 从原型设计到汽车应用中传感器和光学元件的高级制造。
Maksym Plakhotnyuk, Ph.D.
CEO & Founder
ATLANT 3D
HPC, AI, Chiplets, heterogeneous integration
Mark Fuselier
SVP Technology & Product Engineering
AMD
Generative AI Driven Advanced Packaging and Materials Innovation
Dr. Bill En
CVP, Foundry Technology and Operations
AMD
Enabling AI revolution through innovations in Advanced Packaging and Chiplet Technology
Deepak Kulkarni, Ph.D.
Senior Fellow Advanced Packaging
AMD
Advanced Packaging: Enabling Moore’s Law’s Next Frontier
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD
Innovation to Enable More Compute From Each Transistor
Dr. Bill En
CVP, Foundry Technology and Operations
AMD
Designing for Tomorrow : Evolving Challenges in Semiconductor Design
J-Wing Teh
Director of Silicon & Systems Design Engineering
AMD
Future of AI Hardware Enabled by Advanced Packaging
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD
Future of AI Hardware Enabled by Advanced Packaging
Raja Swaminathan, Ph.D.
CVP, Advanced Packaging
AMD
AMEC Company Update and Offshore Manufacturing Plan
Pat Walsh
Managing Director NA/EU
AMEC
New Challenges for MEMS and Sensor Packaging
Adrian Arcedera
SVP Memory, MEMS and Sensor Business Unit
Amkor Technology, Inc.
Chiplets and System Integration – Key Concepts and Implementation
Jianmin Li
Packaging R&D Director, Amkor Technology China, Inc.
Amkor Technology, Inc.
Semiconductor Packaging for the AI Era
Roger St. Amand
CVP, Chiplets/FCBGA/fcCSP BU
Amkor Technology, Inc.
An OSAT Perspective of the Power Semiconductor Market
Michael Johnson
Sr Director, Power Discrete & Modules
Amkor Technology, Inc.
Advance Packaging for Automotive MEMS and Sensors
Stefan Martens
Sr Director, MEMS and Sensor BU
Amkor Technology, Inc.
An OSAT Perspective of the Power Semiconductor Market
Katsumi Furuse
Sr. Manager Wirebond/Power BU Power
Amkor Technology, Inc.
An OSAT Perspective of the Power Semiconductor Market OSAT对电力半导体市场的视角
Troy Lin
Director, Product Marketing
Amkor Technology, Inc.
Innovative Packages, Big Power: The Rise of Advanced Power Packaging
David Clark
VP Product Marketing
Amkor Technology, Inc.
Do AI Factories Dream of MEMS Sheep?
Nick Renaud-Bezot
Senior Manager, MEMS and Sensor BU
Amkor Technology, Inc.
Illuminating and complementing: Light-Based Sensing
Dr. Roland Helm
Senior Vice President, Head of Integrated Optical Sensing
ams OSRAM
RISC-V Accelerating ML Innovation and Beyond
Samuel Chiang
Deputy Technical Director
Andes Technology
Opening Gas Sensing Possibilities with Silicon Photonics-Based Sensors
Dr. Tristan Rousselle
Founder & CEO
Aryballe
How Laser is Enabling The Power Semiconductor Roadmap
Jeroen van Borkulo
Head of Business & Marketing
ASMPT Semiconductor Solutions
Co-Packaged Optics and Solutions for High Volume manufacturing
Dr. Johann Weinhändler
Managing Director
ASMPT Semiconductor Solutions
Enabling the AI Era
Choon Khoon Lim
SVP and CEO, Business Group Advanced Packaging
ASMPT Semiconductor Solutions
Valuation of Artificial Intelligence for Semiconductor Equipment
Jon Hander
AVP Panel Products
ASMPT Semiconductor Solutions
AP 2.5D & 3D FLI with True Residue-Free Fluxless TCB
Greg Clemons
Sr. Manager Business Development, USA
ASMPT Semiconductor Solutions
SiC wafer dicing with multi-beam laser: optimal process quality and minimized cost
Kees-Jan Leliveld
Managing Director of ASMPT ALSI and Vice President ASMPT Semiconductor Solutions
ASMPT Semiconductor Solutions
Piezoelectric MEMS Platform for Sensing and RF Applications
Dr. Yul Koh
Senior Scientist
IME A*Star
Tackling the Power Wall-Next Level of Integration Technologies in PCB and Substrates
Hong (Rainbow) Yuan
VP of Technology
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Transforming Industries at the Atomic Scale: The Power of Atomic Scale Advanced Manufacturing and the Advanced Innovation Ecosystems
Maksym Plakhotnyuk, Ph.D.
CEO & Founder
ATLANT 3D
Atomic-Layer Advanced Manufacturing
Maksym Plakhotnyuk, Ph.D.
CEO & Founder
ATLANT 3D
Atomic-Scale Manufacturing for Next-Gen Advanced Packaging
Maksym Plakhotnyuk, Ph.D.
CEO & Founder
ATLANT 3D
The Future of Atomic Layer Advanced Manufacturing
Bonnie Tsim, Ph.D.
Head of Strategic Initiatives and Growth
ATLANT 3D
The Development of Silicon Photonics in Optical Communications, and its Challenges
David Chang, Ph.D.
CTO
AuthenX. Inc
Future Packaging/System Challenges for AI Data Centers
Babak Sabi, Ph.D.
VP of Technology
AWS Annapurna Labs
Future Packaging/System Challenges for AI Data Centers
Babak Sabi, Ph.D.
VP of Technology
AWS Annapurna Labs
Orbital Foundries for Next-Generation Semiconductors
Divya Panchanathan, P.h.D.
Global Lead for In-Space Semiconductors Commercialization
Axiom Space
Next Generation Semiconductor Management
Dr. Karl Breidenbach
Associate Director, Global Lead Semiconductor Procurement
Boston Consulting Group
BelGaN – Moving to The Next Chapter
Marnix Tack, Ph.D.
CTO & VP Business Development
Raw material impact on the transition to 200mm SiC device production
Dr. Siegmar Schoser
Project Director Cooperation and external Sourcing
Bosch
Crossbreeding of MEMS, CMOS, CSOI, Optics and Assembly
Dr. Stefan Majoni
Director Foundry MEMS
Bosch
Advances in MEMS Sensors & Technologies
Dr. Ando Feyh
MEMS Strategy Management, New Business and M&A
Bosch
SiC – A Yin and Yang Perspective
Ralf Bornefeld
SVP Business Unit Power Semiconductors & Modules
Bosch
Clear Sound, Clean Air: How disruptions in MEMS speakers and particulate matter sensors make our lives more comfortable and healthier.
Stefan Kimmerle, Ph.D.
VP Engineering
Bosch Sensortec
Bosch advanced SiC chips and modules – Green engine to boost China EV development
Bruno Schuster
Director Power Semiconductors – Regional business development Asia Pacific
Bosch
AI in MEMS Manufacturing – A collaborational challenge for the entire value chain
Dr. Florian Schuster
Director of Product Management
Bosch
Driving Innovation, Ensuring Domestic Competitiveness, Increasing Supply Chain Resilience
Thorsten Scheer, Ph.D.
Regional President of the Bosch Automotive Electronics Division, North America
Bosch
Silicon Photonics and its Challenges
Arjun Kumar Kantimahanti
R&D Engineer
Broadcom
ICeGaN: the Call of the GaN Revolution
Giorgia Longobardi, Ph.D.
Founder and CEO
Cambridge GaN Devices
Driving the Future with GaN: From Myth to Reality
Henryk Dabrowski
SVP of Global Sales
Cambridge GaN Devices
Photonic Fabric ™ : Designing silicon photonics for reliability, scale and deployment
Ankur Aggarwal, Ph.D.
VP of Advanced Packaging & Supply Chain
Celestial AI
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Update
Dan Berger
Associate Director
CHIPS for America R&D Office
The future of Advanced Packaging Inspection is X-ray
Enrico Härtel
Director Global Key Account Management
Comet
Static Control for Better Yield for AI & HPC Devices in Manufacturing
Joshua Yoo
President
Core Insight, Inc.
Glass Substrates for Advanced Packaging
Dr. Xavier Lafosse
Commercial Technology Director, Advanced Optics
Corning Incorporated
The Emergence of 5PL: Enabling Revenue Growth & Structural Affordability via High Velocity Supply Chain Adaptability
Stuart Love
Director, Global Supply Chain
DSV Inventory Management Solutions
The EDA breakthrough solution for SiC and GaN Front-End and Back-End
Luca Lillacci
General Manager
EDA Industries S.p.a
EV Charging Infrastructure Challenges
Nuno Delgado
Electric Mobility Director
Efacec
Mix and Matching Chiplets with the Economics of PCB Design
Ramin Farjadrad
Co-Founder & CEO
Eliyan
Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging
Laurent Giai-Miniet
CEO
ERS electronic GmbH
Unleashing the Power of AI: Opportunities and Challenges Ahead
Dr. Justin Chueh
Director Monolithic and Heterogeneous Integration Department
Etron Technology Inc.
Opening Address
Lucilla Sioli
Director Artificial Intelligence and Digital Industry
EU Commission
Enhancing Europe’s Leadership in MEMS & Sensors: Seizing Opportunities with the EU Chips Act
Pierre Chastanet
Head of Unit of “Microelectronics and Photonics Industry” Unit, DG CNECT
EU Commission
Navigating Public Funding Opportunities for Europe’s Semiconductor Industry
Marc Isabelle, Ph.D.
Founder & CEO
european economics
EVATEC – Mastering Deposition Technologies from Core to Package
Maurus Tschirky
Senior Strategic Marketing Manager
Evatec
Thin Film Solutions for Wide Bang Gap (WBG) Power Devices
Dr. Vinoth Sundaramoorthy
Product Marketing Manager
Evatec
Thinfilm Technology for Heat Dissipation Layers in HPC Applications
Ralph Zoberbier
CMO
Evatec
Wall Street Perspectives on the Semiconductor Market
Tom Stokes
Senior Managing Director
Evercore
eVTOL marketing trend 低空飞行器未来市场趋势
KeDa Xu
Founder & CEO
Falcon Sichuan Aviation Technology Co. Ltd
Si Schottky Photodiodes: New Horizons for Short Wavelength Infrared (SWIR) Sensing
Dr. Sandro Koch
Business Unit Manager Acoustic Sensors and Systems
Fraunhofer Institute for Photonic Microsystems
European Chips Act (EUCA) and the FMD Pilot line “Advanced Heterogenous Systems Integrations (AHSI)”
Dr. Michael Eritt
Head of Department Engineering
Fraunhofer Institute for Photonic Microsystems
APECS Research Pilot Line for advanced heterointegration innovations in the MEMS Industry
Jörg Amelung
Deputy Institute Director Division, Director Engineering, Manufacturing & Test
Fraunhofer Institute for Photonic Microsystems
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